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1. 发明申请

WO2012068559A2 FACTORY LEVEL PROCESS AND FINAL PRODUCT PERFORMANCE CONTROL SYSTEM 审中-公开
标题翻译：工厂级工艺和最终产品性能控制系统
公开(公告)号：WO2012068559A2
公开(公告)日：2012-05-24
申请号：PCT/US2011/061549
申请日：2011-11-18
申请人： APPLIED MATERIALS, INC. , PARIKH, Suketu, Arun , SCHWARM, Alexander, T. , MITTAL, Sanjiv , GAY, Charles
发明人： PARIKH, Suketu, Arun , SCHWARM, Alexander, T. , MITTAL, Sanjiv , GAY, Charles
IPC分类号： G05B19/418
CPC分类号： G05B19/41875 , G05B2219/32182 , Y02P90/12 , Y02P90/18 , Y02P90/22
摘要： A factory control server stores module configuration data for a plurality of modules. The plurality of modules comprises processes for producing a final product and has corresponding module requirements. The factory control server analyzes in real-time actual product output data that is generated by a final product tester after a factory produces at least one final product to determine whether the actual product output data meets an expected product output. The factory control server analyzes actual module data in real-time to determine a new module requirement to cause new actual product output data for a subsequent final product to meet the expected product output in response to a determination that the actual product output data does not meet the expected product output. The factory control server notifies a module controller in real-time of the new module requirement, wherein the module controller changes parameters in real-time to manufacture the subsequent final product using the new module requirement.
摘要翻译：工厂控制服务器存储多个模块的模块配置数据。多个模块包括用于生产最终产品的过程并且具有相应的模块要求。工厂控制服务器在工厂生产至少一个最终产品之后分析由最终产品测试者生成的实时实际产品输出数据，以确定实际产品输出数据是否满足预期的产品输出。工厂控制服务器实时分析实际的模块数据，以确定新的模块要求，以便随后的最终产品产生新的实际产品输出数据以满足预期的产品输出以响应确定实际的产品输出数据不符合预期产品产量。工厂控制服务器实时通知模块控制器新模块要求，其中模块控制器实时更改参数，以使用新的模块要求制造后续最终产品。

2. 发明申请

WO2007130692A2 ADAPTIVE MULTIVARIATE FAULT DETECTION 审中-公开
标题翻译：自适应多重故障检测
公开(公告)号：WO2007130692A2
公开(公告)日：2007-11-15
申请号：PCT/US2007/011142
申请日：2007-05-07
申请人： APPLIED MATERIALS, INC. , HARVEY, Jerry, Lynn, Jr. , SCHWARM, Alexander, T.
发明人： HARVEY, Jerry, Lynn, Jr. , SCHWARM, Alexander, T.
IPC分类号： G06F11/30
CPC分类号： G05B19/41875 , G05B23/024 , G05B23/0297 , G05B2219/32201 , Y02P90/22 , Y02P90/86
摘要： A method and apparatus for detecting faults. A set of data samples is received, the set of data samples including multiple process variables. One or more multivariate statistical models are adapted, wherein adapting includes applying a change to at least one univariate statistic of the one or more multivariate statistical models if the change is greater than a threshold value. The one or more multivariate statistical models are used to analyze subsequent process data to detect faults.
摘要翻译：一种检测故障的方法和装置。接收一组数据样本，该组数据样本包括多个过程变量。调整一个或多个多变量统计模型，其中适应包括如果所述变化大于阈值，则将改变应用于所述一个或多个多变量统计模型的至少一个单变量统计量。一个或多个多变量统计模型用于分析后续过程数据以检测故障。

3. 发明申请

WO2008137062A1 METRICS INDEPENDENT AND RECIPE INDEPENDENT FAULT CLASSES 审中-公开
标题翻译：独立和独立的度量独立故障类
公开(公告)号：WO2008137062A1
公开(公告)日：2008-11-13
申请号：PCT/US2008/005667
申请日：2008-05-01
申请人： APPLIED MATERIALS, INC. , LIN, Y., Sean , CLEMENTS, William, R., III , SCHWARM, Alexander, T.
发明人： LIN, Y., Sean , CLEMENTS, William, R., III , SCHWARM, Alexander, T.
IPC分类号： G06F11/30
CPC分类号： G05B19/0428 , G05B2219/37519
摘要： A method and apparatus for diagnosing faults. Process data is analyzed using a first metric to identify a fault. The process data was obtained from a manufacturing machine running a first recipe. A fault signature that matches the fault is identified. The identified fault signature was generated using a second metric and/or a second recipe. At least one fault class that is associated with the fault signature is identified.
摘要翻译：一种用于诊断故障的方法和装置。使用第一个度量来分析过程数据以识别故障。过程数据是从运行第一配方的制造机器获得的。识别与故障匹配的故障签名。使用第二度量和/或第二配方生成所识别的故障签名。识别与故障签名相关联的至少一个故障类。

