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1. 发明申请

WO2011139061A3 METHOD FOR ALIGNING SEMICONDUCTOR MATERIALS 审中-公开
标题翻译：用于对准半导体材料的方法
公开(公告)号：WO2011139061A3
公开(公告)日：2012-04-19
申请号：PCT/KR2011003268
申请日：2011-05-02
申请人： HANMI SEMICONDUCTOR CO LTD , LEE KYUNG SHIK , KO YOUNG IL , JUNG HYUN GYUN
发明人： LEE KYUNG SHIK , KO YOUNG IL , JUNG HYUN GYUN
IPC分类号： H01L21/68 , H01L21/50
CPC分类号： H01L21/681
摘要： The present invention relates to a method which enables the positions of semiconductor materials to be accurately aligned so as to accurately transfer the semiconductor materials to processing positions in an apparatus for manufacturing a semiconductor package. According to the present invention, a wafer-processing apparatus, such as a singulation apparatus or the like that cuts a wafer-type material, in which a plurality of semiconductor packages is arranged into a lattice, into individual semiconductor package units, achieves a novel alignment system in that the alignment relationship between the center of a dowel hole and the center of a semiconductor package is photographed by means of a vision camera, and the positions of the materials in the X-Y-è directions are accurately aligned so as to accurately transfer the materials to the processing positions. Therefore, the wafer-processing apparatus can be actively used in a novel aligning method such as wafer-level packaging or the like. Particularly, the present invention relates to a method for aligning semiconductor materials, which can avoid the influence of errors caused by the vibration of equipment, etc., and ensure accurate measurement values in order to accurately align the materials.
摘要翻译：本发明涉及一种能够使半导体材料的位置精确对准以便将半导体材料精确地传送到半导体封装制造装置中的处理位置的方法。根据本发明，将多个半导体封装被排列成格子的晶片型材料切割成单个半导体封装单元的诸如单片化装置等的晶片处理装置实现了新颖的对准系统，因为通过视觉摄像机对定位销孔的中心和半导体封装的中心之间的对准关系进行拍摄，并且XY-è方向上的材料位置准确对准，以便精确地传送材料处理位置。因此，可以以诸如晶片级封装等的新型对准方法主动使用晶片处理装置。特别地，本发明涉及半导体材料对准的方法，其可以避免由设备的振动引起的误差的影响等，并且确保准确的测量值以便准确地对准材料。

2. 发明申请

WO2009035259A3 APPARATUS FOR CUTTING PROCESSING MEMORY CARD 审中-公开
标题翻译：用于切割处理存储卡的设备
公开(公告)号：WO2009035259A3
公开(公告)日：2009-05-22
申请号：PCT/KR2008005338
申请日：2008-09-10
申请人： HANMI SEMICONDUCTOR CO LTD , JUNG HYUN GYUN , NA IK KYUN
发明人： JUNG HYUN GYUN , NA IK KYUN
IPC分类号： H01L21/677
CPC分类号： H05K3/0052 , B28D5/0082 , H05K3/0032 , H05K2201/09154 , H05K2201/10159 , H05K2203/0228
摘要： Disclosed is a memory card processing apparatus capable of conducting overall outline processing and chamfer processing of memory cards having a nonlinear portion by a single piece of equipment in a rapid and efficient manner. The apparatus includes a strip loading unit supplied with strips having a plurality of memory cards arranged on a frame; an outline processing unit for cutting the memory cards on the strip delivered from the strip loading unit along an outline so that the memory cards are singulated; a strip delivery picker for delivering the strip from the strip loading unit to the outline processing unit; a chamfer processing unit for processing a slanted chamfer on a lateral edge portion of the memory cards delivered from the outline processing unit; a unit picker for delivering the memory cards, outline processing of which has been completed, from the outline processing unit to the chamfer processing unit; an unloading unit for placing the memory cards, chamfer processing of which has been completed, delivered from the chamfer processing unit on a designated tray; and an unloading picker for delivering the memory cards from the chamfer processing unit to the unloading unit.
摘要翻译：公开了一种存储卡处理设备，其能够以快速和有效的方式通过单件设备对具有非线性部分的存储卡进行整体轮廓处理和倒角处理。该装置包括一个条带加载单元，该条带加载单元被提供有具有布置在框架上的多个存储卡的条带轮廓处理单元，用于沿着轮廓线切割从条带加载单元传送来的条带上的存储卡，以便存储卡被分割; 条带传送拾取器，用于将条带从条带加载单元传送到轮廓处理单元; 倒角处理单元，用于处理从所述轮廓处理单元递送的所述存储卡的横向边缘部分上的倾斜倒角; 一个单元选取器，用于从轮廓处理单元向倒角处理单元递送其轮廓处理已完成的存储卡; 卸载单元，用于将倒角处理已完成的存储卡放置在指定的托盘上; 以及用于将存储卡从倒角处理单元传送到卸载单元的卸载拾取器。

