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1. 发明申请

WO2006074312A3 DUAL FLAT NON-LEADED SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：双平面非引线半导体封装
公开(公告)号：WO2006074312A3
公开(公告)日：2006-11-09
申请号：PCT/US2006000356
申请日：2006-01-05
申请人： ALPHA & OMEGA SEMICONDUCTOR , LIU KAI , ZHANG XIAOTIAN , SUN MING , LUO LEESHAWN
发明人： LIU KAI , ZHANG XIAOTIAN , SUN MING , LUO LEESHAWN
IPC分类号： H01L23/495 , H01L21/48
CPC分类号： H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49111 , H01L2224/49113 , H01L2224/49171 , H01L2224/4943 , H01L2224/85 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A DFN semiconductor package includes a leadframe (210) having a die bonding pad (300) formed integrally with a drain lead (260), a gate lead (240) and a source lead (230), a die coupled to the die bonding pad (300), a die source bonding area coupled to the source lead (230) and a die gate bonding area (300) coupled to the gate lead (240), and an encapsulant at least partially covering the die (300) drain lead (260) ate lead (240) and source lead (230).
摘要翻译： DFN半导体封装包括具有与漏极引线（260）整体形成的管芯接合焊盘（300）的引线框架（210），栅极引线（240）和源极引线（230），与管芯接合焊盘（300），耦合到所述源极引线（230）的管芯源极接合区域和耦合到所述栅极引线（240）的管芯栅极接合区域（300）;以及密封剂，至少部分地覆盖所述管芯（300）漏极引线 260）处引线（240）和源引线（230）。

2. 发明申请

WO2006135874A3 DFN SEMICONDUCTOR PACKAGE HAVING REDUCED ELECTRICAL RESISTANCE 审中-公开
标题翻译： DFN半导体封装具有降低的电阻
公开(公告)号：WO2006135874A3
公开(公告)日：2009-04-16
申请号：PCT/US2006022909
申请日：2006-06-12
申请人： ALPHA & OMEGA SEMICONDUCTOR , SUN MING , ZHANG XIAOTIAN , LIU KAI
发明人： SUN MING , ZHANG XIAOTIAN , LIU KAI
IPC分类号： H01L23/34
CPC分类号： H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/0603 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/49111 , H01L2224/49113 , H01L2224/49171 , H01L2224/4943 , H01L2224/73265 , H01L2224/85 , H01L2924/01005 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A DFN semiconductor package is disclosed, the package includes a leadframe having a die bonding pad formed integrally with a drain lead, a source lead bonding area and a gate lead bonding area, the source lead bonding area and the gate lead bonding area being of increased area, a die coupled to the die bonding pad, a die source bonding area coupled to the source lead bonding area and a die gate bonding area coupled to the gate lead bonding area, and an encapsulant at least partially covering the die, drain lead, gate lead bonding area and source lead bonding area.
摘要翻译：公开了一种DFN半导体封装，封装包括具有与漏极引线，源极引线接合区域和栅极引线接合区域一体形成的管芯接合焊盘的引线框架，源极引线接合区域和栅极引线接合区域增加区域，耦合到管芯接合焊盘的管芯，耦合到源极引线接合区域的管芯源极接合区域和耦合到栅极引线接合区域的管芯栅极结合区域，以及至少部分地覆盖管芯，漏极引线，栅极引线接合面积和源极引线接合面积。

