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1. 发明申请

WO2010039410A3 BRUSH BOX CLEANER WITH FORCE CONTROL 审中-公开
公开(公告)号：WO2010039410A3
公开(公告)日：2010-04-08
申请号：PCT/US2009/056686
申请日：2009-09-11
申请人： APPLIED MATERIALS, INC. , CHEN, Hui , YUDOVSKY, Joseph , D'AMBRA, Allen, L.
发明人： CHEN, Hui , YUDOVSKY, Joseph , D'AMBRA, Allen, L.
IPC分类号： H01L21/304
摘要： Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using scrubber brushes. One embodiment of the present invention provides a substrate cleaner comprises two scrubber brush assemblies movably disposed in a processing volume. The two scrubber brush assemblies are configured to contact and clean opposite surfaces of a substrate disposed in the processing volume. The substrate cleaner also comprises a positioning assembly configured to simultaneously adjust positions of the two scrubber brush assemblies, wherein the positioning assembly makes substantially the same amount of adjustment to the first and second scrubber brush assemblies in mirror symmetry.

2. 发明申请

WO2011139388A1 DISK-BRUSH CLEANER MODULE WITH FLUID JET 审中-公开
标题翻译：带流体喷射的盘式清洁器模块
公开(公告)号：WO2011139388A1
公开(公告)日：2011-11-10
申请号：PCT/US2011/021147
申请日：2011-01-13
申请人： APPLIED MATERIALS, INC. , CHEN, Hui , D'AMBRA, Allen L. , KO, Sen-Hou , CHEN, Yufei , BLANK, Adrian , SILVETTI, Mario D. , ALONZO, Geraldo J. , KARUPPIAH, Lakshmanan
发明人： CHEN, Hui , D'AMBRA, Allen L. , KO, Sen-Hou , CHEN, Yufei , BLANK, Adrian , SILVETTI, Mario D. , ALONZO, Geraldo J. , KARUPPIAH, Lakshmanan
IPC分类号： H01L21/302
CPC分类号： H01L21/67046 , H01L21/67051
摘要： Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using a disk brush. One embodiment provides a substrate cleaner comprising a substrate chuck disposed in the processing volume, and a brush assembly disposed in the processing volume, wherein the brush assembly comprises a disk brush movably disposed opposing the substrate chuck, and a processing surface of the disk brush contacts a surface of the substrate on the substrate chuck.
摘要翻译：本发明的实施例涉及使用盘刷清洁衬底的装置和方法。一个实施例提供一种基板清洁器，其包括设置在处理体积中的基板卡盘和设置在处理容积中的刷子组件，其中刷子组件包括可移动地布置成与基板卡盘相对的盘刷，以及盘刷触头的处理表面基板卡盘上的基板的表面。

3. 发明申请

WO2010039409A2 APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE USING PRESSURIZED FLUID 审中-公开
标题翻译：使用加压流体清洁半导体基板的装置和方法
公开(公告)号：WO2010039409A2
公开(公告)日：2010-04-08
申请号：PCT/US2009/056679
申请日：2009-09-11
申请人： APPLIED MATERIALS, INC. , CHEN, Hui , D'AMBRA, Allen L.
发明人： CHEN, Hui , D'AMBRA, Allen L.
IPC分类号： H01L21/304 , H01L21/302
CPC分类号： H01L21/67051
摘要： Embodiments of the present invention generally relate to an apparatus and a method for cleaning a semiconductor substrate after a polishing process. Particularly, embodiments of the present invention relates to an apparatus and method for cleaning a substrate using pressurized fluid. One embodiment of the present invention comprises two rollers to support and rotate a substrate in a substantially vertical orientation, a pressure wheel to apply a force to engage the substrate with the two rollers, and a swinging nozzle configured to dispense a pressurized fluid towards the substrate.
摘要翻译：本发明的实施例一般涉及在抛光处理之后清洁半导体衬底的装置和方法。特别地，本发明的实施例涉及使用加压流体清洁基板的装置和方法。本发明的一个实施例包括两个辊，用于以基本垂直的方向支撑和旋转基底，压力轮施加力以使基底与两个辊接合;以及摆动喷嘴，构造成将加压流体分配到基底。

