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    • 5. 发明申请
    • PRECISION PRINTING ELECTROPLATING THROUGH PLATING MASK ON A SOLAR CELL SUBSTRATE
    • 精密印刷通过太阳能电池基板上的电镀掩模进行电镀
    • WO2008070528A2
    • 2008-06-12
    • PCT/US2007/085963
    • 2007-11-29
    • APPLIED MATERIALS, INC.LOPATIN, SergeyDUKOVIC, John O.EAGLESHAM, DavidKOVARSKY, Nicolay Y.BACHRACH, RobertBUSCH, JohnGAY, Charles
    • LOPATIN, SergeyDUKOVIC, John O.EAGLESHAM, DavidKOVARSKY, Nicolay Y.BACHRACH, RobertBUSCH, JohnGAY, Charles
    • B05C13/02H01L21/469
    • H01L31/022425H01L31/02008Y02E10/50
    • Embodiments of the invention contemplate the formation of a low cost solar cell using a novel electroplating apparatus and method to form a metal contact structure having metal lines formed using an electrochemical plating process. The apparatus and methods described herein remove the need to perform the often costly processing steps of performing a mask preparation and formation steps, such as screen printing, lithographic steps and inkjet printing steps, to form a contact structure. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper. Embodiments of the invention may provide an apparatus and method of forming a solar cell device that utilizes a reusable masking device during one or more electrochemical deposition steps.
    • 本发明的实施例考虑使用新型电镀设备和方法形成低成本太阳能电池,以形成具有使用电化学电镀工艺形成的金属线的金属接触结构。 本文描述的装置和方法不需要执行经常昂贵的处理步骤来执行掩模准备和形成步骤,例如丝网印刷,光刻步骤和喷墨印刷步骤,以形成接触结构。 在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。 因此,希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。 因此,本文描述的本发明的一个或多个实施例适用于使用包含普通金属(例如铜)的电化学电镀工艺形成低成本且可靠的互连层。 本发明的实施例可以提供一种形成在一个或多个电化学沉积步骤期间利用可重复使用的掩模装置的太阳能电池装置的装置和方法。