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1. 发明申请

WO2005008734A8 AUTOMATED PROCESS AND APPARATUS FOR PLANARIZATION OF TOPOGRAPHICAL SURFACES 审中-公开
标题翻译：自动化过程和设备的地形表面平面设计
公开(公告)号：WO2005008734A8
公开(公告)日：2012-08-09
申请号：PCT/US2004022445
申请日：2004-07-09
申请人： BREWER SCIENCE INC , MCCUTCHEON JEREMY W
发明人： MCCUTCHEON JEREMY W
IPC分类号： B05D3/02 , B05C11/02 , B05D3/12 , H01L20060101
CPC分类号： H01L21/31058 , H01L21/67115 , H01L21/6719 , H01L21/68707 , H01L21/68785
摘要： An improved apparatus (20) and method are provided for effective, high speed contact planarization of coated curable substrates such as microelectronic devices to achieve very high degrees of planarization. The apparatus (20) includes a planarizing unit (28) preferably having an optical flat flexible sheet (88) and a backup optical flat body (82), and a curing assembly (30). In operation, a substrate (78) having a planarizable coating (76) is placed within a vacuum chamber (26) beneath sheet (88) and body (82). A pressure differential is created across sheet (88) so as to deflect the sheet into contact with a central region C of the coating (76), whereupon the coating (76) is brought into full planarizing contact with sheet (88) and body (82) by means of a support (114) and vacuum chuck (120); at this point the coating (76) is cured using assembly (30). After curing, a pressure differential is established across sheet (88) for sequentially separating the sheet from the peripheral portion P of the coating, and then full separation of the sheet (88) and coating (76).
摘要翻译：提供了一种改进的装置（20）和方法，用于有效的高速接触平面化涂覆的可固化基板例如微电子器件以实现非常高的平坦度。装置（20）包括平坦化单元（28），优选地具有光学平面柔性片（88）和备用光学平坦体（82），以及固化组件（30）。在操作中，具有可平面化涂层（76）的基板（78）被放置在薄片（88）和主体（82）下方的真空室（26）内。在片材（88）之间产生压差，以便将片材偏转成与涂层（76）的中心区域C接触，于是涂层（76）与片材（88）和主体（88）完全平坦化接触 82）通过支撑件（114）和真空卡盘（120）; 在这一点上，涂层（76）使用组件（30）固化。固化后，在片材（88）之间建立用于将片材从涂层的周边部分P顺序分离，然后片材（88）和涂层（76）的完全分离的压力差。

2. 发明申请

WO2005008734A3 AUTOMATED PROCESS AND APPARATUS FOR PLANARIZATION OF TOPOGRAPHICAL SURFACES 审中-公开
标题翻译：自动化过程和设备的地形表面平面设计
公开(公告)号：WO2005008734A3
公开(公告)日：2006-05-11
申请号：PCT/US2004022445
申请日：2004-07-09
申请人： BREWER SCIENCE INC , MCCUTCHEON JEREMY W
发明人： MCCUTCHEON JEREMY W
IPC分类号： B05D3/02 , B05C11/02 , B05D3/12 , H01L20060101
CPC分类号： H01L21/31058 , H01L21/67115 , H01L21/6719 , H01L21/68707 , H01L21/68785
摘要： An improved apparatus (20) and method are provided for effective, high speed contact planarization of coated curable substrates such as microelectronic devices to achieve very high degrees of planarization. The apparatus (20) includes a planarizing unit (28) preferably having an optical flat flexible sheet (88) and a backup optical flat body (82), and a curing assembly (30). In operation, a substrate (78) having a planarizable coating (76) is placed within a vacuum chamber (26) beneath sheet (88) and body (82). A pressure differential is created across sheet (88) so as to deflect the sheet into contact with a central region C of the coating (76), whereupon the coating (76) is brought into full planarizing contact with sheet (88) and body (82) by means of a support (114) and vacuum chuck (120); at this point the coating (76) is cured using assembly (30). After curing, a pressure differential is established across sheet (88) for sequentially separating the sheet from the peripheral portion P of the coating, and then full separation of the sheet (88) and coating (76).
摘要翻译：提供了一种改进的装置（20）和方法，用于有效的高速接触平面化涂覆的可固化基板例如微电子器件以实现非常高的平坦度。装置（20）包括平坦化单元（28），优选地具有光学平面柔性片（88）和备用光学平坦体（82），以及固化组件（30）。在操作中，具有可平面化涂层（76）的基板（78）被放置在薄片（88）和主体（82）下方的真空室（26）内。在片材（88）之间产生压差，以便将片材偏转成与涂层（76）的中心区域C接触，于是涂层（76）与片材（88）和主体（88）完全平坦化接触 82）通过支撑件（114）和真空卡盘（120）; 在这一点上，涂层（76）使用组件（30）固化。固化后，在片材（88）之间建立用于将片材从涂层的周边部分P顺序分离，然后片材（88）和涂层（76）的完全分离的压力差。