3. 发明申请

WO2009035259A2 APPARATUS FOR CUTTING PROCESSING MEMORY CARD 审中-公开
标题翻译：切割加工记忆卡的装置
公开(公告)号：WO2009035259A2
公开(公告)日：2009-03-19
申请号：PCT/KR2008/005338
申请日：2008-09-10
申请人： HANMI SEMICONDUCTOR CO., LTD. , JUNG, Hyun Gyun , NA, Ik Kyun
发明人： JUNG, Hyun Gyun , NA, Ik Kyun
IPC分类号： H01L21/677
CPC分类号： H05K3/0052 , B28D5/0082 , H05K3/0032 , H05K2201/09154 , H05K2201/10159 , H05K2203/0228
摘要： Disclosed is a memory card processing apparatus capable of conducting overall outline processing and chamfer processing of memory cards having a nonlinear portion by a single piece of equipment in a rapid and efficient manner. The apparatus includes a strip loading unit supplied with strips having a plurality of memory cards arranged on a frame; an outline processing unit for cutting the memory cards on the strip delivered from the strip loading unit along an outline so that the memory cards are singulated; a strip delivery picker for delivering the strip from the strip loading unit to the outline processing unit; a chamfer processing unit for processing a slanted chamfer on a lateral edge portion of the memory cards delivered from the outline processing unit; a unit picker for delivering the memory cards, outline processing of which has been completed, from the outline processing unit to the chamfer processing unit; an unloading unit for placing the memory cards, chamfer processing of which has been completed, delivered from the chamfer processing unit on a designated tray; and an unloading picker for delivering the memory cards from the chamfer processing unit to the unloading unit.
摘要翻译：公开了一种存储卡处理装置，其能够以快速且有效的方式通过单件设备对具有非线性部分的存储卡进行总体轮廓处理和倒角处理。该装置包括一个条带装载单元，该条带装载单元提供有布置在框架上的多个存储卡的条带; 轮廓处理单元，用于沿着轮廓切割从条带装载单元传送的条上的存储卡，使得存储卡被分割; 用于将带材从带材加载单元传送到轮廓处理单元的条带递送选择器; 倒角处理单元，用于处理从轮廓处理单元传送的存储卡的侧边缘部分上的倾斜倒角; 用于将从轮廓处理单元到倒角处理单元的存储卡的轮廓处理完成的单元拾取器; 用于放置已经完成的倒角处理的存储卡的卸载单元从倒角处理单元在指定的托盘上传送; 以及用于将存储卡从倒角处理单元传送到卸载单元的卸载拾取器。

4. 发明申请

WO2006062307A1 SCRAP ELIMINATION APPARATUS 审中-公开
标题翻译：刮刀消除装置
公开(公告)号：WO2006062307A1
公开(公告)日：2006-06-15
申请号：PCT/KR2005/004044
申请日：2005-11-29
申请人： HANMI SEMICONDUCTOR CO., LTD. , JUNG, Hyun-Gyun , KWAK, Nho-Kwon
发明人： JUNG, Hyun-Gyun , KWAK, Nho-Kwon
IPC分类号： H01L21/301
CPC分类号： B28D5/0058 , B28D5/0082 , H05K3/0052
摘要： Disclosed is a scrap elimination apparatus of a sawing machine used for fabricating semi¬ conductor devices. The scrap elimination apparatus includes a guide duct for receiving and guiding the scraps, and a scrap discharge unit installed at a bottom surface of the guide duct in order to discharge the scraps while floating the scraps. The scraps introduced into the guide duct are discharged by the fluid, which upwardly sprays toward the scraps through the fluid spray holes, so the scraps are prevented from sticking to the guide plate or being embedded or caught in the pulley during the discharge process for the scraps. Thus, it is possible to easily discharge the straps without stopping the operation of the scrap elimination apparatus.
摘要翻译：公开了用于制造半导体器件的锯切机的废料消除装置。废料消除装置包括用于接收和引导废料的引导管道，以及安装在引导管的底表面处的废料排出单元，以便在废弃物的同时排出废料。引入引导管道的废料通过流体排出，流体通过流体喷射孔朝向废料向上喷射，从而防止废料在排放过程中粘附到引导板或嵌入或夹在滑轮中废料。因此，可以在不停止废料消除装置的操作的情况下容易地排出带子。

