会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明申请
    • PHOTOMASK INCLUDING HARDENED PHOTORESIST
    • 照片包括硬化电影
    • WO01040877A1
    • 2001-06-07
    • PCT/US2000/027478
    • 2000-10-04
    • G03F1/00G03F9/00
    • G03F1/29G03F1/56
    • A method for fabricating a photomask processes photoresist on the photomask into a hardened material that is not stripped off but rather becomes an optical and structural component of the photomask. As such, the photoresist optically defines the dimension of critical features. This eliminates the dimensional uncertainty that arises from etching of underlying opaque materials such as chrome. The photoresist's thickness and optical transmission can be selected to allow a phase shift of transmitted light so that the photomask is a phasemask. The hardened photomask can be formed directly on a transparent substrate, for example, using optical pattern generation, without an intervening opaque material between the photoresist and the substrate.
    • 用于制造光掩模的方法将光掩模上的光致抗蚀剂处理成不被剥离的硬化材料,而是变成光掩模的光学和结构部件。 因此,光致抗蚀剂光学地限定关键特征的尺寸。 这消除了由诸如铬等不透明材料的蚀刻引起的尺寸不确定性。 可以选择光致抗蚀剂的厚度和光透射率以允许透射光的相移,使得光掩模是相位掩模。 硬化的光掩模可以直接形成在透明基板上,例如使用光学图案生成,而在光致抗蚀剂和基板之间没有中间的不透明材料。
    • 6. 发明申请
    • TRIMMING MASK WITH SEMITRANSPARENT PHASE-SHIFTING REGIONS
    • 具有半透明相移区域的修剪面膜
    • WO01025852A1
    • 2001-04-12
    • PCT/EP2000/009811
    • 2000-10-06
    • G03F1/00G03F7/20H01L21/027
    • G03F1/29G03F1/32G03F1/34G03F1/70G03F7/2026G03F7/70466
    • For lithographically producing the smallest structures at less than the exposure wavelengths in semiconductor fabrication, a double exposure is carried out using a thick phase mask and a trimming mask, the trimming mask further structures the phase-contrast lines produced by the phase mask. Besides transparent or opaque regions, the trimming mask also has phase-shifting regions. These surround transparent regions of the trimming mask through which the phase-contrast lines produced by the first mask are locally re-exposed, that is to say interrupted. The intensity profile of successive line sections is especially rich in contrast through the addition of the phase-shifting partially trasparent regions on the second mask; the distances between the line sections can be reduced. The trimming mask, otherwise used only for larger structures, is therefor suitable for the configuration of the finest dimensionally critical structures.
    • 为了在半导体制造中以小于曝光波长的方式平版印刷产生最小结构,使用厚相掩模和修剪掩模进行双重曝光,修整掩模进一步构成由相位掩模产生的相位对比线。 除了透明或不透明区域之外,修整掩模还具有相移区域。 这些环绕着修整掩模的透明区域,由第一掩模产生的相位对应线通过该区域被局部再暴露,也就是说被中断。 通过在第二掩模上添加相移部分透明区域,连续线段的强度分布特别丰富; 可以减少线路部分之间的距离。 修剪面罩,否则仅用于较大的结构,适用于最精细的尺寸关键结构的配置。
    • 7. 发明申请
    • DIFFERENTIAL ALTERNATING PHASE SHIFT MASK OPTIMIZATION
    • 差分替换相位移屏蔽优化
    • WO2006078908A2
    • 2006-07-27
    • PCT/US2006/002046
    • 2006-01-20
    • INTERNATIONAL BUSINESS MACHINES CORPORATIONLIEBERMANN, Lars WBAUMN, Zachary
    • LIEBERMANN, Lars WBAUMN, Zachary
    • G06F17/50G03F1/00
    • G03F1/30G03F1/29
    • A method of mask design comprises creating a first mask design by aligning mask resolution enhancement technology (RET) features, such as alternating phase shifting regions or sub-resolution assist features, with critical width segments of the integrated circuit design, such that the first mask design meets manufacturability design rules, and creating a second mask design by aligning RET features with the critical width segments of the integrated circuit design, such that the second mask design meets lithographic design rules in regions local to the critical width segments. Features of the second mask design are identified that violate the manufacturability design rules, and then a third mask design is created, derived from the second mask design wherein the features of the second mask design that violate the manufacturability rules are selectively replaced by features from the first mask design so that the third mask design meets the manufacturability design rules.
