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1. 发明申请

WO2012025484A1 CARRIER FOR A SUBSTRATE AND A METHOD FOR ASSEMBLING THE SAME 审中-公开
标题翻译：用于衬底的载体和用于组装衬底的方法
公开(公告)号：WO2012025484A1
公开(公告)日：2012-03-01
申请号：PCT/EP2011/064371
申请日：2011-08-22
申请人： APPLIED MATERIALS, INC. , BRÜNING, Andre , HEIMEL, Oliver , HINTERSCHUSTER, Reiner , WOLF, Hans Georg
发明人： BRÜNING, Andre , HEIMEL, Oliver , HINTERSCHUSTER, Reiner , WOLF, Hans Georg
IPC分类号： C23C14/50
CPC分类号： C23C14/50 , C03C17/002 , Y10T29/49826 , Y10T29/49963
摘要： The present invention is relates to carriers for substrates and to methods for assembling the same in the field of vacuum deposition of thin films. In particular, the present invention is directed a carrier (1) for a substrate to be coated in a vacuum chamber comprising: a first frame (3) comprising two vertical sections (32) and two horizontal sections (31) being dimensioned to surround the substrate; a second frame (2) dimensioned to define an area of the substrate to be coated, and to cover at least a first part (33) of the first frame (3) to prevent the first part (33) of the first frame (3) from being coated when the second frame (2) is mounted to the first frame (3); and wherein the second frame (2) is detachably mounted to the first frame (3).
摘要翻译：本发明涉及用于衬底的载体及其在薄膜的真空沉积领域中的组装方法。特别地，本发明涉及一种用于要涂覆在真空室中的基底的载体（1），包括：包括两个垂直部分（32）和两个水平部分（31）的第一框架（3），其尺寸被设计成围绕基质; 第二框架（2）的尺寸设置成限定待涂覆的基底的区域，并且覆盖第一框架（3）的至少第一部分（33）以防止第一框架（3）的第一部分（33））在第二框架（2）安装到第一框架（3）时被涂覆; 并且其中所述第二框架（2）可拆卸地安装到所述第一框架（3）。

2. 发明申请

WO2015158390A1 CARRIER FOR SUBSTRATES 审中-公开
标题翻译：基板载体
公开(公告)号：WO2015158390A1
公开(公告)日：2015-10-22
申请号：PCT/EP2014/057919
申请日：2014-04-17
申请人： APPLIED MATERIALS, INC. , BRÜNING, Andre , HEIMEL, Oliver , HINTERSCHUSTER, Reiner
发明人： BRÜNING, Andre , HEIMEL, Oliver , HINTERSCHUSTER, Reiner
IPC分类号： H01J37/32 , H01L21/687 , C23C16/458 , C23C14/50 , G03F7/20
CPC分类号： H01J37/32715 , C23C14/50 , C23C16/4585 , C23C16/4587 , G03F7/707 , G03F7/70716 , G03F7/70783 , H01J37/32376 , H01L21/68728
摘要： A carrier (100) for supporting a substrate (101) in a substrate processing chamber (600) for vacuum processing is described. The carrier includes at least two holders (120), wherein each holder includes a fixed portion (122), which is configured to be attached to a carrier body having a fixed position with respect to the carrier body, a floating portion (123), which is movable relative to the fixed portion along at least one direction (140), and a fixing mechanism, which is provided in a fixed position relative to the floating portion and which is configured to clamp the substrate in the holder. Moreover, the floating portion is movable along the at least one direction from a first end position to a second end position, and said floating portion further comprises a force arrangement (130) configured to center or to pull the substrate in the carrier in the at least one direction.
摘要翻译：描述了用于在用于真空处理的基板处理室（600）中支撑基板（101）的载体（100）。载体包括至少两个保持器（120），其中每个保持器包括固定部分（122），其被构造成附接到相对于载体主体具有固定位置的载体主体，浮动部分（123）其可沿至少一个方向（140）相对于所述固定部分移动;以及固定机构，所述固定机构相对于所述浮动部分设置在固定位置，并且被构造成将所述基板夹持在所述保持器中。此外，浮动部分可以沿着至少一个方向从第一端部位置移动到第二端部位置，并且所述浮动部分还包括力装置（130），其配置成使载体中的基板在中心位置或在其中拉动至少一个方向。

