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1. 发明申请

WO2009158378A3 DUAL CHAMBER MEGASONIC CLEANER 审中-公开
公开(公告)号：WO2009158378A3
公开(公告)日：2009-12-30
申请号：PCT/US2009/048390
申请日：2009-06-24
申请人： APPLIED MATERIALS, INC. , MARTINEZ, Ricardo , D'AMBRA, Allen, L. , BLANK, Adrian , BRITCHER, Thuy , CHEN, Hui
发明人： MARTINEZ, Ricardo , D'AMBRA, Allen, L. , BLANK, Adrian , BRITCHER, Thuy , CHEN, Hui
IPC分类号： H01L21/304 , H01L21/302
摘要： Embodiments described herein relate to semiconductor device manufacturing, and more particularly to a vertically oriented dual megasonic module for simultaneously cleaning multiple substrates. In one embodiment, an apparatus for cleaning multiple substrates is provided. The apparatus comprises an outer tank for collecting overflow processing fluid comprising at least one sidewall and a bottom. A first inner module adapted to contain a processing fluid is positioned partially within the outer tank. The first inner module comprises one or more roller assemblies to hold a substrate in a substantially vertical orientation. A second inner module adapted to contain a processing fluid is positioned partially within the outer tank. The second inner module comprises one or more roller assemblies adapted to hold a substrate in a substantially vertical orientation. Each inner module contains a transducer adapted to direct vibrational energy through the processing fluid toward the substrates.

2. 发明申请

WO2011139388A1 DISK-BRUSH CLEANER MODULE WITH FLUID JET 审中-公开
标题翻译：带流体喷射的盘式清洁器模块
公开(公告)号：WO2011139388A1
公开(公告)日：2011-11-10
申请号：PCT/US2011/021147
申请日：2011-01-13
申请人： APPLIED MATERIALS, INC. , CHEN, Hui , D'AMBRA, Allen L. , KO, Sen-Hou , CHEN, Yufei , BLANK, Adrian , SILVETTI, Mario D. , ALONZO, Geraldo J. , KARUPPIAH, Lakshmanan
发明人： CHEN, Hui , D'AMBRA, Allen L. , KO, Sen-Hou , CHEN, Yufei , BLANK, Adrian , SILVETTI, Mario D. , ALONZO, Geraldo J. , KARUPPIAH, Lakshmanan
IPC分类号： H01L21/302
CPC分类号： H01L21/67046 , H01L21/67051
摘要： Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using a disk brush. One embodiment provides a substrate cleaner comprising a substrate chuck disposed in the processing volume, and a brush assembly disposed in the processing volume, wherein the brush assembly comprises a disk brush movably disposed opposing the substrate chuck, and a processing surface of the disk brush contacts a surface of the substrate on the substrate chuck.
摘要翻译：本发明的实施例涉及使用盘刷清洁衬底的装置和方法。一个实施例提供一种基板清洁器，其包括设置在处理体积中的基板卡盘和设置在处理容积中的刷子组件，其中刷子组件包括可移动地布置成与基板卡盘相对的盘刷，以及盘刷触头的处理表面基板卡盘上的基板的表面。

3. 发明申请

WO2009158378A2 DUAL CHAMBER MEGASONIC CLEANER 审中-公开
标题翻译：双室MEGASONIC CLEANER
公开(公告)号：WO2009158378A2
公开(公告)日：2009-12-30
申请号：PCT/US2009048390
申请日：2009-06-24
申请人： APPLIED MATERIALS INC , MARTINEZ RICARDO , D AMBRA ALLEN L , BLANK ADRIAN , BRITCHER THUY , CHEN HUI
发明人： MARTINEZ RICARDO , D AMBRA ALLEN L , BLANK ADRIAN , BRITCHER THUY , CHEN HUI
IPC分类号： H01L21/304 , H01L21/302
CPC分类号： B08B3/12 , H01L21/67051
摘要： Embodiments described herein relate to semiconductor device manufacturing, and more particularly to a vertically oriented dual megasonic module for simultaneously cleaning multiple substrates. In one embodiment, an apparatus for cleaning multiple substrates is provided. The apparatus comprises an outer tank for collecting overflow processing fluid comprising at least one sidewall and a bottom. A first inner module adapted to contain a processing fluid is positioned partially within the outer tank. The first inner module comprises one or more roller assemblies to hold a substrate in a substantially vertical orientation. A second inner module adapted to contain a processing fluid is positioned partially within the outer tank. The second inner module comprises one or more roller assemblies adapted to hold a substrate in a substantially vertical orientation. Each inner module contains a transducer adapted to direct vibrational energy through the processing fluid toward the substrates.
摘要翻译：本文所述的实施例涉及半导体器件制造，更具体地，涉及用于同时清洁多个基板的垂直取向的双兆赫模块。在一个实施例中，提供了一种用于清洁多个基板的装置。该装置包括用于收集包括至少一个侧壁和底部的溢流处理流体的外槽。适于容纳处理流体的第一内部模块部分地位于外部容器内。第一内部模块包括一个或多个辊组件以将基板保持在基本垂直的方向。适于容纳处理流体的第二内部模块部分地位于外部罐中。第二内部模块包括一个或多个辊组件，其适于将基板保持在基本垂直的方向。每个内部模块包含适于将振动能量通过处理流体引向基板的换能器。

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