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1. 发明申请

WO2006008647A1 DOUBLE-SIDED CHIP CARD MODULE WITH SINGLE-SIDE TESTING CAPABILITIES 审中-公开
标题翻译：具有单面测试能力的双面芯片卡模块
公开(公告)号：WO2006008647A1
公开(公告)日：2006-01-26
申请号：PCT/IB2005/002211
申请日：2005-07-11
申请人： AXALTO SA , REIGNOUX, Yves , DELOCHE, Manuel , THEVENOT, Benoît , NEROT, Dorothée , GROENINCK, Denis , BREL, Marie-Cécile
发明人： REIGNOUX, Yves , DELOCHE, Manuel , THEVENOT, Benoît , NEROT, Dorothée , GROENINCK, Denis , BREL, Marie-Cécile
IPC分类号： G06K19/077
CPC分类号： G06K19/077
摘要： The chip card module, when in an intermediate condition, comprises: a double-sided dielectric layer (10) with conductive patterns formed on both sides; a chip (12) supported on the backside (14) of said dielectric layer; first contact pads (20) arranged on the frontside (16) of said dielectric layer; and second contact pads (24) arranged on the backside (14) of said dielectric layer. The chip (12) and first (20) and second (24) contact pads are located within a peripheral cutout line (22) adapted to define the outer shape of the module in a further manufacturing condition after punching the dielectric layer along said line. A plurality of via holes (30) are formed through the dielectric layer at respective hole locations arranged beyond the cutout line, along with corresponding test pads (26) each formed on the frontside (16) so as to extend over a respective via hole and connected to a respective first contact pad (20). This enables simultaneous electrical access from the backside (14), in particular for test probes (32, 34), both i) directly to the second contact pads (24) and ii) indirectly to the first contact pads (20) by way of the test pads (26) being accessed at the bottom of the via holes (30).
摘要翻译：当处于中间状态时，芯片卡模块包括：在两侧形成有导电图案的双面电介质层（10）; 支撑在所述电介质层的背面（14）上的芯片（12）; 布置在所述电介质层的前侧（16）上的第一接触焊盘（20）和布置在所述电介质层的背面（14）上的第二接触焊盘（24）。芯片（12）和第一（20）和第二（24）接触焊盘位于外围切口线（22）内，适于在沿着所述线冲压电介质层之后的另一制造条件中限定模块的外形。多个通孔（30）通过布置在切口线以外的相应孔位置处的介电层形成，以及各自形成在前侧（16）上的相应的测试垫（26），以便在相应的通孔上延伸，连接到相应的第一接触焊盘（20）。这使得能够从背面（14），特别是用于测试探针（32,34）的同时电气接入，i）直接连接到第二接触焊盘（24），以及ii）通过以下方式间接地连接到第一接触焊盘（20）所述测试焊盘（26）在所述通孔（30）的底部被访问。

2. 发明申请

WO2005062246A1 IDENTIFICATION DOCUMENT 审中-公开
标题翻译：识别文件
公开(公告)号：WO2005062246A1
公开(公告)日：2005-07-07
申请号：PCT/IB2004/004202
申请日：2004-12-20
申请人： AXALTO SA , REIGNOUX, Yves , CHERAMY, Séverine , THEVENOT, Benoît , LEIBENGUTH, Joseph , GROENINCK, Denis , LAFON, Jean-Pierre
发明人： REIGNOUX, Yves , CHERAMY, Séverine , THEVENOT, Benoît , LEIBENGUTH, Joseph , GROENINCK, Denis , LAFON, Jean-Pierre
IPC分类号： G06K19/077
CPC分类号： G06K19/07749 , G06K19/025 , G06K19/07722 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/01077 , H01L2924/3025 , H01L2924/00014
摘要： The invention relates to an identification document (21) and a method for making such a document. According to the invention, the identification document (21) comprises at least one flexible cover layer (25), at least one flexible internal page (22) and an electronic module (26) including a flexible support layer, an antenna positioned onto said flexible support layer and an electronic radio frequency microcontroller storing identification data, said microcontroller being affixed to said flexible support layer and electrically connected to said antenna, said module (26) being affixed to said flexible layer cover layer (25) or to said flexible internal page (22). The invention relates more particularly to electronic passports and visas.
摘要翻译：本发明涉及一种识别文件（21）及其制作方法。根据本发明，识别文件（21）包括至少一个柔性覆盖层（25），至少一个柔性内部页面（22）和包括柔性支撑层的电子模块（26），位于所述柔性覆盖层支撑层和存储识别数据的电子射频微控制器，所述微控制器固定到所述柔性支撑层并电连接到所述天线，所述模块（26）固定到所述柔性层覆盖层（25）或所述柔性内部页面（22）。本发明更具体地涉及电子护照和签证。

