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1. 发明申请

WO2012020073A2 RFID ANTENNA MODULES AND INCREASING COUPLING 审中-公开
标题翻译： RFID天线模块和增加耦合
公开(公告)号：WO2012020073A2
公开(公告)日：2012-02-16
申请号：PCT/EP2011/063806
申请日：2011-08-11
申请人： FÉINICS AMATECH TEORANTA LIMITED , FINN, David
发明人： FINN, David
IPC分类号： G06K19/077
CPC分类号： G06K19/07749 , G06K19/07718 , G06K19/0775 , G06K19/07767 , G06K19/07783 , G06K19/07784
摘要： A transponder (240) with an antenna module (200, 200A, 200B, 200E, 200E, AM) having a chip module (108, 208) and an antenna (110, 210, A); a booster antenna (250) having a first antenna structure (252, D) in the form of a flat coil having a number of turns, an outer end (7) and an inner end (8), and a second antenna structure (254, E) in the form of a flat coil having a number of turns, an outer end (9) and an inner end (10); the inner end (10) of the second antenna structure (254) connected with the outer end (7) of the first antenna structure (252). The antenna module may be positioned so that its antenna (A) overlaps one of the first antenna structure (252, D) or the second antenna structure (254, E). An antenna module (200, 200A, 200B, 200D, 200E) having two additional antenna structures (B, C) is disclosed. Methods of enhancing coupling are disclosed.
摘要翻译：一种具有天线模块（200,200A，200B，200E，200E，AM）的转发器（240），具有芯片模块（108,208）和天线（110,210A）; 具有多个匝数的扁平线圈形式的第一天线结构（252，D），外端（7）和内端（8）以及第二天线结构（254）的增强天线（250） E）为具有多个匝数的扁平线圈，外端（9）和内端（10）的形式; 第二天线结构（254）的内端（10）与第一天线结构（252）的外端（7）连接。天线模块可以被定位成使得其天线（A）与第一天线结构（252D）或第二天线结构（254，E）之一重叠。公开了具有两个附加天线结构（B，C）的天线模块（200,200A，200B，200D，200E）。公开了增强耦合的方法。

2. 发明申请

WO2007057786A2 RFID READER WITH MULTIPLE INTERFACES 审中-公开
标题翻译：带有多个接口的RFID阅读器
公开(公告)号：WO2007057786A2
公开(公告)日：2007-05-24
申请号：PCT/IB2006/003965
申请日：2006-05-27
申请人： DPD PATENT TRUST , FINN, David
发明人： FINN, David
CPC分类号： G06K7/0008 , G06K7/0013 , G06K7/10346
摘要： A pocket-size RFID reader apparatus (100, 150) having a contactless interface (212) and a slot (106) for insertion of a contactless smart card fob (116, 166), and having a biometric sensor (110), thereby providing two levels of personalization. The apparatus may have a wireless interface (218); and a slot (107) for insertion of a wireless SD I/O device (117,167). The apparatus may have a slot (108) for insertion of an external memory device (118). The apparatus may have a mechanical connection (contact) interface (104). The apparatus may also have an RF interface (234) for reading an electronic immobilizer (134) within the apparatus.
摘要翻译：一种袖珍型RFID读取器装置（100,150），具有非接触式接口（212）和用于插入非接触式智能卡（116,166）的插槽（106），并且具有生物测定传感器（110），从而提供两个级别的个性化。该装置可以具有无线接口（218）; 和用于插入无线SD I / O设备（117,167）的插槽（107）。该设备可以具有用于插入外部存储器设备（118）的插槽（108）。该设备可以具有机械连接（接触）接口（104）。该设备还可以具有用于读取设备内的电子防盗锁（134）的RF接口（234）。

