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    • 2. 发明申请
    • RAISED SOURCE/DRAIN REGIONS IN MOS DEVICE
    • MOS设备中的提取源/排水区域
    • WO2008144629A1
    • 2008-11-27
    • PCT/US2008/064082
    • 2008-05-19
    • TEXAS INSTRUMENTS INCORPORATEDSRIDHAR, SeetharamanMANSOORI, Majid
    • SRIDHAR, SeetharamanMANSOORI, Majid
    • H01L21/336
    • H01L21/823814H01L21/823807H01L29/66636H01L29/7848
    • Provided is a method for manufacturing a semiconductor device that includes a substrate (210) having a PMOS device region (220) and NMOS device region (260). A first gate structure (240) including a first hardmask (248) and a second gate structure (280) including a second hardmask (288) are formed in the region and region, respectively. Epitaxial SiGe regions (610) are created in the substrate proximate the first gate structure, the first hardmask protecting the first gate structure from the SiGe. First source/drain regions (410, 1020) are formed proximate the first gate structure, at least a portion of each of the first source/drain regions located within one of the SiGe regions. Additionally, a raised portion (710) is grown above the substrate proximate the second gate structure, the portion forming at least a part of second source/drain regions (820, 1120) located on opposing sides of the second gate structure. Additionally, the first and second hardmasks protect the first and second gate structures from the growing.
    • 提供一种制造半导体器件的方法,该半导体器件包括具有PMOS器件区(220)和NMOS器件区(260)的衬底(210)。 分别在区域和区域中形成包括第一硬掩模(248)和包括第二硬掩模(288)的第二栅极结构(280)的第一栅极结构(240)。 在靠近第一栅极结构的衬底中形成外延SiGe区域(610),第一硬掩模保护第一栅极结构与SiGe。 第一源极/漏极区(410,1020)形成在第一栅极结构附近,第一源/漏区中的每一个的至少一部分位于SiGe区之一内。 另外,凸起部分(710)在靠近第二栅极结构的衬底上方生长,该部分形成位于第二栅极结构的相对侧上的第二源极/漏极区域(820,1120)的至少一部分。 此外,第一和第二硬掩模保护第一和第二门结构免受增长。