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1. 发明申请

WO2003037719A1 METHOD AND APPARATUS FOR TENSIONING COVER TAPE 审中-公开
标题翻译：用于张紧胶带的方法和装置
公开(公告)号：WO2003037719A1
公开(公告)日：2003-05-08
申请号：PCT/US2002/034743
申请日：2002-10-30
申请人： ROBOTIC VISION SYSTEMS, INC. , BEHNKE, Merlin, E.
发明人： BEHNKE, Merlin, E.
IPC分类号： B65B9/04
CPC分类号： B65B9/045 , B65B9/04 , B65B15/04 , H05K13/003 , H05K13/0084 , H05K13/021 , H05K13/0417
摘要： A method and apparatus for packaging parts (64) in compartments (76) of a carrier tape (34) and affixing a cover tape (41) over the carrier tape to trap the parts in the compartments. The method and apparatus provide for deflecting a flange (72) of the carrier tape and sealing the cover tape to the deflected flange. The cover tape is tightened across the carrier tape when the carrier tape flange returns to its undeflected condition.
摘要翻译：一种用于将部件（64）包装在载带（34）的隔室（76）中并将盖带（41）固定在载带上以将部件捕获在隔间内的方法和装置。该方法和装置用于使载带的凸缘（72）偏转并将盖带密封到偏转的凸缘上。当载带凸缘返回到其不偏转状态时，盖带被横跨载带束紧。

2. 发明申请

WO2009051468A1 HIGH SPEED LINEAR PICK-AND-PLACE 审中-公开
标题翻译：高速线性拾音器
公开(公告)号：WO2009051468A1
公开(公告)日：2009-04-23
申请号：PCT/MY2008/000054
申请日：2008-06-11
申请人： SYSTEMATION SEMICONDUCTOR LLC , VECTOR TECHNOLOGY SDN. BHD. , BEHNKE, Merlin, E. , BERTZ, Rob, G. , JAHNKE, Duane, B. , PIKUS, Ken, J. , ROLLMANN, Dave, J. , SHIRES, Mark, R. , REILLY, Mike, J. , PICHLER, Todd, K.
发明人： BEHNKE, Merlin, E. , BERTZ, Rob, G. , JAHNKE, Duane, B. , PIKUS, Ken, J. , ROLLMANN, Dave, J. , SHIRES, Mark, R. , REILLY, Mike, J. , PICHLER, Todd, K.
IPC分类号： H01L21/677 , H01L21/683
CPC分类号： B65G47/918
摘要： A high-speed linear pick-and-place for increasing the speed of transfer of semiconductor electronic devices with accommodation for automated inspection or test. The invention includes two or more linear pick-and-place assemblies, each having two or more independently positionable pick-and-place nozzles. These assemblies are aligned such that the 4 or more nozzles can all pick and place to common shared locations. The 4 or more nozzles are operated so that they can pass by each other on their return stroke, except that nozzles sharing a rail cannot pass each other.
摘要翻译：一种用于提高半导体电子设备传输速度的高速线性拾取器，用于自动检测或测试。本发明包括两个或更多个线性拾取和放置组件，每个具有两个或更多个可独立定位的拾取和放置喷嘴。这些组件对准，使得4个或更多个喷嘴可以全部拾取并放置到公共共享位置。操作4个以上的喷嘴，使得它们可以在它们的返回行程上彼此通过，除了共享轨道的喷嘴不能彼此通过。

3. 发明申请

WO2003037720A3 METHOD AND APPARATUS FOR SEALING COVER TAPE TO CARRIER TAPE 审中-公开
公开(公告)号：WO2003037720A3
公开(公告)日：2003-05-08
申请号：PCT/US2002/034744
申请日：2002-10-30
申请人： ROBOTIC VISION SYSTEMS, INC. , BEHNKE, Merlin, E.
发明人： BEHNKE, Merlin, E.
IPC分类号： B65B9/04
摘要： Method and apparatus for sealing cover tape(126). A sealing mechanism is connected to an actuator(110) that moves the mechanism toward an adhesively backed cover tape(126) and a carrier tape(130). The sealing mechanism applies heat and /or pressure to the cover tape to activate and bond the cover tape to the carrier tape. A biasing member (98)biases the mechanism away from the cover and carrier tapes. The actuator(110) is actuable to overcome the biasing force of the biasing member and to initiate contact between the sealing mechanism and the cover tape. When the actuator is disengaged, the biasing member moves the sealing mechanism away from the cover tape.