3. 发明申请

WO2007033243A3 SEMICONDUCTOR PACKAGE HAVING PLATE INTERCONNECTIONS 审中-公开
标题翻译：具有板互连的半导体封装
公开(公告)号：WO2007033243A3
公开(公告)日：2007-12-06
申请号：PCT/US2006035641
申请日：2006-09-12
申请人： ALPHA & OMEGA SEMICONDUCTOR , SUN MING , SHI LEI , HO YUEH-SE , LIU KAI , ZHANG XIAOTIAN
发明人： SUN MING , SHI LEI , HO YUEH-SE , LIU KAI , ZHANG XIAOTIAN
IPC分类号： H01L23/495
CPC分类号： H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/32245 , H01L2224/37011 , H01L2224/40095 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having metalized source and gate areas separated by a passivation area, a patterned source connection coupling the source lead to the semiconductor die metalized source area, a patterned gate connection coupling the gate lead to the semiconductor die metalized gate area, a semiconductor die drain area coupled to the drain lead, and an encapsulant covering at least a portion of the semiconductor die and drain, source and gate leads.
摘要翻译：公开了半导体封装。该封装包括具有漏极，源极和栅极引线的引线框架，耦合到引线框架的半导体管芯，具有金属化源的半导体管芯和由钝化区域分开的栅极区域，将源极引线耦合到半导体管芯金属化源将栅极引线耦合到半导体管芯金属化栅极区域的图案化栅极连接，耦合到漏极引线的半导体管芯漏极区域以及覆盖半导体管芯和漏极，源极和栅极引线的至少一部分的密封剂。

4. 发明申请

WO2008137001A3 SEMICONDUCTOR PACKAGE HAVING DIMPLED PLATE INTERCONNECTIONS 审中-公开
标题翻译：具有切割板互连的半导体封装
公开(公告)号：WO2008137001A3
公开(公告)日：2010-03-11
申请号：PCT/US2008005563
申请日：2008-04-30
申请人： ALPHA & OMEGA SEMICONDUCTOR , SUN MING , SHI LEI , LIU KAI
发明人： SUN MING , SHI LEI , LIU KAI
IPC分类号： H01L23/495
CPC分类号： H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/32245 , H01L2224/37011 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metalized source areas and a metalized gate area, a patterned source connection having a plurality of dimples formed thereon coupling the source lead to the semiconductor die metalized source areas, a patterned gate connection having a dimple formed thereon coupling the gate lead to the semiconductor die metalized gate area, a semiconductor die drain area coupled to the drain lead, and an encapsulant covering at least a portion of the semiconductor die and drain, source and gate leads.
摘要翻译：公开了半导体封装。封装包括具有漏极，源极和栅极引线的引线框架，耦合到引线框架的半导体管芯，具有多个金属化源极区域和金属化栅极区域的半导体管芯，具有形成在其上的多个凹坑的图案化源极连接，源极引导到半导体芯片金属化源极区域，具有形成在其上的凹坑的图案化栅极连接将栅极引线耦合到半导体管芯金属化栅极区域，耦合到漏极引线的半导体管芯漏极区域和覆盖至少一部分的密封剂的半导体管芯和漏极，源极和栅极引线。

5. 发明申请

WO2007094759A3 SEMICONDUCTOR PACKAGE WITH PLATED CONNECTION 审中-公开
标题翻译：具有连接连接的半导体封装
公开(公告)号：WO2007094759A3
公开(公告)日：2007-12-21
申请号：PCT/US2006004729
申请日：2006-02-10
申请人： ALPHA & OMEGA SEMICONDUCTOR
发明人： LUO LEESHAWN , LIU KAI , SUN MING , ZHANG XIAO TIANG
IPC分类号： H01L23/02 , H01L21/00 , H01L23/48
CPC分类号： H01L21/568 , H01L23/3107 , H01L23/4334 , H01L23/49524 , H01L24/40 , H01L24/73 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16245 , H01L2224/40095 , H01L2224/40245 , H01L2224/73253 , H01L2224/73255 , H01L2224/84801 , H01L2224/8485 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/37099
摘要： A semiconductor package and method for making a semiconductor package are disclosed. The semicondu
摘要翻译：公开了半导体封装和制造半导体封装的方法。半导体