4. 发明申请

WO2007133543A2 RANGED FAULT SIGNATURES FOR FAULT DIAGNOSIS 审中-公开
标题翻译：用于故障诊断的范围故障信号
公开(公告)号：WO2007133543A2
公开(公告)日：2007-11-22
申请号：PCT/US2007/011106
申请日：2007-05-07
申请人： APPLIED MATERIALS, INC. , HARVEY, Jr., Lynn, Jerry , SCHWARM, Alexander, T.
发明人： HARVEY, Jr., Lynn, Jerry , SCHWARM, Alexander, T.
IPC分类号： F16H48/06
CPC分类号： G05B23/0251 , G05B23/0281
摘要： A method and apparatus for diagnosing faults. A fault is detected. One or more process variables that contributed to the fault are determined. A relative contribution of each of the one or more process variables is determined. A determination is made as to which fault signatures match the fault, a match occurring when the relative contributions of the one or more process variables are within relative contribution ranges of the matching fault signature. Each fault signature is associated with at least one fault class.
摘要翻译：一种用于诊断故障的方法和装置。检测到故障。确定导致故障的一个或多个过程变量。确定一个或多个过程变量中的每一个的相对贡献。确定哪个故障签名与故障匹配，当一个或多个过程变量的相对贡献在匹配故障签名的相关贡献范围内时发生匹配。每个故障签名与至少一个故障类别相关联。

5. 发明申请

WO2004046835A3 METHOD, SYSTEM AND MEDIUM FOR CONTROLLING MANUFACTURE PROCESS HAVING MULTIVARIATE INPUT PARAMETERS 审中-公开
公开(公告)号：WO2004046835A3
公开(公告)日：2004-06-03
申请号：PCT/US2003/036501
申请日：2003-11-14
申请人： APPLIED MATERIALS, INC. , KOKOTOV, Yuri , ENTIN, Efim , SEROR, Jacques , FISHER, Yossi , SAREL, Shalomo , SHAMUGASUNDRAM, Arulkumar, P. , SCHWARM, Alexander, T. , PAIK, Young, Jeen
发明人： KOKOTOV, Yuri , ENTIN, Efim , SEROR, Jacques , FISHER, Yossi , SAREL, Shalomo , SHAMUGASUNDRAM, Arulkumar, P. , SCHWARM, Alexander, T. , PAIK, Young, Jeen
IPC分类号： G05B23/02
摘要： A method, system, and medium of modeling and/or for controlling a manufacturing process is disclosed. In particular, a method according to embodiments of the present invention includes the step of identifying one or more input parameters. Each input parameter causes a change in at least two outputs. The method also includes the step of storing values of the identified inputs and corresponding empirical output values along with predicted output values. The predicted output values are calculated based on, in part, the values of the identified inputs. The method also includes the step of calculating a set of transform coefficients by minimizing a score equation that is a function of differences between one or more of the empirical output values and their corresponding predicted output values. The method further includes the steps of receiving a new set of values for the identified inputs, transforming the new set of values for the identified input using the set of coefficients, and calculating a set of predicted output values using the transformed input values.

6. 发明申请

WO2004013715A1 METHOD, SYSTEM, AND MEDIUM FOR HANDLING MISREPRESENTATIVE METROLOGY DATA WITHIN AN ADVANCED PROCESS CONTROL SYSTEM 审中-公开
标题翻译：用于处理先进过程控制系统中的误差计量数据的方法，系统和介质
公开(公告)号：WO2004013715A1
公开(公告)日：2004-02-12
申请号：PCT/US2003/023964
申请日：2003-08-01
申请人： APPLIED MATERIALS, INC.
发明人： SCHWARM, Alexander, T. , SHANMUGASUNDRAM, Arulkumar, P. , SEROR, Jacques , KOKOTOV, Yuri , ENTIN, Efim
IPC分类号： G05B23/02
CPC分类号： G05B23/0221 , G05B15/02
摘要： A system, method and medium of controlling a semiconductor manufacturing tool using a feedback control mechanism. The feedback control mechanism includes features for receiving data points relating to an output of the tool. The data points include a current data point and at least one previous data point. The feedback control mechanism also includes features for determining whether the current data point is an erroneous outlier by comparing the current data point to a statistical representation of the at least one previous data point, and based on whether the at least one previous data point is an outlier. The feedback control mechanism further includes features for disregarding the current data point in calculating a feedback value of the feedback control mechanism if the current data point is determined as an erroneous outlier.
摘要翻译：使用反馈控制机构控制半导体制造工具的系统，方法和介质。反馈控制机构包括用于接收与工具的输出有关的数据点的特征。数据点包括当前数据点和至少一个先前的数据点。反馈控制机构还包括用于通过将当前数据点与至少一个先前数据点的统计表示进行比较来确定当前数据点是否是错误异常值的特征，并且基于该至少一个先前数据点是否为离群。反馈控制机构还包括如果当前数据点被确定为错误异常值，则在计算反馈控制机构的反馈值时忽略当前数据点的特征。

