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1. 发明申请

WO2016004899A1 PROCESS FOR MAKING TETRACYCLIC HETEROCYCLE COMPOUNDS 审中-公开
标题翻译：制备四元杂环化合物的方法
公开(公告)号：WO2016004899A1
公开(公告)日：2016-01-14
申请号：PCT/CN2015/083786
申请日：2015-07-10
申请人： MERCK SHARP & DOHME CORP. , MERCK SHARP & DOHME LIMITED , MSD R&D (CHINA) CO., LTD. , LI, Hongming , YIN, Jingjun , BELYK, Kevin M. , CAMPOS, Kevin R. , CHEN, Qinghao , HYDE, Alan M. , ITOH, Tetsuji , KLAPARS, Artis , TUDGE, Mathew Thomas , CLEATOR, Edward , DUMAS, Aaron M. , CAMPEAU, Louis-Charles , CHEN, Yonggang , QI, Ji , XIAO, Wensong
发明人： LI, Hongming , YIN, Jingjun , BELYK, Kevin M. , CAMPOS, Kevin R. , CHEN, Qinghao , HYDE, Alan M. , ITOH, Tetsuji , KLAPARS, Artis , TUDGE, Mathew Thomas , CLEATOR, Edward , DUMAS, Aaron M. , CAMPEAU, Louis-Charles , CHEN, Yonggang , QI, Ji , XIAO, Wensong
IPC分类号： C07D265/14 , C07D498/04 , C07D241/44 , C07C211/29 , C07C211/28
CPC分类号： C07D498/04 , C07C251/24 , C07D239/74 , C07D265/14 , C07D265/36 , C07D413/04 , C07D413/14 , C07D417/04 , C07F9/650994 , C07F17/02
摘要： The present invention is directed to a process for making Tetracyclic Heterocycle Compounds of Formula (I) and pharmaceutically acceptable salts thereof, wherein X 1 , X 2 , R 1 , R 2 and R 3 are defined above herein. The present invention is also directed to compounds that are useful as synthetic intermediates in the process of the invention.
摘要翻译：本发明涉及制备式（I）的四环杂环化合物及其药学上可接受的盐的方法，其中X 1，X 2，R 1，R 2和R 3如上所定义。本发明还涉及在本发明方法中可用作合成中间体的化合物。

2. 发明申请

WO2013132507A1 AN INTEGRATED PROCESS FOR THE RECOVERY OF METAL CATALYSTS DURING THE MANUFACTURE OF PURIFIED TEREPHTHALIC ACID 审中-公开
标题翻译：在纯化过硫酸制备过程中金属催化剂回收的综合工艺
公开(公告)号：WO2013132507A1
公开(公告)日：2013-09-12
申请号：PCT/IN2012/000291
申请日：2012-04-20
申请人： RELIANCE INDUSTRIES LTD., , UPPARA, Parasu Veera , ADURI, Pavankumar , MATHEW, Thomas , RATNAPARKHI, Uday , SHARMA, Ananth , UKIL, Tamagna , GHADGE, Rajaram, S.
发明人： UPPARA, Parasu Veera , ADURI, Pavankumar , MATHEW, Thomas , RATNAPARKHI, Uday , SHARMA, Ananth , UKIL, Tamagna , GHADGE, Rajaram, S.
IPC分类号： C07C51/09 , C07C51/265 , C07C51/41 , C07C51/43 , C07C53/08 , C07C55/07 , C07C63/26 , C07C63/24
CPC分类号： C07C51/09 , C07C51/265 , C07C51/412 , C07C51/43 , Y02P20/125 , C07C53/08 , C07C63/24 , C07C63/26 , C07C55/07
摘要： The present disclosure provides a process for recovering PTA (purified terephthalic acid) oxidation catalysts during the manufacture of PTA, using an acid catalyst containing reaction stream resulting from the hydrolysis of an organic ester.
摘要翻译：本公开提供了在制造PTA期间使用含有由有机酯的水解产生的反应物流的酸催化剂来回收PTA（纯化的对苯二甲酸）氧化催化剂的方法。