3. 发明申请

WO2013044941A1 CARRIER FOR THIN GLASS SUBSTRATES AND USE THEREOF 审中-公开
标题翻译：用于薄玻璃基板的载体及其用途
公开(公告)号：WO2013044941A1
公开(公告)日：2013-04-04
申请号：PCT/EP2011/066780
申请日：2011-09-27
申请人： APPLIED MATERIALS, INC. , BRUENING, Andre , HEIMEL, Oliver , HINTERSCHUSTER, Reiner , WOLF, Hans Georg
发明人： BRUENING, Andre , HEIMEL, Oliver , HINTERSCHUSTER, Reiner , WOLF, Hans Georg
IPC分类号： C23C14/50
CPC分类号： C23C14/50
摘要： A carrier for supporting a large area glass substrate having an area of at least 0.174 m² in a substrate processing chamber is described. The carrier includes at least one fixation element configured to hold the substrate at the substrate's upper side and configured to carry at least 60% of the substrate's weight during processing of the substrate, and at least one support portion adapted to hold the substrate at an essentially vertical orientation during processing of the substrate.
摘要翻译：描述了用于在衬底处理室中支撑具有至少0.174m 2的面积的大面积玻璃衬底的载体。所述载体包括至少一个固定元件，所述至少一个固定元件构造成将所述基板保持在所述基板的上侧，并且被配置为在所述基板的处理期间承载所述基板的重量的至少60％，并且至少一个支撑部分适于将所述基板保持在基本上在衬底加工过程中垂直取向。

4. 发明申请

WO2020001775A1 COMPONENT FOR A VACUUM CHAMBER, VACUUM CHAMBER, AND METHOD OF MANUFACTURING A DEGASSING HOLE 审中-公开
公开(公告)号：WO2020001775A1
公开(公告)日：2020-01-02
申请号：PCT/EP2018/067434
申请日：2018-06-28
申请人： APPLIED MATERIALS, INC. , HEIMEL, Oliver , HINTERSCHUSTER, Reiner
发明人： HEIMEL, Oliver , HINTERSCHUSTER, Reiner
IPC分类号： H01J37/32 , H01J37/34 , C23C16/44 , G03F7/20
摘要： A component (502) for a vacuum chamber (500) is described. The component includes a first surface (232) and a blind hole (210) provided in the first surface. The component further includes a degassing hole (220) provided in the first surface and partially overlapping with the blind hole.

5. 发明申请

WO2019096426A1 SUBSTRATE PROCESS ARRANGEMENT AND METHOD FOR HOLDING A SUBSTRATE 审中-公开
公开(公告)号：WO2019096426A1
公开(公告)日：2019-05-23
申请号：PCT/EP2017/079800
申请日：2017-11-20
申请人： APPLIED MATERIALS, INC. , LAU, Simon , HELLMICH, Anke , HINTERSCHUSTER, Reiner
发明人： LAU, Simon , HELLMICH, Anke , HINTERSCHUSTER, Reiner
IPC分类号： H01J37/32 , C23C14/50 , C23C16/458 , H01L21/687
摘要： A substrate support (100) for supporting a substrate (101) having a front surface (102) to be processed and an opposing back surface (115) is described. The substrate support includes a support body and a dry adhesive assembly (240) attached to the support body, the dry adhesive assembly having one or more dry adhesive elements (121), wherein the one or more dry adhesive elements support the substrate at the back surface in at least a center region and an outer region.

6. 发明申请

WO2016015745A1 APPARATUS AND METHOD FOR HOLDING A SUBSTRATE DURING LAYER DEPOSITION IN A VACUUM CHAMBER 审中-公开
标题翻译：在真空室中的层沉积期间保持基底的装置和方法
公开(公告)号：WO2016015745A1
公开(公告)日：2016-02-04
申请号：PCT/EP2014/066181
申请日：2014-07-28
申请人： APPLIED MATERIALS, INC. , HINTERSCHUSTER, Reiner , BRÜNING, Andre
发明人： HINTERSCHUSTER, Reiner , BRÜNING, Andre
IPC分类号： C23C16/458 , C23C14/50 , B65G49/06
CPC分类号： C23C16/4587 , B25B11/005 , C23C14/50
摘要： The present disclosure provides a holding arrangement (100) for holding a substrate (10) during layer deposition in a vacuum chamber. The holding arrangement (100) includes a carrier (110) having a support surface (112) configured for supporting the substrate (10); and one or more holding devices (120) provided at the carrier (110). Each each holding device (120) includes at least one rotatable device (122) configured to rotate around a rotation axis (124), wherein the rotation axis (124) is substantially perpendicular to the support surface (112), and wherein the rotatable device (122) has a contact element (126, 526) positioned at a distance from the rotation axis (124) for holding the substrate (10) after rotation.
摘要翻译：本公开提供了一种用于在层沉积期间在真空室中保持衬底（10）的保持装置（100）。保持装置（100）包括具有支撑表面（112）的载体（110），支撑表面（112）构造成支撑基底（10）; 以及设置在所述载体（110）处的一个或多个保持装置（120）。每个保持装置（120）包括构造成围绕旋转轴线（124）旋转的至少一个可旋转装置（122），其中旋转轴线（124）基本上垂直于支撑表面（112），并且其中可旋转装置（122）具有定位在离开旋转轴线（124）一定距离处的接触元件（126,526），用于在旋转之后保持基板（10）。