5. 发明申请

WO2009025471A3 APPARATUS FOR ATTACHING ADHESION FILM FOR MANUFACTURING SEMICONDUCTOR PACKAGES 审中-公开
标题翻译：用于制造半导体封装的粘合膜附件
公开(公告)号：WO2009025471A3
公开(公告)日：2009-04-16
申请号：PCT/KR2008004740
申请日：2008-08-14
申请人： HANMI SEMICONDUCTOR CO LTD , JUNG HYUN GYUN , KIM YOUNG HYUN , SHIN KYOUNG HYUN , JUNG HAE GEUN , JANG DONG KI
发明人： JUNG HYUN GYUN , KIM YOUNG HYUN , SHIN KYOUNG HYUN , JUNG HAE GEUN , JANG DONG KI
IPC分类号： H01L23/495 , G05D7/00
CPC分类号： B29C63/0047 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/75 , H01L2224/2919 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is an apparatus for attaching an adhesive film for manufacturing a semiconductor package, which automatically perform a process of attaching an adhesive film, which is used for adhesion of a different subplate, on one surface of a lead frame attached on a subplate. The apparatus includes a horizontal movement block installed to be horizontally moved by a linear movement device; a head block, which performs elevation movement on the horizontal movement block in up and down directions; a suction plate installed at a lower part of the head block in such a manner that the suction plate can rotate about a hinge shaft at a predetermined angel in up and down directions, the suction plate having a lower surface including a plurality of vacuum holes for vacuously sucking an adhesive film, wherein the apparatus sucks an adhesive film from an adhesive film stacking part, on which adhesive films are stacked, moves to a work table where the attachment object to be attached to the adhesive film is seated, and attaches the adhesive film to the attachment object on the work table.
摘要翻译：公开了一种用于连接用于制造半导体封装的粘合剂膜的装置，其自动执行用于粘附不同副板的粘合剂膜附接在辅助板上的引线框架的一个表面上的工艺。该装置包括水平移动块，其被安装成由线性移动装置水平移动; 头块，其在上下方向上在水平运动块上执行升降运动; 该吸板安装在头部块的下部，使得吸板可以上下方向以预定角度围绕铰链轴转动，该吸板具有下表面，该下表面包括多个真空孔，用于真空吸附粘合剂膜，其中该装置从粘合剂膜层叠部分粘附粘合剂膜堆叠的粘合剂膜移动到待附着到粘合剂膜上的附着物就座的工作台上，并将粘合剂电影到工作台上的附件对象。

