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    • 5. 发明申请
    • PHOTOMASK HAVING AN INTERNAL SUBSTANTIALLY TRANSPARENT ETCH STOP LAYER
    • 具有内部超大型透明蚀刻层的光刻胶
    • WO2005036264A3
    • 2009-04-16
    • PCT/US2004029452
    • 2004-09-09
    • PHOTRONICS INC
    • MARTIN PATRICK MLASSITER MATTHEWTAYLOR DARRENCANGEMI MICHAELPOORTINGA ERIC
    • G03F9/00G03C5/00G03F20060101G03F1/00G03F1/08
    • G03F1/84G03F1/32G03F1/76
    • The present invention generally relates to optical lithography and more particularly relates to the fabrication of transparent or semitransparent phase shifting masks used in the manufacture of semiconductor devices. In particular, the present invention utilizes an internal etch stop layer and either a deposited substantially transparent layer, deposited partially transparent layer or deposited opaque thereon in an otherwise conventional photomask. The photomask of the present invention is used to make semiconductor devices or intergated circuits. In a preferred embodiment of the present invention is directed to an aaPSM comprising: a patterned opaques layer with a first set of at least one light transmitting openings and a second set of a at least one light transmitting openings; a deposited substantially transparent layer underlying the opaque layer wherein the deposited substantially transparent layer has corresponding light transmitting openings to each of the openings of the first set of at least one light transmitting openings, a substantially transparent etch stop layer underlying the deposited substantially transparent layer, and a subtantially transparent substrate underlying the transparent etch stop layer. In a prefered embodiment, the internal substantially transparent etch stop layer of the present invention is comprised of MgFx and even more particularly may be comprised of MgF2 depostied under evaporation. Other materials that may be used for the substantially transparent etch stop layer of the present invention include but are not limited to Al2O3 and AlxNy.
    • 本发明一般涉及光学光刻术,更具体地说涉及制造用于制造半导体器件的透明或半透明相移掩模。 特别地,本发明利用内部蚀刻停止层和沉积的基本上透明的层,沉积的部分透明的层或在其它常规光掩模中沉积的不透明的层。 本发明的光掩模用于制造半导体器件或隔离电路。 在本发明的优选实施例中,涉及aaPSM,其包括:具有至少一个透光开口的第一组的第一组透明开口的第二组的图案化的白浊层; 在不透明层下面沉积的基本上透明的层,其中沉积的基本上透明的层具有到第一组至少一个透光开口的每个开口的对应的透光开口,沉积的基本上透明的层下面的基本上透明的蚀刻停止层, 以及在透明蚀刻停止层下方的基本透明的基底。 在优选的实施方案中,本发明的内部基本上透明的蚀刻停止层由MgF x组成,甚至更特别地可以由在蒸发下还原的MgF 2组成。 可用于本发明的基本上透明的蚀刻停止层的其它材料包括但不限于Al 2 O 3和Al x N y。
    • 6. 发明申请
    • PHOTOMASK HAVING AN INTERNAL SUBSTANTIALLY TRANSPARENT ETCH STOP LAYER
    • PHOTOMASK具有内部基本透明蚀刻停止层
    • WO2005036264A8
    • 2005-08-04
    • PCT/US2004029452
    • 2004-09-09
    • PHOTRONICS INC
    • MARTIN PATRICK MLASSITER MATTHEWTAYLOR DARRENCANGEMI MICHAELPOORTINGA ERIC
    • G03F20060101G03F1/00G03F1/08G03F
    • G03F1/84G03F1/32G03F1/76
    • The present invention generally relates to optical lithography and more particularly relates to the fabrication of transparent or semitransparent phase shifting masks used in the manufacture of semiconductor devices. In particular, the present invention utilizes an internal etch stop layer and either a deposited substantially transparent layer, deposited partially transparent layer or deposited opaque thereon in an otherwise conventional photomask. The photomask of the present invention is used to make semiconductor devices or intergated circuits. In a preferred embodiment of the present invention is directed to an aaPSM comprising: a patterned opaques layer with a first set of at least one light transmitting openings and a second set of a at least one light transmitting openings; a deposited substantially transparent layer underlying the opaque layer wherein the deposited substantially transparent layer has corresponding light transmitting openings to each of the openings of the first set of at least one light transmitting openings, a substantially transparent etch stop layer underlying the deposited substantially transparent layer, and a subtantially transparent substrate underlying the transparent etch stop layer. In a prefered embodiment, the internal substantially transparent etch stop layer of the present invention is comprised of MgFx and even more particularly may be comprised of MgF2 depostied under evaporation. Other materials that may be used for the substantially transparent etch stop layer of the present invention include but are not limited to Al2O3 and AlxNy.