3. 发明申请

WO2005008734A2 AUTOMATED PROCESS AND APPARATUS FOR PLANARIZATION OF TOPOGRAPHICAL SURFACES 审中-公开
标题翻译：自动化过程和设备的地形表面平面设计
公开(公告)号：WO2005008734A2
公开(公告)日：2005-01-27
申请号：PCT/US2004/022445
申请日：2004-07-09
申请人： BREWER SCIENCE INC. , MCCUTCHEON, Jeremy, W.
发明人： MCCUTCHEON, Jeremy, W.
IPC分类号： H01L
CPC分类号： H01L21/31058 , H01L21/67115 , H01L21/6719 , H01L21/68707 , H01L21/68785
摘要： An improved apparatus (20) and method are provided for effective, high speed contact planarization of coated curable substrates such as microelectronic devices to achieve very high degrees of planarization. The apparatus (20) includes a planarizing unit (28) preferably having an optical flat flexible sheet (88) and a backup optical flat body (82), and a curing assembly (30). In operation, a substrate (78) having a planarizable coating (76) is placed within a vacuum chamber (26) beneath sheet (88) and body (82). A pressure differential is created across sheet (88) so as to deflect the sheet into contact with a central region C of the coating (76), whereupon the coating (76) is brought into full planarizing contact with sheet (88) and body (82) by means of a support (114) and vacuum chuck (120); at this point the coating (76) is cured using assembly (30). After curing, a pressure differential is established across sheet (88) for sequentially separating the sheet from the peripheral portion P of the coating, and then full separation of the sheet (88) and coating (76).
摘要翻译：提供了一种改进的装置（20）和方法，用于有效的高速接触平面化涂覆的可固化基板例如微电子器件以实现非常高的平坦度。装置（20）包括平坦化单元（28），优选地具有光学平面柔性片（88）和备用光学平坦体（82），以及固化组件（30）。在操作中，具有可平面化涂层（76）的基板（78）被放置在薄片（88）和主体（82）下方的真空室（26）内。在片材（88）之间产生压差，以便将片材偏转成与涂层（76）的中心区域C接触，于是涂层（76）与片材（88）和主体（88）完全平坦化接触 82）通过支撑件（114）和真空卡盘（120）; 在这一点上，涂层（76）使用组件（30）固化。固化后，在片材（88）之间建立用于将片材从涂层的周边部分P顺序分离，然后片材（88）和涂层（76）的完全分离的压力差。

4. 发明申请

WO2008079582A1 CONTACT PLANARIZATION APPARATUS 审中-公开
标题翻译：联系平面设备
公开(公告)号：WO2008079582A1
公开(公告)日：2008-07-03
申请号：PCT/US2007/085772
申请日：2007-11-28
申请人： BREWER SCIENCE INC. , MCCUTCHEON, Jeremy, W. , BROWN, Robert, D.
发明人： MCCUTCHEON, Jeremy, W. , BROWN, Robert, D.
IPC分类号： H01L21/304
CPC分类号： G03F7/168 , H01L21/67092 , H01L21/67115
摘要： A contact planarization apparatus includes a lower membrane assembly, an upper membrane assembly, a differential pressure assembly, and a curing or reflowing assembly. The lower membrane assembly supports a substrate to be planarized and biases it toward the upper membrane assembly under the influence of the pressure differential assembly. The upper membrane assembly planarizes the coating on the substrate under the influence of the differential pressure assembly and includes a flexible sheet which is supported above the substrate stage and below the curing or reflowing assembly via a vacuum force applied by the differential pressure assembly. The differential pressure assembly moves the lower and upper membrane assemblies relative to one another to planarize the coating on the substrate entirely through the application of vacuum and pressure forces. The differential pressure assembly includes a top pressure chamber positioned above the upper face of the upper sheet, a bottom pressure chamber positioned below the lower face of the lower sheet, and a central pressure chamber positioned generally between the lower face of the upper sheet and the upper face of the lower sheet.
摘要翻译：接触平面化装置包括下膜组件，上膜组件，差压组件和固化或回流组件。下膜组件支撑待平坦化的基底，并在压差组件的影响下将其偏向上膜组件。上膜组件在差压组件的影响下平坦化基板上的涂层，并且包括柔性片，其通过由差压组件施加的真空力被支撑在基底台上并在固化或回流组件之下。差压组件相对于彼此移动下部膜组件和上部膜组件，以通过施加真空和压力力使衬底上的涂层完全平坦化。差压组件包括位于上板的上表面上方的顶压室，位于下板下表面下方的底压室，以及通常位于上板的下表面和下片的上表面。

5. 发明申请

WO2011162778A1 METHOD AND APPARATUS FOR REMOVING A REVERSIBLY MOUNTED DEVICE WAFER FROM A CARRIER SUBSTRATE 审中-公开
标题翻译：用于从载体基板移除可逆安装的装置的方法和装置
公开(公告)号：WO2011162778A1
公开(公告)日：2011-12-29
申请号：PCT/US2010/041726
申请日：2010-07-12
申请人： BREWER SCIENCE INC. , MCCUTCHEON, Jeremy, W. , BROWN, Robert, D.
发明人： MCCUTCHEON, Jeremy, W. , BROWN, Robert, D.
IPC分类号： H01L21/683 , H01L21/02
CPC分类号： H01L21/187 , H01L21/67092 , H01L21/6835 , H01L21/68721 , H01L2221/68318 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386 , Y10S156/93 , Y10S156/941 , Y10T156/1168 , Y10T156/1978 , Y10T156/1989
摘要： New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.
摘要翻译：提供了用于分离由这些方法和装置形成的临时，永久或半永久粘合的基底和物品的新的拆卸方法和装置。这些方法包括从仅在其外周强度结合的载体晶片或基底上拆卸器件晶片。边缘粘合是化学，机械，声学或热软化，溶解或破坏，以允许晶片在非常低的力和在室温或在室温附近在制造过程中的适当阶段容易地分离。还提供了一种用于便于分离键合衬底的夹具。

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