6. 发明申请

WO2009025471A2 APPARATUS FOR ATTACHING ADHESION FILM FOR MANUFACTURING SEMICONDUCTOR PACKAGES 审中-公开
标题翻译：附着用于制造半导体封装的粘合膜的装置
公开(公告)号：WO2009025471A2
公开(公告)日：2009-02-26
申请号：PCT/KR2008/004740
申请日：2008-08-14
申请人： HANMI SEMICONDUCTOR CO., LTD. , JUNG, Hyun Gyun , KIM, Young Hyun , SHIN, Kyoung Hyun , JUNG, Hae Geun , JANG, Dong Ki
发明人： JUNG, Hyun Gyun , KIM, Young Hyun , SHIN, Kyoung Hyun , JUNG, Hae Geun , JANG, Dong Ki
IPC分类号： H01L23/495 , G05D7/00
CPC分类号： B29C63/0047 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/75 , H01L2224/2919 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is an apparatus for attaching an adhesive film for manufacturing a semiconductor package, which automatically perform a process of attaching an adhesive film, which is used for adhesion of a different subplate, on one surface of a lead frame attached on a subplate. The apparatus includes a horizontal movement block installed to be horizontally moved by a linear movement device; a head block, which performs elevation movement on the horizontal movement block in up and down directions; a suction plate installed at a lower part of the head block in such a manner that the suction plate can rotate about a hinge shaft at a predetermined angel in up and down directions, the suction plate having a lower surface including a plurality of vacuum holes for vacuously sucking an adhesive film, wherein the apparatus sucks an adhesive film from an adhesive film stacking part, on which adhesive films are stacked, moves to a work table where the attachment object to be attached to the adhesive film is seated, and attaches the adhesive film to the attachment object on the work table.
摘要翻译：公开了一种用于附接用于制造半导体封装的粘合膜的设备，该设备自动执行将用于不同底板的粘合的粘合膜附着到引线的一个表面上的过程框架连接在一个底板上。该设备包括水平移动块，该水平移动块安装成通过线性移动装置水平移动; 在上下方向上进行水平移动块的仰角移动的头块; 吸板，其安装在头部块的下部，使得吸附板能够绕着铰链轴在上下方向上以预定的角度旋转，吸附板具有包括多个真空孔的下表面，真空吸附粘合膜，其中，所述设备从其上堆叠有粘合膜的粘合膜堆叠部吸取粘合膜，移动到将要附着到粘合膜的附着物安放到其上的工作台，并且将粘合剂胶片到工作台上的附件物体上。

7. 发明申请

WO2008044840A3 MACHINING APPARATUS AND SEMICONDUCTOR STRIP MACHINING SYSTEM USING THE SAME 审中-公开
标题翻译：加工设备和半导体条带加工系统
公开(公告)号：WO2008044840A3
公开(公告)日：2008-07-24
申请号：PCT/KR2007004871
申请日：2007-10-05
申请人： HANMI SEMICONDUCTOR CO LTD , NA IK KYUN , JUNG HYUN GYUN , YOUN WOONG HWAN
发明人： NA IK KYUN , JUNG HYUN GYUN , YOUN WOONG HWAN
IPC分类号： H01L21/00 , B28D5/00 , H01L21/68 , H01L21/78
CPC分类号： B28D1/30 , B23K26/0853 , B23K26/0876 , B28D1/221 , B28D5/0082
摘要： A machining apparatus and a semiconductor strip machining system are disclosed. The machining apparatus includes a chuck table unit (302) including a pair of chuck tables (304) simultaneously movable in an X-axis direction while being individually movable in Y-axis direction, and a cutting unit (320) for machining articles respectively seated on the chuck tables (304).
摘要翻译：公开了一种加工装置和半导体条加工系统。该加工装置包括夹盘台单元（302），该夹盘台单元（302）具有能够沿X轴方向同时移动的一对夹头台（304），同时沿Y轴方向移动;以及切割单元（320）在卡盘台（304）上。

8. 发明申请

WO2008044840A2 MACHINING APPARATUS AND SEMICONDUCTOR STRIP MACHINING SYSTEM USING THE SAME 审中-公开
标题翻译：加工设备和半导体条带加工系统
公开(公告)号：WO2008044840A2
公开(公告)日：2008-04-17
申请号：PCT/KR2007/004871
申请日：2007-10-05
申请人： HANMISEMICONDUCTOR CO., LTD , NA, Ik Kyun , JUNG, Hyun Gyun , YOUN, Woong Hwan
发明人： NA, Ik Kyun , JUNG, Hyun Gyun , YOUN, Woong Hwan
IPC分类号： H01L21/00 , H01L21/68 , H01L21/78 , B28D5/00
CPC分类号： B28D1/30 , B23K26/0853 , B23K26/0876 , B28D1/221 , B28D5/0082
摘要： A machining apparatus and A semiconductor strip machining system are disclosed. The machining apparatus includes a chuck table unit including a pair of chuck tables simultaneously movable in an X-axis direction while being individually movable in an Y-axis direction; and a cutting unit for machining articles respectively seated on the chuck tables.
摘要翻译：公开了一种加工装置和A半导体条加工系统。该加工装置包括：卡盘台单元，其具有能够沿X轴方向同时移动的一对卡盘台，同时沿Y轴方向移动; 以及用于加工分别安置在卡盘台上的物品的切割单元。