7. 发明申请

WO2015176751A1 DEPOSITION APPARATUS FOR DEPOSITION OF A MATERIAL ON A SUBSTRATE AND METHOD FOR DEPOSITING A MATERIAL ON A SUBSTRATE 审中-公开
标题翻译：用于沉积基材上的材料的沉积装置和在基材上沉积材料的方法
公开(公告)号：WO2015176751A1
公开(公告)日：2015-11-26
申请号：PCT/EP2014/060360
申请日：2014-05-20
申请人： APPLIED MATERIALS, INC , ZILBAUER, Thomas Werner , HELLMICH, Anke , HINTERSCHUSTER, Reiner , MÜHLFELD, Uwe , STOCK, Bernhard , WOLF, Hans Georg , BENDER, Marcus
发明人： ZILBAUER, Thomas Werner , HELLMICH, Anke , HINTERSCHUSTER, Reiner , MÜHLFELD, Uwe , STOCK, Bernhard , WOLF, Hans Georg , BENDER, Marcus
IPC分类号： C23C14/56 , C23C14/34
CPC分类号： C23C14/568 , C23C14/3464 , C23C14/562
摘要： A deposition apparatus (300) for deposition of a material on a substrate is provided. The deposition apparatus (300) includes two or more processing chambers including a first processing chamber (310) and a second processing chamber (320); a substrate support (330) extending at least through the first processing chamber (310) and the second processing chamber (320); and two or more deposition source assemblies including a first deposition source assembly (350) in the first processing chamber (310) and a second deposition source assembly (360) in the second processing chamber (320). Each of the two or more deposition source assemblies includes at least one deposition source support (351, 361) configured to support at least one first deposition source and at least one process device. The at least one deposition source support (351, 361) is configured to be moveable at least between a first position and a second position. In the first position, the at least one first deposition source is oriented towards the substrate support (330), and, in the second position, the at least one process device is oriented towards the substrate support (330).
摘要翻译：提供了用于将材料沉积在基板上的沉积设备（300）。沉积装置（300）包括两个或多个处理室，包括第一处理室（310）和第二处理室（320）。至少延伸穿过第一处理室（310）和第二处理室（320）的衬底支撑件（330）; 以及包括第一处理室（310）中的第一沉积源组件（350）和第二处理室（320）中的第二沉积源组件（360）的两个或更多个沉积源组件。两个或更多个沉积源组件中的每一个包括被配置为支撑至少一个第一沉积源和至少一个处理装置的至少一个沉积源支撑件（351,361）。至少一个沉积源支撑件（351,361）构造成至少在第一位置和第二位置之间是可移动的。在第一位置，至少一个第一沉积源朝向衬底支撑件（330）定向，并且在第二位置，至少一个处理装置朝向衬底支撑件（330）取向。

8. 发明申请

WO2019096425A1 SUBSTRATE SUPPORT FOR PROCESSING A SUBSTRATE, VACUUM PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM 审中-公开
公开(公告)号：WO2019096425A1
公开(公告)日：2019-05-23
申请号：PCT/EP2017/079798
申请日：2017-11-20
申请人： APPLIED MATERIALS, INC. , LAU, Simon , HINTERSCHUSTER, Reiner , HELLMICH, Anke
发明人： LAU, Simon , HINTERSCHUSTER, Reiner , HELLMICH, Anke
IPC分类号： H01J37/32 , C23C14/50 , C23C16/458 , H01L21/687
CPC分类号： H01J37/32715 , C23C14/042 , C23C14/50 , C23C16/042 , C23C16/4581 , H01J37/32733 , H01J37/32899 , H01L21/6875 , H01L21/68764
摘要： A substrate support (100) for processing a substrate (101) is described. The substrate support includes a support body (110); and a dry adhesive (120) attached to the support body providing a holding arrangement for the substrate, the support body being configured to move the substrate by an angle in a processing area (170).

