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    • 1. 发明申请
    • ELECTRONIC DEVICE IN PLASTIC
    • 塑料电子设备
    • WO2012054960A1
    • 2012-05-03
    • PCT/AU2011/001288
    • 2011-10-07
    • GRIFFITH UNIVERSITYTHIEL, DavidNEELI, Madhusudan
    • THIEL, DavidNEELI, Madhusudan
    • H01L27/12H01L23/42H05K1/18
    • H05K1/0204H01L23/5389H01L24/19H01L24/96H01L2223/6677H01L2924/12042H01L2924/3025H05K1/185H05K3/0014H05K3/0064H05K2201/0129H05K2203/0108H05K2203/1469H01L2924/00
    • The invention concerns a method for forming an electronic device in plastic. The method for forming an electronic device in plastic comprises: (a) placing electronic components (220, 215) in recesses (210, 215) in a thermoplastic substrate (200); (b) depositing (135) an electronic circuit (230) over the electronic components (220, 225), or onto a thermoplastic sheet (240); and (c) bonding (160) the thermoplastic substrate (200) with the thermoplastic sheet (240) in a thermal bonding process to seal the electronic components (220, 215) and the electronic circuit (230) between the thermoplastic substrate (200) and the thermoplastic sheet (240), wherein the method further comprises providing a thermally conductive layer (250) on the thermoplastic sheet (240) and/or substrate (200) such that heat applied during the thermal bonding process is distributed uniformly across the thermoplastic sheet (240) and/or substrate (200) to facilitate bonding of the thermoplastic sheet (240) and substrate (200). In another aspect, the invention concerns an electronic device formed according to the method. It is an advantage that a more uniform heat distribution is achieved.
    • 本发明涉及用塑料形成电子装置的方法。 用于在塑料中形成电子器件的方法包括:(a)将电子部件(220,215)放置在热塑性基底(200)中的凹槽(210,215)中; (b)将电子电路(230)沉积在电子部件(220,225)上方或热塑性片材(240)上; 和(c)在热粘合工艺中将热塑性基材(200)与热塑性片材(240)粘合(160)以密封热塑性基材(200)之间的电子部件(220,215)和电子电路(230) 和所述热塑性片材(240),其中所述方法还包括在所述热塑性片材(240)和/或基底(200)上提供导热层(250),使得在热粘合过程期间施加的热量均匀地分布在热塑性塑料片材 片材(240)和/或基底(200),以便于热塑性片材(240)和基底(200)的粘接。 另一方面,本发明涉及根据该方法形成的电子设备。 实现更均匀的热分布是有利的。
    • 6. 发明申请
    • A PHASE SHIFT KEYING AND PHASE MODULATION TRANSMISSION SYSTEM
    • 相移键控和相位调制传输系统
    • WO1985002966A1
    • 1985-07-04
    • PCT/AU1984000262
    • 1984-12-19
    • GRIFFITH UNIVERSITYTHIEL, David, V.
    • GRIFFITH UNIVERSITY
    • H04L27/18
    • H04L27/2272H03D3/241H04L27/2046
    • A PSK and phase modulation transmission system has a modulator and a demodulator. The modulator has a carrier frequency generator (21) coupled to a voltage controlled phase shifter (22). The modulation of the signal in the shifter (22) is controlled by modulation voltage generator (23). A transmitter (24) receives the output from the shifter (22) and transmits the modulated signal. The demodulator (30) includes a receiver section (31) for receiving the signal transmitted by the transmitter (24). The receiver (31) is coupled to a modified phase locked loop comprising a phase detector (32), a low pass filter (33), a sample and a hold circuit (34) and a voltage controlled oscillator (35). A lock control circuit (36) receives either the output from the receiver (31) or the output from the filter (33) to produce a lock in pulse from changes in the received signal or changes in the demodulated signal at the filter (33) for controlling the sample and hold circuit (34).
    • PSK和相位调制传输系统具有调制器和解调器。 调制器具有耦合到电压控制移相器(22)的载波频率发生器(21)。 移位器(22)中的信号的调制由调制电压发生器(23)控制。 发送器(24)接收来自移位器(22)的输出并发送调制信号。 解调器(30)包括用于接收由发射机(24)发射的信号的接收机部分(31)。 接收器(31)耦合到修改的锁相环,包括相位检测器(32),低通滤波器(33),采样和保持电路(34)和压控振荡器(35)。 锁定控制电路(36)接收来自接收器(31)的输出或来自滤波器(33)的输出,以产生来自接收信号的变化的脉冲锁定或滤波器(33)处的解调信号的变化, 用于控制采样和保持电路(34)。