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    • 1. 发明申请
    • PROBE POSITIONING AND BONDING DEVICE AND PROBE BONDING METHOD
    • 探针定位与接合装置及探头连接方法
    • WO2004084296A1
    • 2004-09-30
    • PCT/KR2004/000560
    • 2004-03-16
    • PHICOM CORPORATIONLEE, Oug-KiLEE, Jung-Hoon
    • LEE, Oug-KiLEE, Jung-Hoon
    • H01L21/66
    • G01R3/00B23K26/0861G01R1/06711G01R1/07342G01R31/2887
    • Disclosed herein are a probe positioning and bonding device and a probe bonding method, and more particularly a probe positioning and bonding device used to fix probes to prescribed positions on a substrate so that a probe card used for semiconductor integrated circuit testing equipment is manufactured, and a probe bonding method using the same. The probe positioning and bonding device comprises a stage unit disposed on a working table, a microscope disposed above the stage unit while being supported by means of a first supporting member disposed on the working table, a probe fixing unit disposed above the stage unit and below the microscope while being supported by means of a second supporting member disposed on the working table, and a light source unit supported by means of a third supporting member disposed on the working table. The light source unit is disposed toward the upper part of the stage unit.
    • 这里公开了探针定位和接合装置和探针接合方法,更具体地,涉及用于将探针固定到基板上的规定位置的探针定位和接合装置,从而制造用于半导体集成电路检测设备的探针卡,以及 使用其的探针接合方法。 探针定位和接合装置包括设置在工作台上的台单元,设置在平台单元上方的显微镜,同时由设置在工作台上的第一支撑构件支撑;探针固定单元,设置在平台单元上方和下方 显微镜同时由设置在工作台上的第二支撑构件支撑,以及由设置在工作台上的第三支撑构件支撑的光源单元。 光源单元朝向台单元的上部设置。
    • 2. 发明申请
    • PROBE AND METHOD OF MAKING SAME
    • 探索和制作方法
    • WO2004084295A1
    • 2004-09-30
    • PCT/KR2004/000559
    • 2004-03-16
    • PHICOM CORPORATIONLEE, Oug-KiLEE, Jung-Hoon
    • LEE, Oug-KiLEE, Jung-Hoon
    • H01L21/66
    • G01R1/06744G01R1/06711G01R1/07307G01R1/07342G01R3/00
    • Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of making the same. The probe having a prescribed thickness and formed in the shape of a flat plate. The probe comprises a body part bent at the middle thereof so that the body part is elastically tensioned or compressed when a tension force or a compression force is applied to the body part at the upper and lower ends thereof, a connection part integrally formed with the lower end of the body part, the connection part being fixed to a substrate, and a tip part integrally formed with the upper end of the body part, the tip part contacting a pad of an element.
    • 本文公开了一种探针及其制造方法,更具体地说,涉及一种具有微小间距的探针,其中形成了与晶片上形成有组合形状或其它各种形状的焊盘排列相对应的探针卡,以及 制作相同的方法。 探针具有规定的厚度并形成为平板状。 探头包括在其中间弯曲的主体部分,使得当在其上端和下端处对主体部分施加张力或压缩力时,主体部分被弹性张紧或压缩,与主体部分的上端和下端一体形成的连接部分 主体部分的下端,连接部分固定到基底,以及与主体部分的上端一体形成的尖端部分,尖端部分接触元件的垫。
    • 3. 发明申请
    • SILICON WAFER FOR PROBE BONDING AND PROBE BONDING METHOD USING THEREOF
    • 用于探头连接和探头连接方法的硅晶片
    • WO2005122240A1
    • 2005-12-22
    • PCT/KR2005/001806
    • 2005-06-14
    • PHICOM CORPORATIONLEE, Jung-Hoon
    • LEE, Jung-Hoon
    • H01L21/66
    • G01R3/00G01R1/07342
    • Disclosed herein are a silicon wafer for probe bonding and a probe bonding method using the same.The silicon wafer for probe bonding is improved in structure to facilitate probe bonding on a probe substrate. The probe bonding method involves bonding supporting beams on the silicon wafer to bumps on the probe substrate. The silicon wafer is formed at a surface thereof with probe tips and supporting beams on an end of each probe tip to have a redetermined arrangement pattern. The silicon wafer is further formed with openings from an upper surface to a lower surface thereof. A portion of each supporting beam opposite to the probe tips protrudes is exposed to the outside through the openings.
