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    • 1. 发明申请
    • METHOD AND APPARATUS FOR CONTROLLING NUCLEATION IN SELF-ASSEMBLED FILMS
    • 用于控制自组装膜中的核的方法和装置
    • WO2007001294A8
    • 2008-05-08
    • PCT/US2005022659
    • 2005-06-28
    • UNIV CALIFORNIAXIE YA-HONG
    • XIE YA-HONG
    • B05D3/02
    • B05D3/0218B05D1/185B05D1/208B05D3/0254B05D3/10B82Y30/00B82Y40/00G03F7/0002Y10T156/17
    • A method of forming a self-assembled film with periodic nanometer dimension features (e.g., holes) on a substrate includes the steps of providing film precursors on the substrate, wherein the film precursors are maintained in an amorphous state. Where the film precursors are block copolymers, a heating member is provided. The substrate and the heating member are then moved relative to one another so as to raise the temperature of a portion of the film precursor on the substrate above its glass transition temperature. Relative movement between the substrate and heating member continues until a self-assembled crystalline film is formed over the surface of the substrate. In an alternative embodiment, a pH dispensing member is provided to dispense a pH adjusting agent onto the substrate that promotes self-assembly of a crystalline film.
    • 在衬底上形成具有周期性纳米尺寸特征(例如,孔)的自组装膜的方法包括在衬底上提供膜前体的步骤,其中膜前体保持在非晶状态。 当膜前体是嵌段共聚物时,提供加热构件。 然后使衬底和加热构件相对于彼此移动,以便将衬底上的膜前体的一部分的温度升高到其玻璃化转变温度以上。 基板和加热部件之间的相对运动继续进行,直到在基板的表面上形成自组装的晶体膜。 在替代实施例中,提供pH分配构件以将pH调节剂分配到促进结晶膜自组装的衬底上。
    • 2. 发明申请
    • SPIN INJECTION DEVICE HAVING SEMICONDCUTOR-FERROMAGNETIC-SEMICONDUCTOR STRUCTURE AND SPIN TRANSISTOR
    • 具有半导体 - 反射 - 半导体结构和旋转晶体管的旋转注入装置
    • WO2008005856A2
    • 2008-01-10
    • PCT/US2007/072521
    • 2007-06-29
    • THE REGENTS OF THE UNIVERSITY OF CALIFORNIAXIE, Ya-Hong
    • XIE, Ya-Hong
    • H01L29/40
    • H01L29/66984Y10S977/935
    • A spin injection device and spin transistor including a spin injection device. A spin injection device includes different semiconductor materials and a spin-polarizing ferromagnetic material there between. The semiconductor materials may have different crystalline structures, e.g., a first material can be polycrystalline or amorphous silicon, and a second material can be single crystalline silicon. Charge carriers are spin-polarized when the traverse the spin-polarizing ferromagnetic material and injected into the second semiconductor material. A Schottky barrier height between the first semiconductor and ferromagnetic materials is larger than a second Schottky barrier height between the ferromagnetic and second semiconductor materials. A spin injection device may be a source of a spin field effect transistor.
    • 一种自旋注入装置和包括自旋注入装置的自旋晶体管。 自旋注入装置包括不同的半导体材料和其间的自旋极化铁磁材料。 半导体材料可以具有不同的结晶结构,例如,第一材料可以是多晶或非晶硅,第二材料可以是单晶硅。 当穿过自旋极化铁磁材料并注入到第二半导体材料中时,电荷载体是自旋极化的。 第一半导体和铁磁材料之间的肖特基势垒高度大于铁磁和第二半导体材料之间的第二肖特基势垒高度。 自旋注入装置可以是自旋场效应晶体管的源。
    • 8. 发明申请
    • METHOD FOR CONTROLLING DISLOCATION POSITIONS IN SILICON GERMANIUM BUFFER LAYERS
    • 用于控制硅锗缓冲层中的位移位置的方法
    • WO2007018495A3
    • 2007-12-13
    • PCT/US2005026364
    • 2005-07-25
    • UNIV CALIFORNIAXIE YA-HONGYOON TAE-SIK
    • XIE YA-HONGYOON TAE-SIK
    • H01L21/20H01L21/36H01L21/76
    • H01L29/1054B82Y10/00H01L21/26506H01L21/26533H01L21/266H01L2924/0002H01L2924/00
    • A method for controlling dislocation position in a silicon germanium buffer layer located on a substrate includes depositing a strained silicon germanium layer on the substrate and irradiating one or more regions of the silicon germanium layer with a dislocation inducing agent. The dislocation inducing agent may include ions, electrons, or other radiation source. Dislocations in the silicon germanium layer are located in one or more of the regions. The substrate and strained silicon germanium layer may then be subjected to an annealing process to transform the strained silicon germanium layer into a relaxed state. A top layer of strained silicon or silicon germanium may be deposited on the relaxed silicon germanium layer. Semiconductor-based devices may then be fabricated in the non-damaged regions of the strained silicon or silicon germanium layer. Threading dislocations are confined to damaged areas which may be transformed into SiO 2 isolation regions.
    • 用于控制位于衬底上的硅锗缓冲层中的位错位置的方法包括在衬底上沉积应变硅锗层并用位错诱导剂照射硅锗层的一个或多个区域。 位错诱导剂可以包括离子,电子或其它辐射源。 硅锗层中的位错位于一个或多个区域中。 然后可以对衬底和应变硅锗层进行退火处理,以将应变硅锗层转变成松弛状态。 应变硅或硅锗的顶层可沉积在松散的硅锗层上。 然后可以在应变硅或硅锗层的未损坏区域中制造基于半导体的器件。 穿透位错限于可能转化为SiO 2隔离区的损坏区域。