4. 发明申请

WO9903128A3 SINGULATION SYSTEM FOR CHIP-SCALE PACKAGES 审中-公开
标题翻译： CHIP规模包装机组合系统
公开(公告)号：WO9903128A3
公开(公告)日：1999-07-29
申请号：PCT/US9814078
申请日：1998-07-07
申请人： SYSTEMATION ENGINEERED PRODUCT , KOERPER PHILLIP E , BEHNKE MERLIN E , CHANASYK ALBERT J
发明人： KOERPER PHILLIP E , BEHNKE MERLIN E , CHANASYK ALBERT J
IPC分类号： H01L21/00 , H05K3/00 , B26D5/26
CPC分类号： H01L21/67092 , H05K3/0044 , H05K3/0097
摘要： A singulation system and method for singulating a plurality of chip-scale packages (62) fabricated on a carrier tape (58) is disclosed. The packages (62) are arranged in an array having at least one row and a plurality of columns extending longitudinally. The system includes a first cutting assembly (32) for making first cuts transversely through the tape (58) of the package (62). A first positioning mechanism (36) positions longitudinally the first cutting assembly (32) with respect to the selected column. Drive rollers (18, 20, 22, 24, 26) advance the tape (58) longitudinally from the first cutting assembly (32) to a second cutting assembly (34). The second cutting assembly (34) makes second cuts longitudinally through the tape (58) which intersect the first cuts. A second positioning mechanism (38) positions the second cutting assembly (34) transversely with respect to the selected column.
摘要翻译：公开了一种用于分离制造在载带（58）上的多个芯片尺寸封装（62）的分割系统和方法。包装（62）布置成具有至少一排和纵向延伸的多个列的阵列。该系统包括用于横向穿过包装（62）的带（58）的第一切口的第一切割组件（32）。第一定位机构36相对于选定的柱纵向定位第一切割组件32。驱动辊（18,20,22,24,26）将带（58）从第一切割组件（32）纵向推进到第二切割组件（34）。第二切割组件（34）使第二切口纵向穿过与第一切口相交的带（58）。第二定位机构38将第二切割组件34相对于所选列横向定位。

5. 发明申请

WO2009051467A1 HIGH SPEED TRAY TRANSFER SYSTEM 审中-公开
标题翻译：高速传输系统
公开(公告)号：WO2009051467A1
公开(公告)日：2009-04-23
申请号：PCT/MY2008/000053
申请日：2008-06-11
申请人： SYSTEMATION SEMICONDUCTOR, LLC , VECTOR TECHNOLOGY SDN. BHD. , BEHNKE, Merlin, E. , BERTZ, Rob, G. , JAHNKE, Duane, B. , PIKUS, Ken, J. , ROLLMANN, Dave, J. , SHIRES, Mark, R. , REILLY, Mike, J. , PICHLER, Todd, K.
发明人： BEHNKE, Merlin, E. , BERTZ, Rob, G. , JAHNKE, Duane, B. , PIKUS, Ken, J. , ROLLMANN, Dave, J. , SHIRES, Mark, R. , REILLY, Mike, J. , PICHLER, Todd, K.
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67706 , H01L21/67333 , H01L21/67721
摘要： A high-speed tray transfer system for trays of semiconductor devices for increasing the rate at which trays are delivered to, and advanced through, a pick and place that moves orthogonal to the tray movement, so as to increase the overall throughput speed of a semiconductor handling machine. The invention utilizes two or more platens that carry trays. The platens can pass over, under or otherwise around each other so that while one platen is under and servicing the pick and place, another platen is cycling around and preparing another tray of electronic devices for the pick and place.
摘要翻译：一种用于半导体器件托盘的高速托盘传送系统，用于提高托盘传送到和移动到与托盘运动正交的拾取和放置的速度，以便提高半导体的总体吞吐速度处理机。本发明利用两个或更多台托盘。压板可以通过，下面或以其他方式绕过彼此，以便在一个压板处于下方并对其进行维护的位置时，另一个压板正在循环并且为拾取和放置准备另一个电子装置的托盘。