9. 发明申请

WO2012005453A2 METHOD FOR VISION INSPECTING SEMICONDUCTOR PACKAGES 审中-公开
标题翻译：视觉检测半导体封装的方法
公开(公告)号：WO2012005453A2
公开(公告)日：2012-01-12
申请号：PCT/KR2011004354
申请日：2011-06-14
申请人： HANMI SEMICONDUCTOR CO LTD , JUNG HYUN GYUN , BONG SOON KEE
发明人： JUNG HYUN GYUN , BONG SOON KEE
IPC分类号： H01L21/66
CPC分类号： G01N21/95
摘要： The present invention relates to a method for vision inspecting semiconductor packages. The method for vision inspecting semiconductor packages according to the present invention is a method for vision inspecting a semiconductor package in an apparatus for manufacturing the semiconductor package including: a table having the inspection target semiconductor packages put thereon; a picker including a plurality of pick-up members allowing gap adjustment and the fixing of the semiconductor package; and a vision camera shooting the semiconductor package fixed by the picker. The method includes the steps of: (a) picking up, by the picker, a plurality of semiconductor packages on a table in a state where the space between the pick-up members of the picker is a first pitch; (b) varying the space between the pick-up members of the picker to a second pitch smaller than the first pitch; and (c) shooting, by the vision camera, the semiconductor packages fixed by the picker, wherein the picker and the vision camera move relative to each other without pause.
摘要翻译：本发明涉及一种用于视觉检查半导体封装的方法。根据本发明的用于视觉检查半导体封装的方法是用于在用于制造半导体封装的装置中的半导体封装的视觉检查方法，包括：放置有检查对象半导体封装的工作台; 拾取器，包括允许间隙调节和半导体封装的固定的多个拾取构件; 以及拍摄由拾取器固定的半导体封装的视觉摄像机。该方法包括以下步骤：（a）拾取器在拾取器的拾取构件之间的空间为第一间距的状态下拾取台上的多个半导体封装; （b）将拾取器的拾取构件之间的空间改变为小于第一间距的第二间距; 以及（c）由视觉摄像机拍摄由拾取器固定的半导体封装，其中拾取器和视觉相机相对于彼此移动而没有暂停。

10. 发明申请

WO2011010821A3 CLAMP FOR INGOT SQUARING AND GRINDING EQUIPMENT 审中-公开
标题翻译：用于脚踏和磨削设备的夹钳
公开(公告)号：WO2011010821A3
公开(公告)日：2011-06-03
申请号：PCT/KR2010004490
申请日：2010-07-09
申请人： HANMI SEMICONDUCTOR CO LTD , JUNG HYUN GYUN , NA IK KYUN , PARK JU HO
发明人： JUNG HYUN GYUN , NA IK KYUN , PARK JU HO
IPC分类号： H01L21/687 , H01L21/30 , H01L21/304
CPC分类号： B28D5/0088 , B24B5/02
摘要： The present invention relates to a clamp for holding ingots, which are used as materials for solar cells, when the ingots are being processed in squaring and grinding processing equipment. The present invention provides a clamp for ingot squaring and grinding equipment which implements a novel form of clamping method in which the centre of rotation of a clamp chuck in contact with the end of an ingot is pulled towards the ingot to the maximum extent and is set substantially in a position in contact with the end of the ingot during clamping for the purpose of ingot processing, thereby making it possible to reduce product defects to zero even when the end of the ingot is tilted, since the centre of the ingot and the centre of the clamp can be accurately aligned, and ultimately the ingot can be subjected to accurate squaring, surface grinding and cylindrical grinding processing.
摘要翻译：本发明涉及一种用于保持铸锭的夹具，当在方形和磨削加工设备中加工铸锭时，该铸锭用作太阳能电池的材料。本发明提供了一种用于晶锭研磨和研磨设备的夹具，其实现了一种新型的夹紧方法，其中与晶锭端部接触的夹具卡盘的旋转中心被最大程度地拉向晶锭并被设定基本上在为了铸锭加工而进行夹紧期间与铸锭的端部接触的位置，从而使得即使当铸锭的端部倾斜时也能够将产品缺陷减少到零，因为铸锭的中心和中心的夹具可以精确对准，并且最终可以对铸锭进行精确的平方，平面磨削和外圆磨削加工。

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