发明申请
WO2013162864A1 HIGH STIFFNESS, ANTI-SLIP SCRUBBER BRUSH ASSEMBLY, HIGH-STIFFNESS MANDREL, SUBASSEMBLIES, AND ASSEMBLY METHODS
审中-公开
基本信息:
- 专利标题： HIGH STIFFNESS, ANTI-SLIP SCRUBBER BRUSH ASSEMBLY, HIGH-STIFFNESS MANDREL, SUBASSEMBLIES, AND ASSEMBLY METHODS
- 专利标题（中）：高刚度，防滑玻璃刷组件，高强度人造板，底座和组装方法
- 申请号：PCT/US2013/035682 申请日：2013-04-08
- 公开(公告)号：WO2013162864A1 公开(公告)日：2013-10-31
- 发明人： CHEN, Hui , CHEN, Hung , ATKINSON, Jim , HUO, David D.
- 申请人： APPLIED MATERIALS, INC.
- 申请人地址： 3050 Bowers Avenue Santa Clara, California 95054 US
- 专利权人： APPLIED MATERIALS, INC.
- 当前专利权人： APPLIED MATERIALS, INC.
- 当前专利权人地址： 3050 Bowers Avenue Santa Clara, California 95054 US
- 代理机构： DUGAN, Brian M. et al.
- 优先权： US13/456,796 20120426
- 主分类号： H01L21/302
- IPC分类号： H01L21/302
摘要：
In one aspect, a scrubber brush assembly is provided. The scrubber brush assembly includes a scrubber brush having a body of open-cell foam including an interior surface, a sleeve received in contact with the scrubber brush, the sleeve including peripherally-spaced, longitudinal walls and reinforcing segments interconnecting adjacent ones of the longitudinal walls and forming elongated pockets along the length, the sleeve having raised ribs extending along the length, and a mandrel having recesses formed on an outer surface, the mandrel being coupled to the sleeve by receiving the raised ribs within the recesses. Scrubber brush subassemblies, high stiffness mandrels, and methods of assembly are provided, as are numerous other aspects.
摘要（中）：
在一个方面，提供了洗涤器刷组件。 洗涤器刷组件包括洗涤器刷，其具有包括内表面的开孔泡沫体，与洗涤器刷接触的套筒，套筒包括周向间隔开的纵向壁和将邻近的纵向壁相互连接的加强段 以及沿所述长度形成细长的袋，所述套筒具有沿所述长度延伸的凸肋，以及具有形成在外表面上的凹部的心轴，所述心轴通过容纳所述凹部内的凸肋而联接到所述套筒。 提供了洗涤刷组件，高刚度心轴和组装方法，以及许多其它方面。
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/18 | ...器件有由周期表第Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料 |
| --------------H01L21/26 | ....用波或粒子辐射轰击的 |
| ----------------H01L21/302 | .....改变半导体材料的表面物理特性或形状的，例如腐蚀、抛光、切割 |