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1. 发明申请

WO2006016257A1 PROGRESSIVE UNPLUGGING MULTI-CARDS BODY 审中-公开
标题翻译：积极发展的多媒体体系
公开(公告)号：WO2006016257A1
公开(公告)日：2006-02-16
申请号：PCT/IB2005/002377
申请日：2005-08-08
申请人： AXALTO SA , FROGER, Alexis , GROENINCK, Denis , LE LOC'H, Alain , NEROT, Dorothée , REIGNOUX, Yves , ROUSSEL, François , PROVOST, Stéphane
发明人： FROGER, Alexis , GROENINCK, Denis , LE LOC'H, Alain , NEROT, Dorothée , REIGNOUX, Yves , ROUSSEL, François , PROVOST, Stéphane
IPC分类号： G06K19/077
CPC分类号： G06K19/07739 , G06K19/077 , G06K19/07728 , G06K19/07745 , H01L2924/0002 , Y10T29/49117 , H01L2924/00
摘要： A card body comprises a first card body (ID-1 card 1), a second card body (plug-in card 2) and a third card body (mini card 3). The first card body has a first shape (ID-1 shape). The second card body comprises a second shape (plug-in shape). The first card body encompasses the second card body. The third card body comprises a third shape (mini shape). The second card body encompasses the third card body. The third card body has a cavity for receiving an electronic module. A first boundary separates the first shape (ID-1 shape) from the second shape (plug-in shape), and comprises a first number of apertures (5, 6, 7, 17, 18) and a first number of notches (19 and 20) defining a first mechanical inter-card body coupling strength (link between ID-1 card 1 and plug-in card 2). A second boundary separates the second shape (plug-in shape) from the third shape (mini shape), and comprises a second number of apertures (21) and a second number of notches (11, 12, 13, 14, 15, 16) defining a second mechanical inter-card body coupling strength (link between plug-in card 2 and mini card 3). A cumulated length of the first number of apertures (5, 6, 7, 17, 18) is greater than a cumulated length of the second number of apertures (21) and a cumulated length of the first number of notches (19 and 20) is lesser than a cumulated length of the second number of notches (11, 12, 13, 14, 15, 16) so that the second mechanical coupling strength is greater than the first mechanical coupling strength.
摘要翻译：卡体包括第一卡体（ID-1卡1），第二卡体（插卡2）和第三卡体（小卡3）。第一卡体具有第一形状（ID-1形状）。第二卡体包括第二形状（插件形状）。第一个卡体包含第二个卡体。第三卡体包括第三形状（迷你形状）。第二个卡体包含第三个卡体。第三卡体具有用于接收电子模块的空腔。第一边界将第一形状（ID-1形状）与第二形状（插入形状）分开，并且包括第一数量的孔（5,6,7,17,18）和第一数量的凹口（19 和20）限定第一机械卡间体耦合强度（ID-1卡1和插入卡2之间的链接）。第二边界将第二形状（插入形状）与第三形状（迷你形状）分开，并且包括第二数量的孔（21）和第二数量的凹口（11,12,13,14,15,16））定义第二机械卡间体耦合强度（插入卡2和迷你卡3之间的链接）。第一数量的孔（5,6,7,17,18）的累积长度大于第二数量的孔（21）的累积长度和第一数量的凹口（19和20）的累积长度，小于第二数量的凹口（11,12,13,14,15,16）的累积长度，使得第二机械耦合强度大于第一机械耦合强度。