    • 这里公开了用于探针接合的硅晶片和使用该硅晶片的探针接合方法。用于探针接合的硅晶片的结构得到改善,以便于探针基底上的探针接合。 探针接合方法包括将硅晶片上的支撑束粘合到探针基板上的凸起。 硅晶片在其表面处形成有探针尖端和支撑梁,每个探针尖端的端部具有重新确定的布置图案。 硅晶片还形成有从上表面到下表面的开口。 与探针尖端相反的每个支撑梁的一部分突出通过开口暴露于外部。
    • 4. 发明申请
    • PROBE CARD INCLUDING A PLURALITY OF CONNECTORS AND METHOD OF BONDING THE CONNECTORS TO A SUBSTRATE OF THE PROBE CARD
    • 包括多个连接器的探针卡和将连接器连接到探针卡的基板上的方法
    • WO2008100101A1
    • 2008-08-21
    • PCT/KR2008/000890
    • 2008-02-15
    • PHICOM CORPORATIONLEE, Jung-Hoon
    • LEE, Jung-Hoon
    • H01L21/66
    • G01R1/07378G01R31/2889
    • In a probe card for inspecting a semiconductor device and a flat panel display device, first and second substrate structures and a plurality of connectors are provided. The first substrate structure has a plurality of connection holes. A conductive layer is located on an inner surface of each of the connection holes and connected to a signal line in the first substrate. The second substrate structure has a contact pad at an upper portion thereof and a plurality of probes that make contact with an inspection object at a lower portion thereof. Each of the connectors includes a first contact portion secured to the contact pad of the second substrate structure and a second contact portion inserted into each of the connection holes and making contact with the conductive layer. Accordingly, the second substrate structure may be prevented from being deformed by a vertical external force due to the connectors.
    • 在用于检查半导体器件和平板显示器件的探针卡中,提供了第一和第二衬底结构以及多个连接器。 第一基板结构具有多个连接孔。 导电层位于每个连接孔的内表面上并连接到第一衬底中的信号线。 第二基板结构在其上部具有接触垫,以及在其下部与检查对象接触的多个探针。 每个连接器包括固定到第二基板结构的接触焊盘的第一接触部分和插入到每个连接孔中并与导电层接触的第二接触部分。 因此,可以防止第二基板结构由于连接器而被垂直外力变形。
    • 5. 发明申请
    • DATA MONITORING SYSTEM IN COMMUNICATION NETWORK AND MONITORING METHOD THEREOF
    • 通信网络中的数据监控系统及其监控方法
    • WO2004038445A2
    • 2004-05-06
    • PCT/KR2003/002285
    • 2003-10-28
    • INNOWIRELESS CO., LTD.CHUNG, Joung-TaeJOUNG, Jin-SoupLEE, Jung-Hoon
    • CHUNG, Joung-TaeJOUNG, Jin-SoupLEE, Jung-Hoon
    • G01S
    • H04W24/00H04W24/08
    • A data monitoring system in communication network has a global position system (GPS) receiver, a packet data collecting device and a mobile station-packet data serving node monitoring system (MPMS). The GPS receiver provides time information which is received from the GPS satellite. The packet data collecting device collects the communication protocol and communication environment information between a base station and a packet data serving node (PDSN), together with the time information provided by the GPS receiver. The MPMS receives wireless communication environment, data communication environment and mobile communication protocol of the mobile station from the mobile station together with the GPS time information, and receives packet data communication environment and data communication protocol of the mobile station from the packet data collecting device together with the time information, and monitors and analyzes on a single time axis. Accordingly, wireless communication environment and data environment between mobile communication network and data communication network, can be monitored and analyzed on a single time axis.
    • 通信网络中的数据监控系统具有全球定位系统(GPS)接收机,分组数据采集装置和移动台分组数据服务节点监控系统(MPMS)。 GPS接收机提供从GPS卫星接收的时间信息。 分组数据收集装置与GPS接收机提供的时间信息一起收集基站与分组数据服务节点(PDSN)之间的通信协议和通信环境信息。 MPMS与GPS时间信息一起从移动站接收移动站的无线通信环境,数据通信环境和移动通信协议,并从分组数据采集设备一起接收移动站的分组数据通信环境和数据通信协议 与时间信息,并在单个时间轴上进行监视和分析。 因此,可以在单个时间轴上监视和分析移动通信网络和数据通信网络之间的无线通信环境和数据环境。