3. 发明申请

WO2005034031A1 IDENTIFICATION DOCUMENT 审中-公开
标题翻译：识别文件
公开(公告)号：WO2005034031A1
公开(公告)日：2005-04-14
申请号：PCT/IB2004/003174
申请日：2004-09-29
申请人： AXALTO SA , REIGNOUX, Yves , CHERAMY, Séverine , THEVENOT, Benoît , LEIBENGUTH, Joseph , GROENINCK, Denis
发明人： REIGNOUX, Yves , CHERAMY, Séverine , THEVENOT, Benoît , LEIBENGUTH, Joseph , GROENINCK, Denis
IPC分类号： G06K19/077
CPC分类号： G06K19/025
摘要： The invention relates to an identification document (21) and a method for making the same. According to the invention, the identification document (21) comprises at least one paper or paperboard flexible layer (22, 25) and an electronic module (26) including a flexible support layer, an antenna positioned onto said flexible support layer and an electronic radio frequency microcontroller storing identification data, said microcontroller being affixed to said flexible support layer and electrically connected to said antenna, said module (26) being affixed to said paper or paperboard flexible layer (22, 25). The invention relates more particularly to electronic passports and visas.
摘要翻译：本发明涉及一种识别文件（21）及其制作方法。根据本发明，识别文件（21）包括至少一个纸或纸板柔性层（22,25）和包括柔性支撑层的电子模块（26），定位在所述柔性支撑层上的天线和电子无线电频率微控制器存储识别数据，所述微控制器固定到所述柔性支撑层并电连接到所述天线，所述模块（26）固定在所述纸或纸板柔性层（22,25）上。本发明更具体地涉及电子护照和签证。

4. 发明申请

WO2004027867A1 METHOD OF MANUFACTURING A WAFER ASSEMBLY 审中-公开
标题翻译：制造水轮组件的方法
公开(公告)号：WO2004027867A1
公开(公告)日：2004-04-01
申请号：PCT/IB2003/004012
申请日：2003-09-17
申请人： SCHLUMBERGER SYSTÈMES , SCHLUMBERGER MALCO INC. , LEIBENGUTH, Joseph , BONVALOT, Béatrice , THEVENOT, Benoît , LEMOULLEC, Laurent , DEPOUTOT, Frédéric , REIGNOUX, Yves
发明人： LEIBENGUTH, Joseph , BONVALOT, Béatrice , THEVENOT, Benoît , LEMOULLEC, Laurent , DEPOUTOT, Frédéric , REIGNOUX, Yves
IPC分类号： H01L23/58
CPC分类号： G06K19/07747 , G06K19/072 , G06K19/077 , G06K19/07745 , G06K19/07749 , G06K19/0775 , G06K19/07769 , H01L21/50 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48091 , H01L2924/00014 , H01L2924/01055 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A method of manufacturing a wafer assembly comprising a chip wafer onto which a cover wafer is deposited, the chip wafer comprising an active face and an inactive face, the active face comprising chip elements, the cover wafer being provided with a chip-element-receiving cavity located above a chip element, comprises the following steps: - a cover-wafer-depositing step, in which a cover wafer is deposited on the active face so as to obtain a wafer assembly, the cover wafer being provided with a plurality of chip-receiving cavities, a chip-receiving cavity being located above a chip element, the cover wafer being made of an organic material; - a wafer assembly thinning step, in which the inactive face of the chip wafer is thinned; - an assembling step, in which a chip is placed in the cavity of the cover wafer stacked above the chip wafer.
摘要翻译：一种制造晶片组件的方法，其包括沉积有盖晶片的芯片晶片，所述芯片晶片包括有源面和非活性面，所述有源面包括芯片元件，所述盖晶片设置有芯片元件接收位于芯片元件上方的腔体包括以下步骤： - 覆盖晶片沉积步骤，其中覆盖晶片沉积在有源面上以获得晶片组件，盖晶片设置有多个芯片接收腔，位于芯片元件上方的芯片接收腔，盖晶片由有机材料制成; - 晶片组件变薄步骤，其中所述芯片晶片的非活性面变薄; - 组装步骤，其中将芯片放置在堆叠在晶片晶片上方的覆盖晶片的空腔中。