3. 发明申请

WO2007143661A2 THERMALLY ENCHANCED BGA PACKAGES AND METHODS 审中-公开
标题翻译：热加工BGA封装和方法
公开(公告)号：WO2007143661A2
公开(公告)日：2007-12-13
申请号：PCT/US2007/070436
申请日：2007-06-05
申请人： TEXAS INSTRUMENTS INCORPORATED , ROMIG, Matthew , MATHEW, Thomas
发明人： ROMIG, Matthew , MATHEW, Thomas
IPC分类号： H01L21/00
CPC分类号： H01L23/4334 , H01L23/13 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01029 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/32225 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Improved ball grid array (BGA) packages (100) are disclosed in which thermal properties are enhanced by means of a heat channel through the substrate (102). The heat channel element is patterned for receiving solder balls. A BGA embodiment of the invention includes an integrated circuit (IC) chip operably coupled to a semiconductor substrate having a top surface (104) for receiving the IC chip (108) and a bottom surface (110) defining the perimeter of the bottom of the package. An encapsulant encloses the IC chip and at least a portion of the top surface of the substrate, defining the top and sides of the package. The substrate includes a heat channel aperture (112) for receiving heat channel element (114) having a surface proximal to the IC chip and having an opposing surface defining at least an interior portion of the bottom surface of the package and patterned for receiving solder balls. Methods for assembling packages according to the invention are also disclosed in which a substrate is provided with a heat channel aperture and heat channel element is placed therein. The substrate and heat channel element are temporarily held in position, preferably using tape, during assembly. Solder ball attachment points are provided at the surface of the heat channel element for receiving solder balls.
摘要翻译：公开了改进的球栅阵列（BGA）封装（100），其中通过穿过衬底（102）的热通道来增强热性能。图案化热通道元件用于接收焊球。本发明的BGA实施例包括可操作地耦合到半导体衬底的集成电路（IC）芯片，其具有用于接收IC芯片（108）的顶表面（104）和限定所述IC芯片的底部的周边的底表面（110）包。密封剂封装IC芯片和衬底顶表面的至少一部分，限定封装的顶部和侧面。衬底包括用于接收具有靠近IC芯片的表面的热通道元件（114）的热通道孔（112），并且具有限定包装的底表面的至少内部部分的相对表面，并被图案化以接收焊球。还公开了根据本发明的组装包装的方法，其中衬底设置有热通道孔，并且将热通道元件放置在其中。在组装过程中，衬底和热通道元件暂时保持就位，优选使用胶带。焊球安装点设置在用于接收焊球的热通道元件的表面处。

4. 发明申请

WO2004017516A1 MATCHED TRANSMISSION LINE CONNECTOR 审中-公开
标题翻译：匹配传输线连接器
公开(公告)号：WO2004017516A1
公开(公告)日：2004-02-26
申请号：PCT/US2003/009499
申请日：2003-03-31
申请人： REDCLOVER NETWORKS, INC. , NGUYEN, Dzung, A. , GUNDAVAJHALA, Anand , BUSH, William, Dale , MATHEW, Thomas , LIU, Tiangong , WANG, Tongqing , MATHEW, Moni, G.
发明人： NGUYEN, Dzung, A. , GUNDAVAJHALA, Anand , BUSH, William, Dale , MATHEW, Thomas , LIU, Tiangong , WANG, Tongqing , MATHEW, Moni, G.
IPC分类号： H03H7/38
CPC分类号： H01P5/085
摘要： According to the invention there is provided an interconnect for bi-directionally coupling together a coaxial transmission line and a coplanar waveguide. The interconnect is adapted to provide a transition region between the coaxial transmission line and the coplanar waveguide, which induces a smooth transition from the electric field of the coaxial transmission line to the electric field of the coplanar waveguide as well as broadband impedance matching between the coaxial transmission line and coplanar waveguide.
摘要翻译：根据本发明，提供了用于将同轴传输线和共面波导双向耦合在一起的互连。互连适于在同轴传输线和共面波导之间提供过渡区域，其引起从同轴传输线的电场到共面波导的电场的平滑过渡以及同轴的传输线之间的宽带阻抗匹配传输线和共面波导。

