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1. 发明申请

WO2012136210A2 COOLING SYSTEM FOR A POWER MODULE 审中-公开
标题翻译：电源模块冷却系统
公开(公告)号：WO2012136210A2
公开(公告)日：2012-10-11
申请号：PCT/DK2012000032
申请日：2012-04-02
申请人： DANFOSS DRIVES AS , OLESEN KLAUS , HOLST JOERGEN , FOESEL GEORG , BRANDT PETER , JENSEN PETER , HORNSLETH STEEN , ROTHMANN CARSTEN
发明人： OLESEN KLAUS , HOLST JOERGEN , FOESEL GEORG , BRANDT PETER , JENSEN PETER , HORNSLETH STEEN , ROTHMANN CARSTEN
IPC分类号： H05K7/20
CPC分类号： F25B39/04 , H05K7/20309 , H05K7/20936
摘要： A cooling system for a power module (or some other power electronics device) is described, the cooling system having a closed flow path for circulating a cooling fluid, the flow path having a pressure that is reduced to below atmospheric pressure. The cooling fluid is circulated along the flow path to provide cooling of the power module. The flow path is delimited from the exterior environment by a space provided between the flow path and the exterior environment, said space being sealed off from the cooling flow path, and said space being sealed off towards the exterior environment. The flow path has a pressure below atmospheric pressure and the space between the flow path and the exterior environment is evacuated and typically has a pressure lower than the pressure in the flow path.
摘要翻译：描述了用于功率模块（或一些其他电力电子设备）的冷却系统，该冷却系统具有用于使冷却流体循环的封闭流动路径，该流动路径具有降低至低于大气压的压力。冷却流体沿着流动路径循环以提供功率模块的冷却。流动路径通过设置在流路和外部环境之间的空间从外部环境界定，所述空间与冷却流路密封，并且所述空间朝向外部环境密封。流路的压力低于大气压力，并且流路和外部环境之间的空间被抽真空并且通常具有低于流动路径中的压力的压力。

2. 发明申请

WO2010083834A2 A BUILDING ELEMENT 审中-公开
标题翻译：建筑元素
公开(公告)号：WO2010083834A2
公开(公告)日：2010-07-29
申请号：PCT/DK2010/000009
申请日：2010-01-20
申请人： DANFOSS VENTURES A/S , VOSS, Frands, Wulff , OLESEN, Klaus
发明人： VOSS, Frands, Wulff , OLESEN, Klaus
CPC分类号： F24D3/14 , E04D1/24 , E04D1/26 , F24D11/003 , F24S10/25 , F24S10/502 , F24S20/64 , F24S20/66 , F24S20/67 , F24S20/69 , F24S80/30 , F24S2080/05 , Y02A30/62 , Y02B10/20 , Y02E10/44
摘要： A building element (1) is disclosed which is formed with the same dimensions or appearance as. a standard building element. The building element (1) comprises at least one inlet opening (4) and at least one outlet opening (5) and a means for guiding a fluid from the inlet opening (4) to the outlet opening (5) along an inner surface of a heat transfer area (2) and thereby enabling the transfer of heat between the heat transfer area (2) and the fluid. The building element (1) enables the replacement of traditional building elements by elements which can be used for heating or cooling of specific building surfaces, thus permitting, or enhancing, heat transfer arrangements within a building.
摘要翻译：公开了一种构造元件（1），其具有与其相同的尺寸或外观。标准建筑元素。建筑构件（1）包括至少一个入口开口（4）和至少一个出口开口（5），以及用于将流体从入口开口（4）引导到出口开口（5）的装置，传热区域（2），从而能够在传热区域（2）和流体之间传递热量。建筑构件（1）能够通过可用于加热或冷却特定建筑物表面的元件来替代传统建筑构件，从而允许或增强建筑物内的热传递布置。

3. 发明申请

WO2005089034A2 AN ELEMENT FOR CARRYING ELECTRONIC COMPONENTS 审中-公开
标题翻译：携带电子元件的元件
公开(公告)号：WO2005089034A2
公开(公告)日：2005-09-22
申请号：PCT/DK2005/000156
申请日：2005-03-09
申请人： DANFOSS SILICON POWER GMBH , OLESEN, Klaus, Kristen
发明人： OLESEN, Klaus, Kristen
IPC分类号： H05K7/20
CPC分类号： H05K7/20254 , F28F3/12 , H05K1/0272 , H05K1/0306 , H05K3/06 , H05K2201/0355
摘要： The invention provides an element for carrying electronic components, e.g. a DCB substrate with cells formed into one layer of the element to conduct a heat conductive fluid for cooling electronic components attached to the element. The invention further provides a method of making such an element, wherein the cells are formed by etching grooves into the element.
摘要翻译：本发明提供了一种用于承载电子元件的元件，例如电子元件。 DCB衬底，其中单元形成为元件的一层，以导热导热流体用于冷却附着于元件的电子元件。本发明还提供了制造这种元件的方法，其中通过在元件中蚀刻凹槽来形成单元。