3. 发明申请

WO2005050384A2 MULTI-INTERFACE COMPACT PERSONAL TOKEN APPARATUS AND METHODS OF USE 审中-公开
标题翻译：多接口紧凑个人托盘设备及其使用方法
公开(公告)号：WO2005050384A2
公开(公告)日：2005-06-02
申请号：PCT/US2004/038300
申请日：2004-11-17
申请人： DPD Patent Trust Ltd. , RYAN, Dennis, J. , FINN, David , COMISKEY, Patrick, R. , KNAPICH, Norbert
发明人： RYAN, Dennis, J. , FINN, David , COMISKEY, Patrick, R. , KNAPICH, Norbert
IPC分类号： G06F
CPC分类号： G06F13/385 , G06Q20/10 , G06Q20/327 , G06Q20/3278 , G06Q20/425 , H01R31/06
摘要： A compact personal token apparatus (100, 120, 140, 200, 220, 300, 320, 500), resembling a conventional USB memory fob in size, shape, and form which can be plugged into a PC and interfaced with the virtual world of the Internet. The apparatus is capable of loading and storing information from the Internet, via the PC to its flash memory (410) or EEPROM and then using the stored information or value via its wireless interface (108, 128, 148, 508) in the real world. The apparatus is capable of implementing an auto-run application, when inserted into a personal computer. The apparatus is capable of exchanging information with other devices having compatible interfaces. The apparatus can also function as a firewall (400) when plugged between an Internet connection and a PC.
摘要翻译：一种紧凑的个人令牌装置（100,120,140,200,220,300,320,500），其类似于可以插入到PC中并与虚拟世界接口的尺寸，形状和形式的常规USB存储器互联网。该装置能够将来自因特网的信息经由PC加载到其闪速存储器（410）或EEPROM中，然后通过其现实世界中的无线接口（108,128,148,508）来使用所存储的信息或值。当插入个人计算机时，该装置能够实现自动运行应用程序。该装置能够与具有兼容接口的其他设备交换信息。该装置还可以在互联网连接和PC之间插入时用作防火墙（400）。

4. 发明申请

WO9711437A8 IC BOARD MODULE FOR PRODUCING AN IC BOARD AND PROCESS FOR PRODUCING AN IC BOARD 审中-公开
标题翻译： IC卡模块用于生产IC卡及其制造方法IC卡
公开(公告)号：WO9711437A8
公开(公告)日：2002-09-26
申请号：PCT/DE9601752
申请日：1996-09-17
申请人： FINN DAVID , RIETZLER MANFRED
发明人： FINN DAVID , RIETZLER MANFRED
IPC分类号： G06K19/077
CPC分类号： G06K19/07747 , G06K19/07743 , G06K19/07749 , G06K19/0775 , G06K19/07775 , G06K19/07779 , G06K19/07781 , H01L2224/48091 , H01L2924/01057 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012
摘要： An IC board module (20) for producing an IC board (118) with at least one coil (46) and at least one chip (23) to form a transponder unit, in which the chip and the coil are connected together via a module support (21), which permits both an electrically conductive connection between the chip and the coil and an electrically conductive connection to an external contact surface (38) of the module support and the chip, where the IC board module (20) has a retainer (41) at a distance R behind the external contact surface (38) and projecting laterally beyond said surface, and a process for producing an IC board using such an IC board module.
摘要翻译： IC卡模块（20），用于产生具有至少一个线圈（46）和至少一个芯片（23），以形成一个应答器单元的IC卡（118），其中，所述芯片和模块载体上的线圈（21）被连接到彼此，使芯片和线圈和与模块载体和芯片的外接触表面（38）的导电连接，之间的两个导电连接，其中，所述IC卡模块（20）由外接触表面的凹部R（38）间隔开，所述外接触表面上横向保持装置（41）突出，以及用于制造使用这种IC卡模块的IC卡的方法。

5. 发明申请

WO1997030418A3 METHOD AND DEVICE FOR BONDING A WIRE CONDUCTOR 审中-公开
公开(公告)号：WO1997030418A3
公开(公告)日：1997-08-21
申请号：PCT/DE1997000261
申请日：1997-02-12
申请人： FINN, David , RIETZLER, Manfred
IPC分类号： G06K19/077