4. 发明申请

WO2013070289A1 BRUSH BOX MODULE FOR CHEMICAL MECHANICAL POLISHING CLEANER 审中-公开
标题翻译：用于化学机械抛光清洁剂的刷盒
公开(公告)号：WO2013070289A1
公开(公告)日：2013-05-16
申请号：PCT/US2012/048193
申请日：2012-07-25
申请人： APPLIED MATERIALS, INC. , CHEN, Hui , D'AMBRA, Allen L. , KARUPPIAH, Lakshmanan , OSTERHELD, Thomas H.
发明人： CHEN, Hui , D'AMBRA, Allen L. , KARUPPIAH, Lakshmanan , OSTERHELD, Thomas H.
IPC分类号： H01L21/302 , H01L21/304
CPC分类号： H01L21/67046
摘要： Embodiments of the invention generally relate to a method and apparatus for cleaning a substrate. Particularly, embodiments of the invention relate to an apparatus and method for cleaning a substrate using a scrub brush. One embodiment provides a brush box assembly for cleaning a substrate. The assembly comprises a chamber body having a cleaning chamber disposed therein, a rotatable chuck disposed in the cleaning chamber, and an edge cleaner module positioned adjacent the chuck.
摘要翻译：本发明的实施例一般涉及用于清洁基底的方法和装置。特别地，本发明的实施例涉及一种使用擦洗刷清洁衬底的装置和方法。一个实施例提供了一种用于清洁基底的刷盒组件。该组件包括一个室主体，其具有设置在其中的清洁室，设置在清洁室中的可旋转卡盘以及邻近卡盘定位的边缘清洁器模块。

5. 发明申请

WO2009158378A3 DUAL CHAMBER MEGASONIC CLEANER 审中-公开
公开(公告)号：WO2009158378A3
公开(公告)日：2009-12-30
申请号：PCT/US2009/048390
申请日：2009-06-24
申请人： APPLIED MATERIALS, INC. , MARTINEZ, Ricardo , D'AMBRA, Allen, L. , BLANK, Adrian , BRITCHER, Thuy , CHEN, Hui
发明人： MARTINEZ, Ricardo , D'AMBRA, Allen, L. , BLANK, Adrian , BRITCHER, Thuy , CHEN, Hui
IPC分类号： H01L21/304 , H01L21/302
摘要： Embodiments described herein relate to semiconductor device manufacturing, and more particularly to a vertically oriented dual megasonic module for simultaneously cleaning multiple substrates. In one embodiment, an apparatus for cleaning multiple substrates is provided. The apparatus comprises an outer tank for collecting overflow processing fluid comprising at least one sidewall and a bottom. A first inner module adapted to contain a processing fluid is positioned partially within the outer tank. The first inner module comprises one or more roller assemblies to hold a substrate in a substantially vertical orientation. A second inner module adapted to contain a processing fluid is positioned partially within the outer tank. The second inner module comprises one or more roller assemblies adapted to hold a substrate in a substantially vertical orientation. Each inner module contains a transducer adapted to direct vibrational energy through the processing fluid toward the substrates.

6. 发明申请

WO2006124472A2 METHOD AND APPARATUS FOR VERTICAL TRANSFER OF SEMICONDUCTOR SUBSTRATES IN A CLEANING MODULE 审中-公开
标题翻译：半导体基板在清洁模块中垂直传输的方法和装置
公开(公告)号：WO2006124472A2
公开(公告)日：2006-11-23
申请号：PCT/US2006/018130
申请日：2006-05-11
申请人： APPLIED MATERIALS, INC. , YUDOVSKY, Joseph , CHEN, Hui
发明人： YUDOVSKY, Joseph , CHEN, Hui
IPC分类号： H01L21/00
CPC分类号： H01L21/67028 , H01L21/67173 , H01L21/67219 , H01L21/67742 , H01L21/67751
摘要： A substrate handler is provided. In one embodiment, the substrate handler includes a first and second carriage coupled to a rail. A first robot having at least two grippers is attached to the first carrier. A second robot having at least one gripper is coupled to the second carriage. The first carriage is independently positionable along the rail relative to the second carriage. As each carriage has a separate actuator, the movements of the first and second robot are decoupled, thereby allowing increased throughput. The substrate handler is particularly suitable for using in a planarization system having an integrated substrate cleaner.
摘要翻译：提供衬底处理器。在一个实施例中，衬底处理器包括联接到轨道的第一和第二托架。具有至少两个夹持器的第一机器人附接到第一托架。具有至少一个夹持器的第二机器人联接到第二托架。第一托架可相对于第二托架沿轨道独立定位。当每个滑架具有单独的致动器时，第一和第二机器人的运动被解耦，从而允许增加的产量。衬底处理器特别适合于在具有集成衬底清洁器的平面化系统中使用。