6. 发明申请

WO2007094759A9 SEMICONDUCTOR PACKAGE WITH PLATED CONNECTION 审中-公开
标题翻译：半导体封装镀层连接
公开(公告)号：WO2007094759A9
公开(公告)日：2007-11-01
申请号：PCT/US2006004729
申请日：2006-02-10
申请人： ALPHA & OMEGA SEMICONDUCTOR
发明人： LUO LEESHAWN , LIU KAI , SUN MING , ZHANG XIAO TIANG
IPC分类号： H01L23/52
CPC分类号： H01L21/568 , H01L23/3107 , H01L23/4334 , H01L23/49524 , H01L24/40 , H01L24/73 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16245 , H01L2224/40095 , H01L2224/40245 , H01L2224/73253 , H01L2224/73255 , H01L2224/84801 , H01L2224/8485 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/37099
摘要： A semiconductor package and method for making a semiconductor package are disclosed. The semiconductor package has a top surface and a mounting surface and includes a die, a conducting connecting material, a plating material and an insulating material. The die has a processed surface facing towards the mounting surface of the semiconductor package. Exposed metal connections are at the processed surface of the die. The conducting connecting material is disposed on the exposed metal connections. The plating material is in contact with the conducting connecting material. The insulating material is formed around the conducting connecting material, and the plating material extends to the exterior of the insulating material.
摘要翻译：公开了一种制造半导体封装的半导体封装和方法。半导体封装具有顶面和安装面，并且包括管芯，导电连接材料，电镀材料和绝缘材料。该管芯具有面向半导体封装的安装表面的加工表面。裸露的金属连接位于模具的加工表面。导电连接材料设置在暴露的金属连接上。电镀材料与导电连接材料接触。绝缘材料形成在导电连接材料周围，并且电镀材料延伸到绝缘材料的外部。

7. 发明申请

WO2012061680A3 RELAY NODE INTERFACE RELATED LAYER 2 MEASUREMENTS AND RELAY NODE HANDLING IN NETWORK LOAD BALANCING 审中-公开
标题翻译：在网络负载平衡中继电器节点接口相关第2层测量和继电器节点处理
公开(公告)号：WO2012061680A3
公开(公告)日：2012-11-15
申请号：PCT/US2011059277
申请日：2011-11-04
申请人： INTERDIGITAL PATENT HOLDINGS , LIU KAI , WANG PETER S , TAMAKI NOBUYUKI , STERN-BERKOWITZ JANET A , TERRY STEPHEN E
发明人： LIU KAI , WANG PETER S , TAMAKI NOBUYUKI , STERN-BERKOWITZ JANET A , TERRY STEPHEN E
IPC分类号： H04W24/10
CPC分类号： H04W36/30 , H04W24/10 , H04W36/0094 , H04W36/22 , H04W84/047
摘要： A method for performing radio usage measurements to support radio link operations and/or load balancing may be performed at an evolved Node B (eNB). The method may include determining a first radio usage parameter. The first radio usage parameter may be a measurement of radio usage between an eNB and at least one wireless transmit receive unit (WTRU). The method may further include determining a second radio usage parameter. The second radio usage parameter may be a measurement of radio usage between the eNB and at least one relay node (RN) served by the eNB. The method may further include utilizing at least one of the first radio usage parameter or the second radio usage parameter to evaluate at least one of evolved universal terrestrial radio access (E-UTRA) radio link operations, radio resource management (RRM), network operations and maintenance (OAM), and self-organizing networks (SON) functions or functionalities.
摘要翻译：可以在演进节点B（eNB）处执行用于执行无线电使用测量以支持无线电链路操作和/或负载平衡的方法。该方法可以包括确定第一无线电使用参数。第一无线电使用参数可以是eNB与至少一个无线发射接收单元（WTRU）之间的无线电使用的测量。该方法可以进一步包括确定第二无线电使用参数。第二无线电使用参数可以是eNB与由eNB服务的至少一个中继节点（RN）之间的无线电使用的测量。该方法还可以包括利用第一无线电使用参数或第二无线电使用参数中的至少一个来评估演进的通用陆地无线电接入（E-UTRA）无线电链路操作，无线电资源管理（RRM），网络操作和维护（OAM）以及自组织网络（SON）功能或功能。