4. 发明申请

WO2003095922A3 COOLING UNIT AND FLOW DISTRIBUTING ELEMENT FOR USE IN SUCH UNIT 审中-公开
公开(公告)号：WO2003095922A3
公开(公告)日：2003-11-20
申请号：PCT/DK2003/000303
申请日：2003-05-07
申请人： DANFOSS SILICON POWER GMBH , OLESEN, Klaus, Kristen , EISELE, Ronald , LAURIDSEN, Steen
发明人： OLESEN, Klaus, Kristen , EISELE, Ronald , LAURIDSEN, Steen
IPC分类号： H01L23/473
摘要： A liquid-cooled power semi-conductor unit has components to be cooled arranged on the upper side of a plate. The bottom side of the plate is cooled by liquid, which is guided along the plate by means of a distributing element, and the liquid inlet and the liquid outlet of the distributing element are preferably arranged perpendicular to the plate. The distributing element is divided into cells, where each cell has a liquid inlet and a liquid outlet perpendicular to the cooled plate, and the distributing element has multiple cells along the plate.

5. 发明申请

WO2003063240A3 KÜHLVORRICHTUNG 审中-公开
公开(公告)号：WO2003063240A3
公开(公告)日：2003-07-31
申请号：PCT/DK2003/000038
申请日：2003-01-22
申请人： DANFOSS SILICON POWER GMBH , EISELE, Ronald , OLESEN, Klaus, Kristen
发明人： EISELE, Ronald , OLESEN, Klaus, Kristen
IPC分类号： H01L23/473
摘要： Eine Kühlvorrichtung hat eine wärmeleitende Kühlplatte (6) auf seiten zu kühlender elektronischer Leistungsbauteile (5) und eine plattenartige Kühlfluid-Verteilereinrichtung (4). Die Verteilereinrichtung hat auf ihrer der Kühlplatte (6) zugekehrten Seite Kühlfluid-Austrittsöffnungen (9), die mit Abstand von der Kühlplatte (6) angeordnet und auf diese gerichtet sind. Ferner enthält die Verteilereinrichtung (4) wenigstens eine Abführöffnung (10) für das Kühlfluid. Damit die Kühlvorrichtung für verschiedenste Formen von Leistungsbauteilen geeignet ist, eine gleichmässige Kühlung auf der gesamten Kühlfläche für Leistungsbauteile in verschiedenster Form und Anzahl sichergestellt und die Kühlvorrichtung einfacher herstellbar ist, enthält die Verteilereinrichtung (4) eine erste Platte (1), in der die Austrittsöffnungen (9) und eine Vielzahl von Abführöffnungen (10) gleichmässig verteilt sind, eine zweite Platte (2) und eine dritte Platte (3), die übereinander angeordnet sind, wobei jeweils zwei Platten (1, 2; 2, 3) einen mit allen Austrittsöffnungen (9) verbundenen Zuführkanal (13) und einen mit allen Abführöffnungen (10) verbundenen Abführkanal (12) begrenzen.

6. 发明申请

WO2012069053A2 APPARATUS AND METHOD FOR CONTROLLING A MOTOR AND GENERATING THERMAL ENERGY 审中-公开
标题翻译：用于控制电动机和产生热能的装置和方法
公开(公告)号：WO2012069053A2
公开(公告)日：2012-05-31
申请号：PCT/DK2011000139
申请日：2011-11-25
申请人： DANFOSS DRIVES AS , OLESEN KLAUS , HOLST JOERGEN , VESTERGAARD BJOERN , ROLFING ASBJOERN , JAEGER JENS ULRIK
发明人： OLESEN KLAUS , HOLST JOERGEN , VESTERGAARD BJOERN , ROLFING ASBJOERN , JAEGER JENS ULRIK
IPC分类号： H02M7/00
CPC分类号： H02M7/5387 , B60L15/007 , B60L15/2045 , B60L2240/425 , B60L2240/525 , Y02T10/645 , Y02T10/72 , Y02T10/7283
摘要： A power module which is operated in a first and a second mode, wherein the power module generates more thermal energy when operated in the second mode. A method of operating a power module in a first and a second mode where the generation of thermal energy in the power module is larger when the power module is operated in the second mode than it is operated in the first mode.
摘要翻译：一种以第一和第二模式操作的功率模块，其中当在第二模式下操作时，功率模块产生更多的热能。一种在第一模式和第二模式中操作功率模块的方法，其中当所述功率模块在所述第二模式下操作时，所述功率模块中的热能的产生比在所述第一模式中操作的所述功率模块中的热能的产生更大。