6. 发明申请

WO9730418A2 METHOD AND DEVICE FOR BONDING A WIRE CONDUCTOR 审中-公开
标题翻译：方法和设备，用于接触电线导体
公开(公告)号：WO9730418A2
公开(公告)日：1997-08-21
申请号：PCT/DE9700261
申请日：1997-02-12
申请人： FINN DAVID , RIETZLER MANFRED
发明人： FINN DAVID , RIETZLER MANFRED
IPC分类号： G06K19/077 , H01L21/607 , H05K3/10
CPC分类号： G06K19/07779 , G06K19/077 , G06K19/07749 , G06K19/07781 , H01L2224/78301 , H01L2924/01068 , H05K3/10 , Y10T29/49016 , Y10T29/49121 , Y10T29/49149 , H01L2924/00014
摘要： The invention relates to a method and device for bonding a wire conductor (13) when producing a transponder unit having a wire-wound coil (12) and a chip unit (15) and arranged on a substrate (11). During a first phase the wire conductor (13) extends across the bonding pad (18, 19) or a region receiving the bonding pad, and is fixed to the substrate (11) in relation to the bonding pad (18, 19) or the region associated with the bonding pad, and during a second phase the wire connector (13) is connected to the bonding pad (18, 19) by connection means (25, 37).
摘要翻译：用于与在一个制造的线导体（13）接触的基底（11）上的方法和装置被布置，一个线圈（12）和具有应答器单元的芯片单元（15），其中在第一相中的金属丝导体（13）在所述垫（18，19）或引导离开一个所述垫接纳到终端区域（18，19）部分和相对和的相关联的一个所述焊盘部分被固定在基板（11）上，并且在第二阶段中的电线导体的连接（13）所述连接表面（18，19）通过的连接装置（25，37）的装置进行。

7. 发明申请

WO1997011437A2 IC BOARD MODULE FOR PRODUCING AN IC BOARD AND PROCESS FOR PRODUCING AN IC BOARD 审中-公开
标题翻译： IC卡模块用于生产IC卡及其制造方法IC卡
公开(公告)号：WO1997011437A2
公开(公告)日：1997-03-27
申请号：PCT/DE1996001752
申请日：1996-09-17
申请人： FINN, David , RIETZLER, Manfred
IPC分类号： G06K19/077
CPC分类号： G06K19/07747 , G06K19/07743 , G06K19/07749 , G06K19/0775 , G06K19/07775 , G06K19/07779 , G06K19/07781 , H01L2224/48091 , H01L2924/01057 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012
摘要： An IC board module (20) for producing an IC board (118) with at least one coil (46) and at least one chip (23) to form a transponder unit, in which the chip and the coil are connected together via a module support (21), which permits both an electrically conductive connection between the chip and the coil and an electrically conductive connection to an external contact surface (38) of the module support and the chip, where the IC board module (20) has a retainer (41) at a distance R behind the external contact surface (38) and projecting laterally beyond said surface, and a process for producing an IC board using such an IC board module.
摘要翻译： IC卡模块（20），用于产生具有至少一个线圈（46）和至少一个芯片（23），以形成一个应答器单元的IC卡（118），其中，所述芯片和模块载体上的线圈（21）被连接到彼此，使芯片和线圈和与模块载体和芯片的外接触表面（38）的导电连接，之间的两个导电连接，其中，所述IC卡模块（20）由外接触表面的凹部R（38）间隔开，所述外接触表面上横向保持装置（41）突出，以及用于制造使用这种IC卡模块的IC卡的方法。

