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    • 2. 发明申请
    • PHOTOLITHOGRAPHIC MASK
    • 光刻掩膜
    • WO0241076A3
    • 2003-01-03
    • PCT/DE0104263
    • 2001-11-14
    • INFINEON TECHNOLOGIES AGGRIESINGER UWEHENNIG MARIOKNOBLOCH JUERGENPFORR RAINERVORWERK MANUEL
    • GRIESINGER UWEHENNIG MARIOKNOBLOCH JUERGENPFORR RAINERVORWERK MANUEL
    • G03F1/00G03F1/36G03F7/20H01L21/027G03F1/14
    • G03F7/70441G03F1/29G03F7/70433
    • According to the invention, auxiliary openings (2) are allocated to the openings (1) on a mask which are to be transferred onto a wafer. Said auxiliary openings have a phase shifting characteristic of preferably between 160 DEG and 200 DEG in relation to the openings (1), as well as a cross-section which is less than the limit dimension (31) for the printing of the projection device, so that the auxiliary openings (2) themselves cannot be printed onto the wafer. At the same time, however, they strengthen the contrast of the aerial image of an associated insulated or semi-insulated opening (1) on the wafer in particular. According to one form of embodiment, the distance of the auxiliary openings (2) from the opening (1) is greater than the resolution limit of the projection device, the opening being less than the coherence length of the light used for projection. The effect of the auxiliary openings consists of the phase-related use of the optical proximity effect. If the auxiliary openings (2) are arranged in a preferred direction, this effect can be used on quadratic openings (1) on the mask to produce elliptic structures (1') on a wafer. The result is a considerable widening of the process window for the projection of substrate contacting planes onto a wafer.
    • 在掩模上的晶片上要传送开口(1)与辅助开口相关联的(2)。 这些具有优选为160°至200℃底层相移特性相对于所述孔(1)之间,以及一个位于该投影装置的横截面(21)的打印的限制尺寸(31)下方,使得辅助开口(2)本身不将 晶圆是geprintet。 同时提高了空间像的对比度,特别是相关联的晶片上的绝缘或半绝缘的开口(1)。 在一个实施例中,辅助开口(2)具有一个位于上述从开口(1)的投影装置的距离的分辨率极限,但其比用于投影的光的相干长度小。 它们的作用是在光学邻近效应的相位相关的利用率,从而可以在掩模在正方形开口的晶片上产生椭圆结构(1“)设定在一个优选的方向上的辅助开口(2)当被利用(1)。 其结果是在投影,特别Substratkontaktierungsebenen到晶片上的处理窗口的显著放大图。
    • 4. 发明申请
    • METHOD AND SYSTEM FOR PHOTOLITHOGRAPHY
    • 用于光刻技术的方法和系统
    • WO2006133729A1
    • 2006-12-21
    • PCT/EP2005/006560
    • 2005-06-17
    • INFINEON TECHNOLOGIES AGPFORR, RainerHENNIG, Mario
    • PFORR, RainerHENNIG, Mario
    • G03F7/20G02B5/20
    • G02B5/205G03F7/7015G03F7/70191G03F7/70625
    • The invention relates to a method for photolithography. Further the invention relates to a system for photolithography. A transparent optical element in a region between a photo mask (10) and a light source (14) of a photolithographic apparatus (5) is provided having a plurality of attenuating elements (60) being arranged in accordance with a first intensity correction function. The first intensity correction function is calculated from variations of characteristic features sizes (50) of structural elements (54) of a resist pattern (20) as compared to the nominal values (42) of structural elements of a layout pattern (40). The variations of the characteristic features sizes are divided into a first contribution being associated with the photolithographic apparatus (5) and into a second contribution being associated with the photo mask (10).
    • 本发明涉及一种光刻方法。 此外,本发明涉及一种用于光刻的系统。 在光刻设备(5)的光掩模(10)和光源(14)之间的区域中设置有根据第一强度校正功能布置的多个衰减元件(60)的透明光学元件。 与布局图案(40)的结构元件的标称值(42)相比,从抗蚀剂图案(20)的结构元件(54)的特征特征尺寸(50)的变化计算第一强度校正函数。 特征特征尺寸的变化被分成与光刻设备(5)相关联的第一贡献,并分成与光掩模(10)相关联的第二贡献。
    • 7. 发明申请
    • PHASE SHIFTING MASK
    • 相SLIDE MASK
    • WO03054627A2
    • 2003-07-03
    • PCT/DE0204321
    • 2002-11-25
    • INFINEON TECHNOLOGIES AGHENNIG MARIOKOEHLE RODERICKKUNKEL GERHARDPFORR RAINERVOIGT INA
    • HENNIG MARIOKOEHLE RODERICKKUNKEL GERHARDPFORR RAINERVOIGT INA
    • G03F1/00G03F1/14
    • G03F1/30
    • The invention relates to a phase shifting mask (8) having symmetrical structures (1, 2) for the production of adjacent pairs (5) of structures (1', 2') on a semiconductor wafer (9), such as pairs of trench capacitors for memory modules, the structures (1, 2) inside the pair having a phase deviation difference of 180 DEG in relation to each other. The dimensions of the structures at the limit of resolution of the lighting system enable the influence of lens aberrations on the difference in line width created between the right and the left to be reduced. The invention also relates to a method for producing the structures (1', 2') on the wafer (9), consisting of a step in which the phase attribution to the right structure (2) or left structure (1) is selected according to the sign of the difference in line width when said difference is measured without phase attribution, using the same lighting system.
    • 在一个相位罩(8)具有对称结构(1,2)用于制备接近半导体晶片(9),在结构上的相互对置的对(5)(1”,2' ),诸如对于具有结构的存储器器件严重电容器对(1,2) 该对对180°的彼此Phasenhubunterschied内。 当躺在由透镜像差的影响的曝光系统结构的尺寸的分辨率极限降低到所得到的左右线宽差。 一种用于结构的晶片(9)的制备(1”,2' )的过程包括选择(2)或左结构(1),这取决于线的符号宽度差的权利,相位指定的demn步骤的使用时 没有相位分配相同的成像系统被测量。