7. 发明申请

WO2005117107A3 POWER SEMICONDUCTOR MODULE AND METHOD FOR COOLING A POWER SEMICONDUCTOR MODULE 审中-公开
标题翻译：功率半导体模块和方法冷却半导体功率模块
公开(公告)号：WO2005117107A3
公开(公告)日：2006-03-09
申请号：PCT/DK2005000341
申请日：2005-05-24
申请人： DANFOSS SILICON POWER GMBH , OLESEN KLAUS KRISTEN , EISELE RONALD
发明人： OLESEN KLAUS KRISTEN , EISELE RONALD
IPC分类号： H01L23/473 , H01L25/07
CPC分类号： H01L23/473 , H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a power semiconductor module comprising a plurality of power semiconductors that are fixed to a first side of a printed circuit board (26), and a cooling device that acts by means of a coolant, on a second side of the printed circuit board (26), opposite the first side, the cooling device comprising a plurality of cells through which the coolant is guided. The aim of the invention is to minimise the risk of failure of one such power semiconductor module. To this end, a non-cooled region (d, e, f) is arranged between at least two cells.
摘要翻译：它与多个功率半导体，其被安装在印刷电路板（26），功率半导体模块的第一侧，并且其作用在PCB（26）与第一侧相对的第二侧与冷却剂的冷却装置指定其中，所述冷却装置包括多个通过其冷却剂被引导的细胞。要最大限度地减少这样的功率半导体模块的风险。为了这个目的，它提供了一个未冷却的部分（D，E，F）被布置在至少两个小区之间。

8. 发明申请

WO2005040709A1 FLOW DISTRIBUTING UNIT AND COOLING UNIT 审中-公开
标题翻译：流量分配单元和冷却单元
公开(公告)号：WO2005040709A1
公开(公告)日：2005-05-06
申请号：PCT/DK2004/000735
申请日：2004-10-26
申请人： DANFOSS SILICON POWER GMBH , OLESEN, Klaus, Kristen
发明人： OLESEN, Klaus, Kristen
IPC分类号： F28F3/12
CPC分类号： F28F9/0268 , F28F3/12 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A distributor (1) for distributing a flow of cooling fluid over surface(s) (3) to be cooled has a housing (13) manufactured in a single piece with inlet (8) and outlet (9) manifolds and a plurality of flow cells (26, 27, 28, 29) which makes it easier and more cost effective to manufacture the distributor (1). The flow cells (26, 27, 28, 29) may be connected in parallel between the manifolds (8, 9) and may be adapted to cool two or more surfaces (3) simultaneously. Also disclosed is a fluid-coolable unit comprising the distributor (1) is furthermore suitable for removing heat from an electronic circuit, such as integrated circuit or CPU.
摘要翻译：用于在要冷却的表面（3）上分配冷却流体流的分配器（1）具有壳体（13），该壳体以单件制造，具有入口（8）和出口（9）歧管以及多个流电池（26,27,28,29），使制造分配器（1）更容易并且更具成本效益。流通池（26,27,28,29）可以在歧管（8,9）之间并联连接，并且可以适于同时冷却两个或更多个表面（3）。还公开了一种流体冷却单元，其包括分配器（1）还适合于从诸如集成电路或CPU的电子电路去除热量。

9. 发明申请

WO2012069053A3 APPARATUS AND METHOD FOR CONTROLLING A MOTOR AND GENERATING THERMAL ENERGY 审中-公开
公开(公告)号：WO2012069053A3
公开(公告)日：2012-05-31
申请号：PCT/DK2011/000139
申请日：2011-11-25
申请人： DANFOSS POWER ELECTRONICS A/S , OLESEN, Klaus , HOLST, Jørgen , VESTERGAARD, Bjørn , ROLFING, Asbjørn , JÆGER, Jens Ulrik
发明人： OLESEN, Klaus , HOLST, Jørgen , VESTERGAARD, Bjørn , ROLFING, Asbjørn , JÆGER, Jens Ulrik
IPC分类号： H02M7/5387
摘要： A power module which is operated in a first and a second mode, wherein the power module generates more thermal energy when operated in the second mode. A method of operating a power module in a first and a second mode where the generation of thermal energy in the power module is larger when the power module is operated in the second mode than it is operated in the first mode.

10. 发明申请

WO2012069052A2 A THERMAL ENERGY ADMINISTRATION SYSTEM 审中-公开
标题翻译：热能管理系统
公开(公告)号：WO2012069052A2
公开(公告)日：2012-05-31
申请号：PCT/DK2011000138
申请日：2011-11-25
申请人： DANFOSS DRIVES AS , OLESEN KLAUS , HOLST JOERGEN , VESTERGAARD BJOERN , ROLFING ASBJOERN
发明人： OLESEN KLAUS , HOLST JOERGEN , VESTERGAARD BJOERN , ROLFING ASBJOERN
IPC分类号： B60H1/00 , H01M10/50
CPC分类号： B60H1/00392 , B60H1/00278 , B60H1/00907 , B60H2001/00307 , B60H2001/00935 , H01M10/0525 , H01M10/613 , H01M10/625 , H01M10/63 , H01M10/6567 , H01M10/663 , H01M10/667 , Y02E60/122
摘要： A thermal energy administration system for an electrical vehicle comprising an electrical motor for propelling the vehicle, comprising an air conditioning system which is arranged to heat one or more heat requiring units, and/or to cool one or more cooling requiring units, wherein at least one of the heat requiring unit(s) and the cooling requiring unit(s) is an electrical device of the electrical vehicle.
摘要翻译：一种用于电动车辆的热能管理系统，包括用于推进车辆的电动马达，包括布置成加热一个或多个热需求单元和/或冷却一个或多个冷却需求单元的空调系统，其中至少热需求单元和冷却需求单元中的一个是电动车辆的电气设备。

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