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    • 5. 发明申请
    • METHOD FOR REDUCING PATTERN DEFORMATION AND PHOTORESIST POISONING IN SEMICONDUCTOR DEVICE FABRICATION
    • 减少半导体器件制造中的图案变形和光致变色中毒的方法
    • WO2004012246A3
    • 2004-05-13
    • PCT/US0323746
    • 2003-07-29
    • ADVANCED MICRO DEVICES INC
    • BONSER DOUGLAS JPLAT MARINA VYANG CHIH YUHBELL SCOTT ACHAN DARIN AFISHER PHILIP ALYONS CHRISTOPHER FCHANG MARK SGAO PEI-YUANWRIGHT MARILYN IYOU LUDAKSHINA-MURTHY SRIKANTESWARA
    • H01L21/28H01L21/033H01L21/3065H01L21/3213H01L29/78
    • H01L21/32139H01L21/0332
    • A hardmask stack is comprised of alternating layers of doped amorphous carbon (22) and undoped amorphous carbon (20). The undoped amorphous carbon layers (20) serve as buffer layers that constrain the effects of compressive stress within the doped amorphous carbon layers (22) to prevent delamination. The stack is provided with a top capping layer (12). The layer beneath the capping layer (12) is preferably undoped amorphous carbon to reduce photoresist poisoning. An alternative hardmask stack is comprised of alternating layers of capping material (42) and amorphous carbon (40). The amorphous carbon layers (40) may be doped or undoped. The capping material layers (42) serve as buffer layers that constrain the effects of compressive stress within the amorphous carbon layers (40) to prevent delamination. The top layer of the stack is formed of a capping material (42). The layer beneath the top layer is preferably undoped amorphous carbon (40) to reduce photoresist poisoning. The lowest layer of the hardmask stack is preferably amorphous carbon (40) to facilitate easy removal of the hardmask stack from underlyingmaterials(8) by an ashing process.
    • 硬掩模叠层由掺杂的无定形碳(22)和未掺杂的无定形碳(20)的交替层组成。 未掺杂的无定形碳层(20)用作缓冲层,其限制掺杂的无定形碳层(22)内的压缩应力的影响以防止分层。 该堆叠具有顶部封盖层(12)。 覆盖层(12)下方的层优选为未掺杂的无定形碳以减少光致抗蚀剂中毒。 替代的硬掩模堆叠由交替的封盖材料(42)和无定形碳(40)层组成。 无定形碳层(40)可以是掺杂的或不掺杂的。 封盖材料层(42)用作缓冲层,其限制无定形碳层(40)内的压缩应力的影响以防止分层。 堆叠的顶层由封盖材料(42)形成。 顶层下方的层优选为未掺杂的无定形碳(40)以减少光致抗蚀剂中毒。 硬掩模堆叠的最下层优选为无定形碳(40),以便于通过灰化工艺容易地从底层材料(8)移除硬掩模堆叠。