8. 发明申请

WO1994028562A1 WINDING HEAD 审中-公开
标题翻译：卷绕头
公开(公告)号：WO1994028562A1
公开(公告)日：1994-12-08
申请号：PCT/DE1994000395
申请日：1994-04-08
申请人： AMATECH GMBH & CO. KG , FINN, David
发明人： AMATECH GMBH & CO. KG
IPC分类号： H01F41/06
CPC分类号： H01F41/10 , H01F41/076 , Y10T29/49071 , Y10T29/5141 , Y10T29/5148 , Y10T29/5187
摘要： A device for producing a wire coil winding (33) on a winding support (32) with a winding head having a wire guide device (16) and being movable in relation to the winding support (32), in which there are, besides the wire guide device (16), a wire connecting device (17) and a wire separation device (18) as further integral units of the winding head (10).
摘要翻译：制造上的绕组支承件（32），绕组线具有线导向装置的线圈绕组（33）的装置（16），其具有相对于所述绕组支撑可动（32）卷绕头（10），其中除了所述线导引装置（16）包括线连接装置（17）和电线的分离装置（18）被提供作为绕组端部（10）的进一步积分装置。

9. 发明申请

WO2011154061A1 MOUNTING AND CONNECTING AN ANTENNA WIRE IN A TRANSPONDER 审中-公开
标题翻译：安装和连接天线在传输器
公开(公告)号：WO2011154061A1
公开(公告)日：2011-12-15
申请号：PCT/EP2010/066137
申请日：2010-10-26
申请人： FEINICS AMATECH TEORANTA , FINN, David , LINDEN, Gerald, E.
发明人： FINN, David , LINDEN, Gerald, E.
IPC分类号： G06K19/077
CPC分类号： G06K19/07783 , G06K19/07722 , G06K19/07745 , G06K19/07749 , G06K19/0775 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/16225 , H01L2224/16227 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45639 , H01L2224/48091 , H01L2224/4813 , H01L2224/78301 , H01L2224/8385 , H01L2224/85 , H01L2224/85203 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01Q1/2225 , H01Q1/38 , H01Q1/40 , H01Q7/00 , Y10T29/49016 , Y10T29/49018 , Y10T29/49117 , Y10T29/49124 , Y10T29/49167 , Y10T29/49174 , Y10T29/5313 , Y10T29/532 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： During mounting to an inlay substrate (602, 702, 802), at least one end portion (610a/b, 711, 715, 810a/b) of an antenna wire (610, 710, 810) is positioned ("floating") directly over a terminal (608a/b, 708a/b, 808a/b) of the chip module (608, 708, 808) for subsequent connecting thereto. A sonotrode (750) has a cutter (766) above the capillary (752) for nicking the wire. The wire may be broken, after mounting, at the nick (713). The antenna may comprise two separate stubs (Stub-1, Stub-2), each having an end portion (including end) positioned over a terminal (810a, 810b) of the chip module (808). In a connection stage, the floating end portions are connected to the terminals.
摘要翻译：在安装到嵌入式衬底（602,702,802）期间，天线线（610,710,810）的至少一个端部（610a，7b，711a，715,810a / b）被定位（“浮动”）直接在芯片模块（608,708,808）的终端（608a / b，708a / b，808a / b）上进行连接。超声波发生器（750）在毛细管（752）上方具有用于切割导线的切割器（766）。电线可能在安装后破损，在缺口处（713）。天线可以包括两个单独的短截线（Stub-1，Stub-2），每个短截线具有位于芯片模块（808）的端子（810a，810b）上的端部（包括端部）。在连接阶段，浮动端部连接到端子。

10. 发明申请

WO2009030979A3 METHOD OF CONNECTING AN ANTENNA TO A TRANSPONDER CHIP AND CORRESPONDING INLAY SUBSTRATE 审中-公开
公开(公告)号：WO2009030979A3
公开(公告)日：2009-03-12
申请号：PCT/IB2007/004658
申请日：2007-09-26
申请人： HID GLOBAL GMBH , FINN, David
发明人： FINN, David
IPC分类号： G06K19/07 , G06K19/077 , H01L23/48 , H01F41/04 , H01L23/488
摘要： A method and apparatus are provided for making radio frequency (RF) inlays. The RP inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas.

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