2. 发明申请

WO2005062246A1 IDENTIFICATION DOCUMENT 审中-公开
标题翻译：识别文件
公开(公告)号：WO2005062246A1
公开(公告)日：2005-07-07
申请号：PCT/IB2004/004202
申请日：2004-12-20
申请人： AXALTO SA , REIGNOUX, Yves , CHERAMY, Séverine , THEVENOT, Benoît , LEIBENGUTH, Joseph , GROENINCK, Denis , LAFON, Jean-Pierre
发明人： REIGNOUX, Yves , CHERAMY, Séverine , THEVENOT, Benoît , LEIBENGUTH, Joseph , GROENINCK, Denis , LAFON, Jean-Pierre
IPC分类号： G06K19/077
CPC分类号： G06K19/07749 , G06K19/025 , G06K19/07722 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/01077 , H01L2924/3025 , H01L2924/00014
摘要： The invention relates to an identification document (21) and a method for making such a document. According to the invention, the identification document (21) comprises at least one flexible cover layer (25), at least one flexible internal page (22) and an electronic module (26) including a flexible support layer, an antenna positioned onto said flexible support layer and an electronic radio frequency microcontroller storing identification data, said microcontroller being affixed to said flexible support layer and electrically connected to said antenna, said module (26) being affixed to said flexible layer cover layer (25) or to said flexible internal page (22). The invention relates more particularly to electronic passports and visas.
摘要翻译：本发明涉及一种识别文件（21）及其制作方法。根据本发明，识别文件（21）包括至少一个柔性覆盖层（25），至少一个柔性内部页面（22）和包括柔性支撑层的电子模块（26），位于所述柔性覆盖层支撑层和存储识别数据的电子射频微控制器，所述微控制器固定到所述柔性支撑层并电连接到所述天线，所述模块（26）固定到所述柔性层覆盖层（25）或所述柔性内部页面（22）。本发明更具体地涉及电子护照和签证。

3. 发明申请

WO2006008647A1 DOUBLE-SIDED CHIP CARD MODULE WITH SINGLE-SIDE TESTING CAPABILITIES 审中-公开
标题翻译：具有单面测试能力的双面芯片卡模块
公开(公告)号：WO2006008647A1
公开(公告)日：2006-01-26
申请号：PCT/IB2005/002211
申请日：2005-07-11
申请人： AXALTO SA , REIGNOUX, Yves , DELOCHE, Manuel , THEVENOT, Benoît , NEROT, Dorothée , GROENINCK, Denis , BREL, Marie-Cécile
发明人： REIGNOUX, Yves , DELOCHE, Manuel , THEVENOT, Benoît , NEROT, Dorothée , GROENINCK, Denis , BREL, Marie-Cécile
IPC分类号： G06K19/077
CPC分类号： G06K19/077
摘要： The chip card module, when in an intermediate condition, comprises: a double-sided dielectric layer (10) with conductive patterns formed on both sides; a chip (12) supported on the backside (14) of said dielectric layer; first contact pads (20) arranged on the frontside (16) of said dielectric layer; and second contact pads (24) arranged on the backside (14) of said dielectric layer. The chip (12) and first (20) and second (24) contact pads are located within a peripheral cutout line (22) adapted to define the outer shape of the module in a further manufacturing condition after punching the dielectric layer along said line. A plurality of via holes (30) are formed through the dielectric layer at respective hole locations arranged beyond the cutout line, along with corresponding test pads (26) each formed on the frontside (16) so as to extend over a respective via hole and connected to a respective first contact pad (20). This enables simultaneous electrical access from the backside (14), in particular for test probes (32, 34), both i) directly to the second contact pads (24) and ii) indirectly to the first contact pads (20) by way of the test pads (26) being accessed at the bottom of the via holes (30).
摘要翻译：当处于中间状态时，芯片卡模块包括：在两侧形成有导电图案的双面电介质层（10）; 支撑在所述电介质层的背面（14）上的芯片（12）; 布置在所述电介质层的前侧（16）上的第一接触焊盘（20）和布置在所述电介质层的背面（14）上的第二接触焊盘（24）。芯片（12）和第一（20）和第二（24）接触焊盘位于外围切口线（22）内，适于在沿着所述线冲压电介质层之后的另一制造条件中限定模块的外形。多个通孔（30）通过布置在切口线以外的相应孔位置处的介电层形成，以及各自形成在前侧（16）上的相应的测试垫（26），以便在相应的通孔上延伸，连接到相应的第一接触焊盘（20）。这使得能够从背面（14），特别是用于测试探针（32,34）的同时电气接入，i）直接连接到第二接触焊盘（24），以及ii）通过以下方式间接地连接到第一接触焊盘（20）所述测试焊盘（26）在所述通孔（30）的底部被访问。