8. 发明申请

WO2006086429A3 ACCESS POINT USING DIRECTIONAL ANTENNAS FOR UPLINK TRANSMISSIONS IN A WLAN 审中-公开
标题翻译：使用方向天线的接入点用于WLAN中的上行链路传输
公开(公告)号：WO2006086429A3
公开(公告)日：2007-11-01
申请号：PCT/US2006004363
申请日：2006-02-08
申请人： INTERDIGITAL TECH CORP , LIU KAI , WANG CARL , CHANDRA ARTY , WANG JIN
发明人： LIU KAI , WANG CARL , CHANDRA ARTY , WANG JIN
IPC分类号： H04L12/413 , H04W16/28
CPC分类号： H04W16/28 , H04B7/0695
摘要： An access point receives uplink transmissions from client stations using directional antenna beams. The directional antenna beams are generated by an antenna array. The different directional antenna beams are assigned beam identification numbers, and a preferred antenna beam is selected for each client station. The client stations in the different antenna beam regions initiate their uplink transmissions using assigned backoff slots within the contention window. The access point selects the preferred directional antenna beam corresponding to the directional antenna beams assigned to the backoff slots.
摘要翻译：接入点使用定向天线波束从客户端站接收上行链路传输。定向天线波束由天线阵列产生。不同的定向天线波束被分配波束识别号，并且为每个客户站选择优选的天线波束。不同天线波束区域中的客户端站在竞争窗口内使用分配的退避时隙来发起其上行链路传输。接入点选择对应于分配给退避时隙的定向天线波束的优选定向天线波束。

9. 发明申请

WO2008098557A3 PROTECTIVE ELEMENT 审中-公开
标题翻译： SCREEN
公开(公告)号：WO2008098557A3
公开(公告)日：2008-11-13
申请号：PCT/DE2008000231
申请日：2008-02-11
申请人： YOTRIO GROUP CO LTD , LIU KAI
发明人： LIU KAI
IPC分类号： A45B23/00
CPC分类号： A45B23/00 , A45B17/00 , A45B19/04 , A45B2023/0012 , A45B2023/0037 , A45B2023/0075 , A45B2023/0081 , A45B2025/146
摘要： The invention relates to a protective element, especially a suspended protective element for using as a parasol or an umbrella, comprising a vertical pole (1), a protective cover element (4), and a holding structure connected to the vertical pole (1). The holding structure is rotatably mounted in relation to the vertical pole (1), and the rotational axis of the support extends at least approximately parallel to the longitudinal axis of the vertical pole (1).
摘要翻译：在一个屏幕上，特别是壁挂式或遮阳用作太阳或雨伞，带支架桅杆（1），罩盖（4）和一个与固定桅杆（1）连接到支撑结构，用于罩盖（4），相对所述支撑结构所述支架（1）可旋转地安装，其中所述轴承的所述旋转轴线至少大致平行于所述支柱（1）的所述纵向轴线延伸。

10. 发明申请

WO2013116045A3 TARGETED DELIVERY OF CONTENT 审中-公开
标题翻译：目标交付内容
公开(公告)号：WO2013116045A3
公开(公告)日：2015-06-04
申请号：PCT/US2013022588
申请日：2013-01-22
申请人： LIU KAI , SMITH JOHN D , TAKAYA NORIFUMI , TAO DAVID , SONY CORP
发明人： LIU KAI , SMITH JOHN D , TAKAYA NORIFUMI , TAO DAVID
IPC分类号： H04N7/18 , G06Q30/00
CPC分类号： H04N21/25891 , H04N21/458 , H04N21/4788
摘要： A targeted delivery of content and related metadata is made to users of various types of electronic devices that are adapted to render or play the content. Images of each user are captured at various times while various items of the content are being played. According to one embodiment the images are processed via one or more facial recognition algorithms so that the identity of each of the users, including their names, is determined. This data is stored in a central server thereby establishing a database of profiles of these users. The profiles are comprised of tracking information of content played by each of the users on a per-content basis. The central server either uses this tracking information directly or transmits it to another server or another business entity, such as for example another content provider, for use by the other business entity.
摘要翻译：对适于呈现或播放内容的各种类型的电子设备的用户进行内容和相关元数据的有针对性的传送。每个用户的图像在不同时间被捕获，同时正在播放各种内容。根据一个实施例，通过一个或多个面部识别算法处理图像，使得确定每个用户的身份，包括其姓名。该数据被存储在中央服务器中，从而建立这些用户的配置文件的数据库。简档由每个内容基础上由每个用户播放的内容的跟踪信息组成。中央服务器可以直接使用该跟踪信息或将其发送到另一个服务器或其他业务实体，例如另一个内容提供商，供其他业务实体使用。

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