9. 发明申请

WO2015188878A1 CLAMP ARRANGEMENT FOR A SUBSTRATE CARRIER, AND METHOD FOR OPENING AND FASTENING A CLAMP ARRANGEMENT 审中-公开
标题翻译：底板承载件的夹紧装置，以及打开和紧固夹紧装置的方法
公开(公告)号：WO2015188878A1
公开(公告)日：2015-12-17
申请号：PCT/EP2014/062420
申请日：2014-06-13
申请人： APPLIED MATERIALS, INC. , BRÜNING, Andre , HINTERSCHUSTER, Reiner
发明人： BRÜNING, Andre , HINTERSCHUSTER, Reiner
IPC分类号： H01L21/67 , H01L21/687
CPC分类号： H01L21/68707 , H01L21/67115 , H01L21/68728
摘要： A clamp device (100), a clamp tool (200), and a clamp arrangement (300) for clamping a substrate (480) to be processed in a substrate carrier (500) are described. The clamp device includes a first lever (110) and a second lever (120), wherein the first lever (110) is movably supported in a first joint (115), the second lever (120) is movably supported in a second joint (125), and wherein the first lever (110) and the second lever (120) are movably connected to each other by a first common joint (140). The second lever (120) includes a clamping portion (121) adapted for being pressed against the substrate (480; 510) to be processed. At least one of the first lever (110) and the second lever (120) comprises a contact portion (116; 126) for providing functional contact to a clamp tool (200; 610). The clamp tool is adapted for opening and fastening the clamp device.
摘要翻译：描述了夹持装置（100），夹紧工具（200）和用于夹持待处理衬底（480）在衬底载体（500）中的夹具装置（300）。夹持装置包括第一杆（110）和第二杆（120），其中第一杆（110）可移动地支撑在第一接头（115）中，第二杆（120）可移动地支撑在第二接头 125），并且其中所述第一杆（110）和所述第二杆（120）通过第一公共接头（140）可移动地彼此连接。第二杆（120）包括适于被压靠待加工的衬底（480; 510）的夹紧部分（121）。所述第一杆（110）和所述第二杆（120）中的至少一个包括用于向夹具（200; 610）提供功能接触的接触部分（116; 126）。夹具用于打开和固定夹紧装置。

10. 发明申请

WO2011141513A1 CHAMBER FOR PHYSICAL VAPOR DEPOSITION 审中-公开
标题翻译：物理蒸气沉积室
公开(公告)号：WO2011141513A1
公开(公告)日：2011-11-17
申请号：PCT/EP2011/057626
申请日：2011-05-11
申请人： APPLIED MATERIALS, INC. , HINTERSCHUSTER, Reiner , LIPPERT, Lothar
发明人： HINTERSCHUSTER, Reiner , LIPPERT, Lothar
IPC分类号： H01J37/34 , C23C14/35 , C23C14/34 , H01L21/00
CPC分类号： H01L21/67098 , C23C14/3407 , H01J37/34 , H01L21/67103 , H01L21/67109
摘要： A chamber (200; 300; 400; 500; 600; 700; 900; 1000) for physical vapour deposition is provided. The chamber includes a housing (210; 310; 410; 510; 610; 710; 910; 1010), a door (220; 320; 420; 520; 620; 720; 920 1100; 1220) for opening and closing the housing; and a bearing (240; 340; 440; 540; 640; 740; 940; 1140; 1240) for receiving a target (230), wherein the bearing is oriented in a first direction (260). Further, the chamber is adapted so that the target is at least partially removable from the chamber in the first direction. According to an embodiment, a chamber (200; 300; 400; 500; 600; 700; 900; 1000,) for physical vapour deposition is provided. The chamber is adapted for receiving at least one target (230) and a substrate. The chamber includes a housing; a door; and at least one bearing for mounting the target, wherein the bearing is attached to the door.
摘要翻译：提供用于物理气相沉积的室（200; 300; 400; 500; 600; 700; 900; 1000）。该室包括用于打开和关闭壳体的壳体（210; 310; 410; 510; 610; 710; 910; 1010），门（220; 320; 420; 520; 620; 720; 920 1100; 1220）以及用于接收靶（230）的轴承（240; 340; 440; 540; 640; 740; 940; 1140; 1240），其中所述轴承沿第一方向（260）定向。此外，腔室适于使靶材在第一方向上至少部分地可从腔室移除。根据实施例，提供用于物理气相沉积的室（200; 300; 400; 500; 600; 700; 900; 1000）。该腔适于接收至少一个靶（230）和基底。该室包括一个壳体; 一扇门; 以及用于安装所述目标的至少一个轴承，其中所述轴承附接到所述门。

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