4. 发明申请

WO2004073062A2 METHOD OF MANUFACTURING A SLICE OF SEMICONDUCTOR 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：WO2004073062A2
公开(公告)日：2004-08-26
申请号：PCT/IB2004/000335
申请日：2004-02-10
申请人： AXALTO SA , SCHLUMBERGER MALCO, INC , AUDOUX, Jean-Noël , GROENINCK, Denis
发明人： AUDOUX, Jean-Noël , GROENINCK, Denis
IPC分类号： H01L23/31
CPC分类号： H01L23/562 , H01L21/563 , H01L23/3114 , H01L2224/73203 , H01L2924/3025
摘要： The invention concerns a method of manufacturing a slice of semiconductor. The slice of semiconductor comprises an active face and an inactive face. A 5 passivation layer is deposited on the active face. The method comprises an organic-layer-depositing step, in which an organic layer is deposited on the inactive face of slice of semiconductor.
摘要翻译：本发明涉及制造半导体薄片的方法。半导体层包括主动面和非活动面。钝化层5沉积在主动面上。该方法包括有机层沉积步骤，其中有机层沉积在半导体薄片的无源面上。

5. 发明申请

WO2007091158A1 PORTABLE OBJECT HAVING A CONTACT INTERFACE, AND COLORATION OF CONTACT INTERFACE 审中-公开
标题翻译：具有接触界面的便携式对象和接触界面的着色
公开(公告)号：WO2007091158A1
公开(公告)日：2007-08-16
申请号：PCT/IB2007/000300
申请日：2007-02-08
申请人： AXALTO SA , GROENINCK, Denis , WELSCH, Pierre-Alois , FORTEL, Julien
发明人： GROENINCK, Denis , WELSCH, Pierre-Alois , FORTEL, Julien
IPC分类号： G06K1/12 , G06K19/077
CPC分类号： G06K1/126 , G06K19/07743
摘要： The invention relates to a portable object having at least a contact interface flushing its surface, and to the coloration of such contact interface (10, 11). The method of coloration comprises the steps of : - applying a conductive coloured layer comprising a ITO ceramic on the whole surface of the contact interface (10, 11) and, - removing the applied layer at least in spaces (15) between the contacts (13) of the contact interface.
摘要翻译：本发明涉及至少具有冲洗其表面的接触界面以及这种接触界面（10,11）着色的便携式物体。着色方法包括以下步骤： - 在接触界面（10,11）的整个表面上施加包含ITO陶瓷的导电着色层，以及至少在触点之间的空间（15）中去除所施加的层（ 13）接触界面。

6. 发明申请

WO2006005985A1 CONTACTLESS IDENTIFICATION DEVICE 审中-公开
标题翻译：无连接识别设备
公开(公告)号：WO2006005985A1
公开(公告)日：2006-01-19
申请号：PCT/IB2005/001061
申请日：2005-04-14
申请人： AXALTO SA , CHERAMY, Séverine , LEIBENGUTH, Joseph , REIGNOUX, Yves , GROENINCK, Denis
发明人： CHERAMY, Séverine , LEIBENGUTH, Joseph , REIGNOUX, Yves , GROENINCK, Denis
IPC分类号： G06K19/077
CPC分类号： G06K19/07749 , B42D25/24 , G06K19/025 , G06K19/073 , G06K19/07327 , G06K19/07372 , G06K19/07381 , G06K19/07722 , G06K19/07745 , H01L2924/0002 , H01Q1/2208 , H01Q1/526 , H01Q7/00 , H04K3/68 , H04K3/86 , H04K2203/20 , H01L2924/00
摘要： The invention relates to a contactless identification device (29) and a method for making such a device. According to the invention, the contactless identification device (29) comprises at least two flexible external layers (23, 24) and an electronic module (21) including a flexible support layer, an antenna positioned onto said flexible support layer and an electronic radio frequency microcontroller storing identification data, said microcontroller being affixed to said flexible support layer and electrically connected to said antenna, said module (21) being affixed to said flexible layer external layers (23, 24). The invention relates more particularly to electronic contactless identification smart cards.
摘要翻译：本发明涉及无接触识别装置（29）和制造这种装置的方法。根据本发明，非接触识别装置（29）包括至少两个柔性外层（23,24）和包括柔性支撑层的电子模块（21），位于所述柔性支撑层上的天线和电子射频微控制器存储识别数据，所述微控制器固定到所述柔性支撑层并电连接到所述天线，所述模块（21）固定到所述柔性层外层（23,24）。本发明更具体地涉及电子非接触识别智能卡。