5. 发明申请

WO2008157333A1 ELASTOMERIC ELEMENT INSTALLATION TOOL AND METHOD 审中-公开
标题翻译：弹性元件安装工具和方法
公开(公告)号：WO2008157333A1
公开(公告)日：2008-12-24
申请号：PCT/US2008/066889
申请日：2008-06-13
申请人： BAKER HUGHES INCORPORATED , O'BRIEN, Robert, S. , LYNDE, Gerald, D. , XU, Yang , MATHEW, Thomas
发明人： O'BRIEN, Robert, S. , LYNDE, Gerald, D. , XU, Yang , MATHEW, Thomas
IPC分类号： F16L55/17 , F16L58/10
CPC分类号： F16L55/17 , F16L58/1081 , Y10T29/49872 , Y10T29/5363 , Y10T29/53657
摘要： Disclosed herein is a method of installing an elastomeric element onto a tubular. The method includes, positioning the elastomeric element onto a radially expandable member (14), radially expanding the radially expandable member and the elastomeric element installed thereon, positioning a tubular coaxially with the radially expandable member, and axially urging the elastomeric element off the radially expandable member thereby allowing the elastomeric element to be positioned coaxially about an outer perimetrical surface of the tubular.
摘要翻译：本文公开了一种将弹性体元件安装到管状体上的方法。该方法包括将弹性体元件定位在可径向扩张的构件（14）上，径向地使可径向扩张的构件和安装在其上的弹性体元件放大，将管状物与径向可膨胀构件同轴地定位，并将弹性体元件沿径向可膨胀从而允许弹性体元件围绕管的外周表面同轴地定位。

6. 发明申请

WO2007143661A3 THERMALLY ENCHANCED BGA PACKAGES AND METHODS 审中-公开
标题翻译：热加工BGA封装和方法
公开(公告)号：WO2007143661A3
公开(公告)日：2008-12-24
申请号：PCT/US2007070436
申请日：2007-06-05
申请人： TEXAS INSTRUMENTS INC , ROMIG MATTHEW , MATHEW THOMAS
发明人： ROMIG MATTHEW , MATHEW THOMAS
IPC分类号： H05K7/20
CPC分类号： H01L23/4334 , H01L23/13 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01029 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/32225 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Improved ball grid array (BGA) packages are disclosed in which thermal properties are enhanced by means of a heat channel through the substrate, the heat channel element patterned for receiving solder balls An integrated circuit (IC) chip is coupled to a substrate having a top surface for receiving the IC chip and a bottom surface defining the pepmeter of the package bottom An encapsulant encloses the IC chip and a portion of the substrate top surface, defining the top and sides of the package The substrate includes an aperture for receiving heat channel element having a surface proximal to the IC chip and an opposing surface defining at least an intenor portion of the bottom surface of the package Methods for assembling packages are also disclosed The substrate and heat channel element are temporarily held in position, preferably using tape, during assembly.
摘要翻译：公开了改进的球栅阵列（BGA）封装，其中热特性通过穿过衬底的热通道增强，图形化用于接收焊球的热通道元件集成电路（IC）芯片耦合到具有顶部的衬底用于接收IC芯片的表面和限定封装底部的pepmeter的底表面密封剂封装IC芯片和限定封装的顶部和侧面的衬底顶表面的一部分。衬底包括用于接收热通道元件的孔具有靠近IC芯片的表面和限定封装底表面的至少一个中间部分的相对表面还公开了用于组装封装的方法。在组装期间，衬底和热通道元件优选地使用胶带暂时保持就位。