7. 发明申请

WO2002103779A1 IN SITU SENSOR BASED CONTROL OF SEMICONDUCTOR PROCESSING PROCEDURE 审中-公开
标题翻译：基于传感器的半导体处理程序控制
公开(公告)号：WO2002103779A1
公开(公告)日：2002-12-27
申请号：PCT/US2002/019117
申请日：2002-06-17
申请人： APPLIED MATERIALS, INC.
发明人： SHANMUGASUNDRAM, Arulkumar, P. , SCHWARM, Alexander, T.
IPC分类号： H01L21/66
CPC分类号： B24B37/013 , B24B37/042 , B24B49/03 , B24B49/18 , G05B19/00 , G05B19/19 , G05B19/41865 , G05B2219/32053 , G05B2219/32065 , G05B2219/45031 , H01L21/31053 , H01L21/67253 , H01L21/67276 , H01L22/20 , H01L2924/0002 , Y02P90/20 , H01L2924/00
摘要： A wafer property is controlled by a semiconductor processing tool using data collected from an in situ sensor. Initially, data relating to the wafer property is collected by the in situ sensor during a process executed according to a wafer recipe parameters. Subsequently, the process may be adjusted by modifying the recipe parameters according to comparisons between the data collected by the in situ sensor relating to the wafer property and the results predicted by a process model used to predict wafer outputs. A subsequent process utilizing the data collected by the in situ sensor is then executed. In at least some embodiments of the present invention the data may be used for run-to-run control on subsequent wafers processed by the tool.
摘要翻译：晶片特性由使用从原位传感器收集的数据的半导体处理工具控制。最初，在根据晶片配方参数执行的处理期间，通过原位传感器收集与晶片特性相关的数据。随后，可以通过根据与晶片性质相关的原位传感器收集的数据与通过用于预测晶片输出的过程模型预测的结果之间的比较来修改配方参数来调整该过程。然后执行利用原位传感器收集的数据的后续处理。在本发明的至少一些实施例中，数据可以用于由工具处理的后续晶片上的运行控制。

8. 发明申请

WO2003009345A2 INTEGRATION OF FAULT DETECTION WITH RUN-TO-RUN CONTROL 审中-公开
标题翻译：故障检测与运行控制的集成
公开(公告)号：WO2003009345A2
公开(公告)日：2003-01-30
申请号：PCT/US2002/021942
申请日：2002-07-12
申请人： APPLIED MATERIALS, INC.
发明人： REISS, Terry, P. , SHANMUGASUNDRAM, Arulkumar, P. , SCHWARM, Alexander, T.
IPC分类号： H01L21/00
CPC分类号： G05B23/0286 , G05B19/41865 , G05B2219/31357 , G05B2219/31443 , G05B2219/45031 , Y02P90/12 , Y02P90/14 , Y02P90/20
摘要： Semiconductor wafers are processed in conjunction with a manufacturing execution system using a run-to-run controller and a fault detection system. A recipe is received from the manufacturing execution system by the run-to-run controller for controlling a tool. The recipe includes a setpoint for obtaining one or more target wafer properties. Processing of the wafers is monitored by measuring processing attributes including fault conditions and wafer properties using the fault detection system and one or more sensors. Setpoints of the recipe may be modified at the run-to-run controller according to the processing attributes to maintain the target wafer properties, except in cases when a fault condition is detected by the fault detection system. Thus, data acquired in the presence of tool or wafer fault conditions are not used for feedback purposes. In addition, fault detection models may be used to define a range of conditions indicative of a fault condition. in these cases, the fault detection models may be modified to incorporate, as parameters, setpoints of a recipe modified by a run-to-run controller.
摘要翻译：半导体晶片与使用运行控制器和故障检测系统的制造执行系统一起进行处理。通过用于控制工具的跑步运行控制器从制造执行系统接收配方。该配方包括用于获得一个或多个目标晶片特性的设定点。通过使用故障检测系统和一个或多个传感器测量包括故障状况和晶片特性的处理属性来监视晶片的处理。除了在故障检测系统检测到故障情况的情况下，配方的设定点可以根据处理属性在运行控制器上修改以维持目标晶片特性。因此，在存在工具或晶片故障条件的情况下获取的数据不用于反馈目的。此外，可以使用故障检测模型来定义指示故障状况的条件范围。在这些情况下，可以修改故障检测模型，以便将由运行到运行的控制器修改的配方的设定值作为参数进行整合。