7. 发明申请

WO2004105132A1 AN ELECTRICAL CONNECTION FOR A MICROELECTRONIC CHIP, AND A METHOD FOR MANUFACTURING SUCH A CONNECTION 审中-公开
标题翻译：用于微电子芯片的电气连接以及用于制造这种连接的方法
公开(公告)号：WO2004105132A1
公开(公告)日：2004-12-02
申请号：PCT/IB2004/001596
申请日：2004-05-18
申请人： AXALTO SA , SCHLUMBERGER MALCO, INC. , GROENINCK, Denis , BONVALOT, Béatrice
发明人： GROENINCK, Denis , BONVALOT, Béatrice
IPC分类号： H01L23/485
CPC分类号： H01L24/85 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L2224/0231 , H01L2224/02317 , H01L2224/04042 , H01L2224/05073 , H01L2224/05155 , H01L2224/05554 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/32145 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/48453 , H01L2224/48465 , H01L2224/48475 , H01L2224/48477 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48669 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/73265 , H01L2224/85051 , H01L2224/85205 , H01L2225/06527 , H01L2225/06568 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2224/78 , H01L2924/00 , H01L2224/48869 , H01L2924/00015
摘要： An electrical connection for a microelectronic chip, and a method for manufacturing such a connection. A method of manufacturing an electrical connection for a microelectronic chip, the microelectronic chip 3, 13, 23, 33 comprises at least one connection pad of reduced size 2, 2A, 2B, 2C, 2D, wherein the method of manufacturing comprises the steps of: - adding an additional layer 11, 11',11", 11A, 11B on the at least one connection pad, - bonding a wire 8 on the additional layer.
摘要翻译：微电子芯片的电连接，以及制造这种连接的方法。一种制造微电子芯片的电连接的方法，微电子芯片3,13,23,33包括至少一个尺寸减小的2A，2B，2C，2D的连接焊盘，其中制造方法包括以下步骤：： - 在所述至少一个连接焊盘上添加附加层11,11'，11“，11A，11B， - 将所述附加层上的导线8接合。

8. 发明申请

WO2004073062A3 METHOD OF MANUFACTURING A REINFORCED SEMICONDUCTOR WAFER 审中-公开
标题翻译：制造增强半导体波长的方法
公开(公告)号：WO2004073062A3
公开(公告)日：2004-10-21
申请号：PCT/IB2004000335
申请日：2004-02-10
申请人： AXALTO SA , SCHLUMBERGER MALCO INC , AUDOUX JEAN-NOEL , GROENINCK DENIS
发明人： AUDOUX JEAN-NOEL , GROENINCK DENIS
IPC分类号： H01L21/56 , H01L23/00 , H01L23/31
CPC分类号： H01L23/562 , H01L21/563 , H01L23/3114 , H01L2224/73203 , H01L2924/3025
摘要： The invention concerns a method of manufacturing a slice of semiconductor. The slice of semiconductor comprises an active face and an inactive face. A passivation layer (pass) is deposited on the active face. The method comprises an organic-layer-depositing step, in which an organic layer (ORGA1) is deposited on the inactive face of slice of semiconductor.
摘要翻译：本发明涉及制造半导体薄片的方法。半导体层包括主动面和非活动面。钝化层（通过）沉积在主动面上。该方法包括有机层沉积步骤，其中有机层（ORGA1）沉积在半导体薄片的无源面上。