7. 发明申请

WO2005023087A3 ELECTROMYOGRAM METHOD AND APPARATUS 审中-公开
公开(公告)号：WO2005023087A3
公开(公告)日：2005-03-17
申请号：PCT/US2004/024092
申请日：2004-07-27
申请人： MOTOROLA, INC. , A CORPORATION OF THE STATE OF DELAWARE , MATHEW, Thomas, , HONG, Di-An, , VALLIATH, George, , OLSON, William L.,
发明人： MATHEW, Thomas, , HONG, Di-An, , VALLIATH, George, , OLSON, William L.,
IPC分类号： A61B5/04
摘要： An electromyogram device (10) have a conformable housing (11) that houses or otherwise supports an electromyogram signal processor (13), electromyogram sensors (14), and a display (15) that provides, for example, information corresponding to one or more muscle condition parameters such as muscular fatigue. In various embodiments, the device can further include additional displays (34), memory (31), audible alarm mechanisms (32), and/or a wireless receiver and/or transmitter (33). In one embodiment, such devices can communicate amongst one another to permit central and/or remote display of the resultant electromyogram information.

8. 发明申请

WO2013009553A2 POLYOLEFIN DRAG REDUCING AGENTS PRODUCED BY MULTIPLE NON-CRYOGENIC GRINDING STAGES 审中-公开
标题翻译：通过多个非低温磨削阶段生产的聚烯烃减阻剂
公开(公告)号：WO2013009553A2
公开(公告)日：2013-01-17
申请号：PCT/US2012/045490
申请日：2012-07-05
申请人： BAKER HUGHES INCORPORATED , MATHEW, Thomas , KOMMAREDDI, Nagesh, S. , WARD, Jack, Bradford
发明人： MATHEW, Thomas , KOMMAREDDI, Nagesh, S. , WARD, Jack, Bradford
IPC分类号： C08J3/12 , C08J3/02 , C08F10/00 , C08F6/00 , C09K3/00
CPC分类号： F17D1/17 , F17D1/08 , F17D1/16
摘要： Fine particulate polymer drag reducing agents (DRAs) in bi-modal or multi-modal particle size distributions may be produced simply and efficiently without cryogenic temperatures. The grinding or pulverizing of polymer, e.g. non-porous poly(alpha-olefin) suitable for reducing drag in hydrocarbons may be achieved by the use of at least one liquid grinding aid and at least two grinding processors in series. The blades of the stators of the grinders are of different configuration so that granulated polymer fed to the first processor having relatively larger gaps between blades is ground to an intermediate size which is fed to the second processor having relatively smaller gaps between blades which grinds the polymer to a second, smaller size. A non-limiting example of a suitable liquid grinding aid includes a blend of propylene glycol, water and hexanol. Particulate DRA may be produced at a size of 300 microns or less in only two passes.
摘要翻译：可以在没有低温温度的情况下简单且有效地生产双峰或多峰粒度分布中的细粒聚合物减阻剂（DRA）。聚合物的研磨或粉碎，例如适用于降低烃中阻力的无孔聚（α-烯烃）可以通过使用至少一种液体研磨助剂和至少两种串联的研磨处理器来实现。研磨机的定子的叶片具有不同的构造，以致供给到具有相对较大的叶片之间的间隙的第一处理器的粒状聚合物被研磨成中间尺寸，该中间尺寸被供给到具有相对较小的间隙之间的间隙中的第二处理器，到第二个更小的尺寸。合适的液体研磨助剂的非限制性实例包括丙二醇，水和己醇的混合物。只需两次就可以生产300微米或更小的颗粒状DRA。