    • 掩模设计的方法包括通过将掩模分辨率增强技术(RET)特征(例如交替相移区域或子分辨率辅助特征)与集成电路设计的关键宽度段对准来创建第一掩模设计,使得第一掩模 设计符合可制造性设计规则,并通过将RET特征与集成电路设计的关键宽度段对齐来创建第二掩模设计,使得第二掩模设计满足临界宽度段局部区域中的光刻设计规则。 识别出第二掩模设计的特征违反了可制造性设计规则,然后从第二掩模设计得出第三掩模设计,其中第二掩模设计的违反可制造性规则的特征被选择性地被来自 第一个面膜设计,使第三个面膜设计符合可制造性设计规则。
    • 8. 发明申请
    • 位相シフトマスクの製造方法
    • 生产相移屏障的方法
    • WO2005017621A1
    • 2005-02-24
    • PCT/JP2004/011712
    • 2004-08-09
    • HOYA株式会社須田 秀喜
    • 須田 秀喜
    • G03F1/08
    • G03F1/29
    • In a first step, an etching mask layer (3a) and a light-shielding film (2) are etched to form an etching mask layer (3a) consisting of a main opening (5) and auxiliary openings (6), and a light-shielding film pattern (2a). Then, in a second step, impression etching of a transparent substrate (formation of a substrate impressed section (8)) is effected, and in a final third step, the etching mask layer (3a) is removed. Thereby, since the main and auxiliary openings can be simultaneously exposed to light in the first step, the accuracy of positioning of them is improved. Further, the etching mask layer (3a), which is damaged in the second step, is removed in the third step. That is, the etching mask layer (3a) can protect the light-shielding film pattern (2a), thus preventing the light-shielding film pattern (2a) from being damaged.
    • 在第一步骤中,蚀刻蚀刻掩模层(3a)和遮光膜(2),以形成由主开口(5)和辅助开口(6)构成的蚀刻掩模层(3a) (2a)。 然后,在第二步骤中,进行透明基板的印模蚀刻(形成基板印刷部分(8)),并且在最后的第三步骤中,去除蚀刻掩模层(3a)。 因此,由于在第一步骤中可以同时暴露主要和辅助开口,所以它们的定位精度得以提高。 此外,在第三步中除去在第二步骤中损坏的蚀刻掩模层(3a)。 也就是说,蚀刻掩模层(3a)可以保护遮光膜图案(2a),从而防止遮光膜图案(2a)被损坏。
    • 10. 发明申请
    • PHASE SHIFT MASKING FOR COMPLEX PATTERNS
    • 复杂模式的相位移位掩码
    • WO02003140A1
    • 2002-01-10
    • PCT/US2000/042284
    • 2000-11-28
    • G03F1/00G03F1/26G03F1/36H01L21/027G03F1/14
    • G03F1/26G03F1/29G03F1/30G03F1/70
    • Techniques are provided for extending the use of phase shift techniques to implementation of masks used for complex layouts in the layers of integrated circuits, beyond selected critical dimension features such as transistors gates to which such structures have been limited in the past. The method includes identifying features for which phase shifting can be applied, automatically mapping the phase shifting regions for implementation of such features, resolving phase conflicts which might occur according to a given design rule, and application of sub-resolution assist features within phase shift regions and optical proximity correction features to phase shift regions. Both opaque field phase shift masks and complementary binary masks defining interconnect structures and other types of structures that are not defined using phase shiftting, necessary for completion of the layout of the layer are produced.
    • 提供的技术用于将相移技术的使用扩展到集成电路层中用于复杂布局的掩模的实现,超出了过去已经限制了这种结构的所选临界尺寸特征,例如晶体管栅极。 该方法包括识别可以对其进行相移的特征,自动映射用于实现这些特征的相移区域,解决根据给定设计规则可能发生的相位冲突,以及在相移区域内应用子分辨率辅助特征 和光学邻近校正特征到相移区域。 产生不完整的场相移掩模和定义互连结构的互补二进制掩模和不是使用相移定义的其它类型的结构,这是完成层的布局所必需的。