7. 发明申请

WO2009114664A2 SEAL INSTALLATION TOOL 审中-公开
标题翻译：密封安装工具
公开(公告)号：WO2009114664A2
公开(公告)日：2009-09-17
申请号：PCT/US2009/036906
申请日：2009-03-12
申请人： APPLIED MATERIALS, INC. , CHEN, Hui
发明人： CHEN, Hui
IPC分类号： B25B33/00 , B25B27/20 , B25B27/28 , F16L23/02 , F16L23/18
CPC分类号： B23P19/084 , B25B27/0028 , Y10T29/49963 , Y10T29/53878 , Y10T29/53909 , Y10T29/53943
摘要： A tool is provided to facilitate the assembly of a seal ring. The tool comprises an elongated body and a flange projecting radially from the elongated body. A first portion of the tool is configured to receive the placement of a seal ring and a retainer cap thereon. The retainer cap may carry attachment elements, such as screws, used to secure the retainer cap on the housing. To mount the seal ring, the tool is inserted through a shaft hole of the housing to clamp the seal ring and the retainer cap between the housing and a flange of the tool. The attachment elements then are tightened to fix the retainer cap on the housing, which secures the seal ring sandwiched between the retainer cap and the housing. After the assembly of the seal ring is completed, the tool may then be slidably removed.
摘要翻译：提供了一种便于组装密封环的工具。该工具包括细长主体和从细长主体径向突出的凸缘。该工具的第一部分构造成接收其上的密封环和保持器盖的放置。保持器帽可以携带用于将保持器盖固定在壳体上的附接元件，例如螺钉。为了安装密封环，工具通过壳体的轴孔插入，以将密封环和保持器盖夹在壳体和工具的凸缘之间。然后紧固附接元件以将保持器盖固定在壳体上，其将密封环固定在夹持器盖和壳体之间。在完成密封环的组装之后，可以可滑动地移除该工具。

8. 发明申请

WO2013162638A1 VAPOR DRYER MODULE WITH REDUCED PARTICLE GENERATION 审中-公开
标题翻译：具有减少颗粒生成的蒸汽干燥器模块
公开(公告)号：WO2013162638A1
公开(公告)日：2013-10-31
申请号：PCT/US2012/048183
申请日：2012-07-25
申请人： APPLIED MATERIALS, INC. , ZHANG, Dan , CHEN, Hui , ATKINSON, Jim, K. , CHEN, Hung, Chih , D'AMBRA, Allen
发明人： ZHANG, Dan , CHEN, Hui , ATKINSON, Jim, K. , CHEN, Hung, Chih , D'AMBRA, Allen
IPC分类号： H01L21/302
CPC分类号： H01L21/67034 , B25J11/0095 , F26B25/001 , F26B25/14 , H01L21/67057 , H01L21/67326 , H01L21/67748 , H01L21/67751
摘要： Embodiments described herein generally relate to a vapor dryer module for cleaning substrates during a chemical mechanical polishing (CMP) process. In one embodiment, a module for processing a substrate is provided. The module includes a tank having sidewalls with an outer surface and an inner surface defining a processing volume, a substrate support structure for transferring a substrate within the processing volume, the substrate support structure having a first portion that is at least partially disposed in the processing volume and a second portion that is outside of the processing volume, and one or more actuators disposed on an outer surface of one of the sidewalls of the tank and coupled between the outer surface and the second portion of the support structure, the one or more actuators operable to move the support structure relative to the tank.
摘要翻译：本文描述的实施例通常涉及用于在化学机械抛光（CMP）工艺期间清洁衬底的蒸汽干燥器模块。在一个实施例中，提供了一种用于处理衬底的模块。模块包括具有外表面和限定处理体积的内表面的侧壁的槽，用于在处理体积内转移衬底的衬底支撑结构，衬底支撑结构具有至少部分地设置在处理中的第一部分体积和在处理体积外的第二部分，以及一个或多个致动器，其设置在罐的侧壁中的一个的外表面上并且联接在支撑结构的外表面和第二部分之间，一个或多个致动器可操作以相对于罐移动支撑结构。