    • 本发明一般涉及光学光刻,更具体地涉及用于制造半导体器件的透明或半透明相移掩模的制造。 特别地,本发明利用内部蚀刻停止层和沉积的基本上透明的层,沉积的部分透明层或在其他常规光掩模上沉积的不透明层。 本发明的光掩模用于制造半导体器件或集成电路。 在本发明的优选实施例中,涉及一种aaPSM,其包括:具有第一组至少一个光透射开口和第二组至少一个光透射开口的图案化不透明层; 在不透明层下面的沉积的基本上透明的层,其中沉积的基本上透明的层具有对应于第一组至少一个透光开口的每个开口的对应光透射开口,在沉积的基本透明层下面的基本上透明的蚀刻停止层, 以及位于透明蚀刻停止层下方的基本上透明的衬底。 在一个优选的实施方案中,本发明的内部基本上透明的蚀刻停止层由MgFx组成,并且甚至更具体地可以由在蒸发下沉积的MgF 2组成。 可以用于本发明的基本上透明的蚀刻停止层的其他材料包括但不限于Al 2 O 3和Al x N y。
    • 9. 发明申请
    • 디지털 마이크로미러 디바이스 제어기 및 그의 노광 이미지 출력 처리 방법
    • 数字微镜设备控制器和曝光图像输出处理方法
    • WO2017030318A1
    • 2017-02-23
    • PCT/KR2016/008812
    • 2016-08-10
    • 주식회사 에스디에이
    • 임창민심상범문영성
    • G03F7/20G03F9/00G03F1/76
    • G03F1/76G03F7/20G03F9/00
    • 일실시예는 관리 컨트롤러로부터 전송받은 노광할 이미지를 저장하는 저장부, 상기 노광할 이미지의 디지털 마이크로미러 디바이스 출력 처리를 전체 제어하는 메인 제어부 및, 상기 메인 제어부의 제어하에, 싱크 컨트롤러의 트리거 신호에 따라 상기 노광 스테이지 위치 변화에 상응하여 상기 노광할 이미지를 이동해서, DMD로의 노광 이미지 출력을 처리하는 노광 이미지 매니저를 포함하고, 상기 노광할 이미지는 노광 스테이지나 마스크 필름을 메모리에 가상화하여 구현할 해상도의 메모리 비트 셀(Bit Cell)로 모델링화한 가상 프레임으로 생성하여 된 것이며, 상기 노광 이미지 매니저는 상기 생성된 가상 프레임을 노광할 이미지로 사용해서, 노광 이미지 출력을 처리하는 디지털 마이크로미러 디바이스 제어기 및 그의 노광 이미지 출력 처리 방법에 관한 것으로, 일정 픽셀 크기를 가진 디스플레이 장치에 정밀 미세 패턴을 구현하고, 노광 스테이지와 노광할 이미지 간 실시간 동기화도 이루어진다.
    • 实施例涉及数字微镜器件(DMD)控制器及其曝光图像输出处理方法。 DMD控制器包括:存储单元,用于存储从管理控制器接收的用于曝光的图像; 主控制单元,用于控制用于曝光图像的数字微镜装置的总体输出处理; 以及曝光图像管理器,其在主控制单元的控制下,根据吸收控制器的触发信号响应曝光阶段的位置变化而移动用于曝光的图像,并通过一个 DMD。 生成用于曝光的图像作为虚拟框架,曝光阶段或掩模膜在存储器中被虚拟化,并以要实现的分辨率建模为存储位单元。 曝光图像管理器使用所生成的虚拟帧作为曝光图像并处理曝光图像的输出。 在具有一定像素尺寸的显示装置上实现了详细的精细图案,并且实现了曝光台和用于曝光的图像之间的实时同步。