9. 发明申请

WO2002103777A1 FEEDBACK CONTROL OF A CHEMICAL MECHANICAL POLISHING DEVICE PROVIDING MANIPULATION OF REMOVAL RATE PROFILES 审中-公开
标题翻译：提供拆卸速率配置文件的化学机械抛光装置的反馈控制
公开(公告)号：WO2002103777A1
公开(公告)日：2002-12-27
申请号：PCT/US2002/019063
申请日：2002-06-17
申请人： APPLIED MATERIALS, INC.
发明人： SHANMUGASUNDRAM, Arulkumar, P. , SCHWARM, Alexander, T. , PRABHU, Gopalakrishna, B.
IPC分类号： H01L21/66
CPC分类号： B24B37/013 , B24B37/042 , B24B49/03 , B24B49/04 , B24B49/18 , G05B19/00 , G05B19/19 , G05B19/41865 , G05B2219/32053 , G05B2219/32065 , G05B2219/45031 , H01L21/31053 , H01L21/67253 , H01L21/67276 , H01L22/20 , H01L2924/0002 , Y02P90/20 , Y02P90/22 , H01L2924/00
摘要： A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies a wafer material removal rate in a polishing step of a polishing process for each of the regions, wherein the polishing process comprises a plurality of polishing steps, (b) polishing a wafer using a first polishing recipe based upon an incoming wafer thickness profile, (c) determining a wafer thickness profile for the post-polished wafer of step (b), and (d) calculating an updated polishing recipe based upon the wafer thickness profile of step (c) and the model of step (a) to maintain a target wafer thickness profile. The model defines the effect of tool state on polishing effectiveness. The method can be used to provide feedback to a plurality of platen stations.
摘要翻译：在抛光操作中控制晶片的表面不均匀性的方法包括（a）提供在晶片上限定多个区域的晶片抛光模型，并且在抛光工艺的抛光步骤中识别晶片材料去除速率对于每个所述区域，其中所述抛光工艺包括多个抛光步骤，（b）基于进入的晶片厚度轮廓使用第一抛光配方抛光晶片，（c）确定所述后抛光晶片的晶片厚度分布的步骤（b）的模型，以及（d）基于步骤（c）的晶片厚度分布和步骤（a）的模型来计算更新的抛光配方以维持目标晶片厚度轮廓。该模型定义了刀具状态对抛光效果的影响。该方法可以用于向多个压板站提供反馈。

10. 发明申请

WO2003009345A3 INTEGRATION OF FAULT DETECTION WITH RUN-TO-RUN CONTROL 审中-公开
公开(公告)号：WO2003009345A3
公开(公告)日：2003-01-30
申请号：PCT/US2002/021942
申请日：2002-07-12
申请人： APPLIED MATERIALS, INC.
发明人： REISS, Terry, P. , SHANMUGASUNDRAM, Arulkumar, P. , SCHWARM, Alexander, T.
IPC分类号： G05B19/418
摘要： Semiconductor wafers are processed in conjunction with a manufacturing execution system using a run-to-run controller and a fault detection system. A recipe is received from the manufacturing execution system by the run-to-run controller for controlling a tool. The recipe includes a setpoint for obtaining one or more target wafer properties. Processing of the wafers is monitored by measuring processing attributes including fault conditions and wafer properties using the fault detection system and one or more sensors. Setpoints of the recipe may be modified at the run-to-run controller according to the processing attributes to maintain the target wafer properties, except in cases when a fault condition is detected by the fault detection system. Thus, data acquired in the presence of tool or wafer fault conditions are not used for feedback purposes. In addition, fault detection models may be used to define a range of conditions indicative of a fault condition. in these cases, the fault detection models may be modified to incorporate, as parameters, setpoints of a recipe modified by a run-to-run controller.

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