9. 发明申请

WO2013162864A1 HIGH STIFFNESS, ANTI-SLIP SCRUBBER BRUSH ASSEMBLY, HIGH-STIFFNESS MANDREL, SUBASSEMBLIES, AND ASSEMBLY METHODS 审中-公开
标题翻译：高刚度，防滑玻璃刷组件，高强度人造板，底座和组装方法
公开(公告)号：WO2013162864A1
公开(公告)日：2013-10-31
申请号：PCT/US2013/035682
申请日：2013-04-08
申请人： APPLIED MATERIALS, INC.
发明人： CHEN, Hui , CHEN, Hung , ATKINSON, Jim , HUO, David D.
IPC分类号： H01L21/302
CPC分类号： A46B3/005 , A46B13/001 , H01L21/02096
摘要： In one aspect, a scrubber brush assembly is provided. The scrubber brush assembly includes a scrubber brush having a body of open-cell foam including an interior surface, a sleeve received in contact with the scrubber brush, the sleeve including peripherally-spaced, longitudinal walls and reinforcing segments interconnecting adjacent ones of the longitudinal walls and forming elongated pockets along the length, the sleeve having raised ribs extending along the length, and a mandrel having recesses formed on an outer surface, the mandrel being coupled to the sleeve by receiving the raised ribs within the recesses. Scrubber brush subassemblies, high stiffness mandrels, and methods of assembly are provided, as are numerous other aspects.
摘要翻译：在一个方面，提供了洗涤器刷组件。洗涤器刷组件包括洗涤器刷，其具有包括内表面的开孔泡沫体，与洗涤器刷接触的套筒，套筒包括周向间隔开的纵向壁和将邻近的纵向壁相互连接的加强段以及沿所述长度形成细长的袋，所述套筒具有沿所述长度延伸的凸肋，以及具有形成在外表面上的凹部的心轴，所述心轴通过容纳所述凹部内的凸肋而联接到所述套筒。提供了洗涤刷组件，高刚度心轴和组装方法，以及许多其它方面。

10. 发明申请

WO2003019642A1 ETCH PROCESS FOR DIELECTRIC MATERIALS COMPRISING OXIDIZED ORGANO SILANE MATERIALS 审中-公开
标题翻译：包含氧化有机硅烷材料的电介质材料的蚀刻工艺
公开(公告)号：WO2003019642A1
公开(公告)日：2003-03-06
申请号：PCT/US2002/026835
申请日：2002-08-22
申请人： APPLIED MATERIALS, INC.
发明人： BOITEUX, Yves, Pierre , CHEN, Hui , GREGORATTO, Ivano , HSIEH, Chang-Lin , HUNG, Hoiman , TANG, Sum-Yee, Betty
IPC分类号： H01L21/311
CPC分类号： H01L21/76808 , H01L21/02126 , H01L21/02164 , H01L21/022 , H01L21/02211 , H01L21/02274 , H01L21/31116 , H01L21/31633 , H01L21/76802 , H01L21/76807 , H01L2221/1036
摘要： The present invention provides a novel etching technique for etching a layer of C-doped silicon oxide, such as a partially oxidized organo silane material. This technique, employing CH 2 F 2 /Ar chemistry at low bias and low to intermediate pressure, provides high etch selectivity to silicon oxide and improved selectivity to organic photoresist. Structures including a layer of partially oxidized organo silane material (1004) deposited on a layer of silicon oxide (1002) were etched according to the novel technique, forming relatively narrow trenches (1010, 1012, 1014, 1016) and wider trenches. The technique is also suitable for forming dual damascene structures In additional embodiments, manufacturing systems are provided for fabricating IC structures of the present invention. These systems include a controller that is adapted for interacting with a plurality of fabricating stations.
摘要翻译：本发明提供一种用于蚀刻C掺杂氧化硅层的新颖蚀刻技术，例如部分氧化的有机硅烷材料。这种在低偏压和低至中压下使用CH2F2 / Ar化学的技术为氧化硅提供了高蚀刻选择性，并提高了对有机光致抗蚀剂的选择性。根据新技术蚀刻包括沉积在氧化硅层（1002）上的部分氧化的有机硅烷材料层（1004）的结构，形成较窄的沟槽（1010,1012,1014,1016）和更宽的沟槽。该技术也适用于形成双镶嵌结构。在另外的实施例中，提供制造系统用于制造本发明的IC结构。这些系统包括适于与多个制造站相互作用的控制器。

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