5. 发明申请

WO2002071328A1 CARTE A PUCE AVEC ALIMENTATION EN ERERGIE INTEGREE 审中-公开
公开(公告)号：WO2002071328A1
公开(公告)日：2002-09-12
申请号：PCT/IB2002/000636
申请日：2002-03-04
申请人： SCHLUMBERGER SYSTEMES , SCHLUMBERGER MALCO, INC , BORG, Norbert , THEVENOT, Benoît
发明人： BORG, Norbert , THEVENOT, Benoît
IPC分类号： G06K19/07
CPC分类号： G06K19/0705 , G06K19/0701 , G06K19/0723 , G06K19/07745 , G06K19/07769 , H01L2924/0002 , H01L2924/00
摘要： A portable object (1) comprises a circuit (22) for receiving information conveyed by an energy field and an internal energy source (18). The portable object (1) further comprises: a switch (24), that connects the circuit (22) to the internal energy source (18) when the switch (24) receives a control energy that is above a threshold level; and a switch controller (23) that substantially derives the control energy from the energy field.
摘要翻译：便携式物体（1）包括用于接收由能量场传送的信息的电路（22）和内部能量源（18）。便携式物体（1）还包括：当开关（24）接收到高于阈值水平的控制能量时，开关（24）将电路（22）连接到内部能量源（18）以及基本上从能量场导出控制能量的开关控制器（23）。

6. 发明申请

WO2004027863A2 HYBRID CARD 审中-公开
标题翻译：混合卡
公开(公告)号：WO2004027863A2
公开(公告)日：2004-04-01
申请号：PCT/IB2003/004011
申请日：2003-09-17
申请人： SCHLUMBERGER SYSTÈMES , SCHLUMBERGER MALCO INC., , THEVENOT, Benoît
发明人： THEVENOT, Benoît
IPC分类号： H01L23/00
CPC分类号： G06K19/07747 , G06K19/072 , G06K19/077 , G06K19/07745 , G06K19/07749 , G06K19/0775 , G06K19/07769 , H01L21/50 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/01055 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A card like object comprises a card body (3) comprising a first face. The first face is at least partially graphically personalized. An antenna (2) is embedded in the card body (3). The card body (3) is provided with a cavity. The cavity comprises a contact chip (6). The cavity further comprises a contactless chip (7), the contactless chip (7) being electrically connected to the antenna (2) with connecting means (9).
摘要翻译：类似卡片的卡片包括具有第一面的卡体（3）。第一张脸至少是部分图形化的个性化。天线（2）嵌入卡体（3）中。卡体（3）设有空腔。该空腔包括接触片（6）。腔体还包括非接触式芯片（7），非接触式芯片（7）通过连接装置（9）电连接到天线（2）。

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