9. 发明申请

WO2004063980A1 MODULE FOR A HYBRID CARD 审中-公开
标题翻译：混合卡模块
公开(公告)号：WO2004063980A1
公开(公告)日：2004-07-29
申请号：PCT/IB2004/000015
申请日：2004-01-08
申请人： SCHLUMBERGER SYSTEMES , SCHLUMBERGER MALCO, INC. , GROENINCK, Denis , BREL, Marie-Cécile
发明人： GROENINCK, Denis , BREL, Marie-Cécile
IPC分类号： G06K19/077
CPC分类号： G06K19/07747 , G06K19/072 , G06K19/07743 , G06K19/0775 , G06K19/07769 , H01L23/49838 , H01L23/49855 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/32225 , H01L2224/48137 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H05K1/183 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor assembly comprises a support layer, a first integrated circuit and a second integrated circuit. The support layer comprises a first side and a second side. The first side comprises a set of contact pads. The second side comprises a set of predefined areas. The set of predefined areas comprises a main predefined area and a plurality of auxiliary predefined areas. Each auxiliary predefined area comprises a connection hole. A connection hole is connected to a contact pad. The first integrated circuit comprises at least one connection pad connected to at least one auxiliary area with connecting means. The second integrated circuit comprises at least one connection pad connected to at least one auxiliary area with connecting means. The second integrated circuit is located onto the main predefined area.
摘要翻译：半导体组件包括支撑层，第一集成电路和第二集成电路。支撑层包括第一侧和第二侧。第一侧包括一组接触垫。第二面包括一组预定义的区域。该组预定义区域包括主预定义区域和多个辅助预定区域。每个辅助预定区域包括连接孔。连接孔连接到接触垫。第一集成电路包括至少一个与连接装置连接到至少一个辅助区域的连接焊盘。第二集成电路包括至少一个与连接装置连接到至少一个辅助区域的连接焊盘。第二个集成电路位于主要预定区域。

10. 发明申请

WO2006005984A1 SHIELDED CONTACTLESS ELECTRONIC DOCUMENT 审中-公开
标题翻译：屏蔽接触式电子文件
公开(公告)号：WO2006005984A1
公开(公告)日：2006-01-19
申请号：PCT/IB2005/000861
申请日：2005-04-01
申请人： AXALTO SA , AXALTO INC. , BOMBAY, Bart , PATTINSON, Neville , KRISHNA, Ksheerabdhi , REIGNOUX, Yves , CHERAMY, Severine , LEIBENGUTH, Joseph , GROENINCK, Denis , LAFON, Jean-Pierre
发明人： BOMBAY, Bart , PATTINSON, Neville , KRISHNA, Ksheerabdhi , REIGNOUX, Yves , CHERAMY, Severine , LEIBENGUTH, Joseph , GROENINCK, Denis , LAFON, Jean-Pierre
IPC分类号： G06K19/077
CPC分类号： G06K19/07749 , B42D25/24 , G06K19/025 , G06K19/073 , G06K19/07327 , G06K19/07372 , G06K19/07381 , G06K19/07722 , G06K19/07745 , H01L2924/0002 , H01Q1/2208 , H01Q1/526 , H01Q7/00 , H04K3/68 , H04K3/86 , H04K2203/20 , H01L2924/00
摘要： The invention relates to a document comprising a cover (1), at least one internal page (2-1, 2-2, 2-3), a radiofrequency microcontroller (3) and an antenna (4) electrically connected to contact pads of said microcontroller (3). The invention is characterised in that said document further comprises an electromagnetic shield (6) capable of disrupting, at least partially, the wireless communication with said microcontroller when the document is closed. The invention applies, in particular, to an electronic passport.
摘要翻译：本发明涉及一种文件，其包括盖（1），至少一个内部页（2-1,2-2,2-3），射频微控制器（3）和天线（4），电气连接到所述微控制器（3）。本发明的特征在于，所述文件还包括电磁屏蔽（6），其能够在所述文档关闭时至少部分地中断与所述微控制器的无线通信。本发明尤其适用于电子护照。

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