9. 发明申请

WO2013009553A3 POLYOLEFIN DRAG REDUCING AGENTS PRODUCED BY MULTIPLE NON-CRYOGENIC GRINDING STAGES 审中-公开
标题翻译：多元非球晶研磨生产的聚烯烃减少剂
公开(公告)号：WO2013009553A3
公开(公告)日：2013-04-04
申请号：PCT/US2012045490
申请日：2012-07-05
申请人： BAKER HUGHES INC , MATHEW THOMAS , KOMMAREDDI NAGESH S , WARD JACK BRADFORD
发明人： MATHEW THOMAS , KOMMAREDDI NAGESH S , WARD JACK BRADFORD
IPC分类号： C08J3/12 , C08F6/00 , C08F10/00 , C08J3/02 , C09K3/00
CPC分类号： F17D1/17
摘要： Fine particulate polymer drag reducing agents (DRAs) in bi-modal or multi-modal particle size distributions may be produced simply and efficiently without cryogenic temperatures. The grinding or pulverizing of polymer, e.g. non-porous poly(alpha-olefin) suitable for reducing drag in hydrocarbons may be achieved by the use of at least one liquid grinding aid and at least two grinding processors in series. The blades of the stators of the grinders are of different configuration so that granulated polymer fed to the first processor having relatively larger gaps between blades is ground to an intermediate size which is fed to the second processor having relatively smaller gaps between blades which grinds the polymer to a second, smaller size. A non-limiting example of a suitable liquid grinding aid includes a blend of propylene glycol, water and hexanol. Particulate DRA may be produced at a size of 300 microns or less in only two passes.
摘要翻译：双模态或多模式粒度分布的细颗粒聚合物减阻剂（DRAs）可以在没有低温的情况下简单有效地生产。聚合物的研磨或粉碎，例如适用于减少烃中的阻力的非多孔聚（α-烯烃）可以通过使用至少一种液体研磨助剂和至少两种串联研磨处理器来实现。研磨机的定子的叶片具有不同的构造，使得进料到具有相对较大的叶片之间间隙的第一处理器的成粒聚合物被研磨成中间尺寸，其被馈送到第二处理器，其具有在研磨聚合物的叶片之间具有相对更小的间隙到第二个，更小的尺寸。合适的液体研磨助剂的非限制性实例包括丙二醇，水和己醇的共混物。颗粒状DRA可以仅在两次通过时以300微米或更小的尺寸生产。

10. 发明申请

WO2012003196A3 SHAPE MEMORY CEMENT ANNULUS GAS MIGRATION PREVENTION APPARATUS 审中-公开
标题翻译：形状记忆水泥环形气体迁移预防装置
公开(公告)号：WO2012003196A3
公开(公告)日：2012-03-01
申请号：PCT/US2011042278
申请日：2011-06-29
申请人： BAKER HUGHES INC , MATHEW THOMAS , JOHNSON MICHAEL H , ROSENBLATT STEVE
发明人： MATHEW THOMAS , JOHNSON MICHAEL H , ROSENBLATT STEVE
IPC分类号： E21B33/13 , E21B33/138
CPC分类号： E21B33/1208
摘要： The annular space around a tubular string has a shape memory material that is in a low profile configuration for run in. After the desired position is obtained and the annulus has cement delivered to fill the annular space, the shape memory device is triggered to revert to an original shape that spans the annulus to seal the tubular and the wellbore sides of the annular space against gas migration through the cement. The structures can have varying run in shapes and can also have original shapes that when the material is triggered will act to displace cement to enhance its compaction on the tubular or the wellbore wall. Combinations of shape memory alloys and polymers are also contemplated to enhance the seal against gas migration.
摘要翻译：围绕管柱的环形空间具有形状记忆材料，该形状记忆材料处于低轮廓构造用于进入。在获得期望的位置并且环空具有粘合剂递送以填充环形空间之后，形状记忆装置被触发以恢复到跨越环形空间的原始形状以密封环形空间的管状物和井筒侧，防止气体通过水泥迁移。该结构可以具有不同形状的运行，并且还可以具有原始形状，当材料被触发时将起作用以移动水泥以增强其在管道或井筒壁上的压实。也预期形状记忆合金和聚合物的组合可以增强密封防止气体迁移。

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