6. 发明申请

WO2003037720A2 METHOD AND APPARATUS FOR SEALING COVER TAPE TO CARRIER TAPE 审中-公开
标题翻译：用于将盖带密封到载体带的方法和装置
公开(公告)号：WO2003037720A2
公开(公告)日：2003-05-08
申请号：PCT/US2002/034744
申请日：2002-10-30
申请人： ROBOTIC VISION SYSTEMS, INC. , BEHNKE, Merlin, E.
发明人： BEHNKE, Merlin, E.
IPC分类号： B65B9/04
CPC分类号： B29C66/8226 , B29C65/18 , B29C65/305 , B29C66/112 , B29C66/131 , B29C66/24244 , B29C66/53461 , B29C66/80 , B29C66/81427 , B29C66/81431 , B29C66/8167 , B29C66/82265 , B29C66/8227 , B29C66/83411 , B65B9/045 , B65B15/04 , B65B51/10 , Y10T156/1741
摘要： Method and apparatus for sealing cover tape. A sealing mechanism is connected to an actuator that moves the mechanism toward an adhesively backed cover tape and a carrier tape. The sealing mechanism applies heat and /or pressure to the cover tape to activate and bond the cover tape to the carrier tape. A biasing member biases the mechanism away from the cover and carrier tapes. The actuator is actuable to overcome the biasing force of the biasing member and to initiate contact between the sealing mechanism and the cover tape. When the actuator is disengaged, the biasing member moves the sealing mechanism away from the cover tape.
摘要翻译：密封胶带的方法和装置密封机构连接到致动器，所述致动器将机构朝向粘性后覆盖带和载带移动。密封机构对盖带施加热和/或压力以启动并将盖带粘合到载带上。偏置构件将机构偏置于盖和载带。致动器可致动以克服偏置构件的偏压力并且启动密封机构和盖带之间的接触。当致动器脱离时，偏置构件将密封机构移离盖带。

7. 发明申请

WO2009051465A1 OVERHEAD TRAVELING CAMERA INSPECTION SYSTEM 审中-公开
标题翻译： OVERHEAD行车摄像机检测系统
公开(公告)号：WO2009051465A1
公开(公告)日：2009-04-23
申请号：PCT/MY2008/000051
申请日：2008-06-11
申请人： SYSTEMATION SEMICONDCUTOR, LLC , VECTOR TECHNOLOGY SDN. BHD. , BEHNKE, Merlin, E. , BERTZ, Rob, G. , JAHNKE, Duane, B. , PIKUS, Ken, J. , ROLLMANN, Dave, J. , SHIRES, Mark, R. , REILLLY, Mike, J. , PICHLER, Todd, K.
发明人： BEHNKE, Merlin, E. , BERTZ, Rob, G. , JAHNKE, Duane, B. , PIKUS, Ken, J. , ROLLMANN, Dave, J. , SHIRES, Mark, R. , REILLLY, Mike, J. , PICHLER, Todd, K.
IPC分类号： G06K9/00 , H05K3/30 , H05K13/08 , H01L21/66
CPC分类号： G06T7/0004 , G01N21/8806 , G06T7/73 , G06T2207/10016 , G06T2207/30148
摘要： An overhead traveling camera inspection system for inspecting the condition of electronic semiconductor devices after being handled by a pick and place mechanism, and for automatically determining and calibrating the precise location of modules serviced by the pick and place mechanism for more accurate picking and placing of semiconductor devices.
摘要翻译：一种用于在拾取和放置机构处理后检查电子半导体器件的状况的高架行驶摄像机检查系统，并且用于自动确定和校准由拾取和放置机构服务的模块的精确位置，以更准确地选择和放置半导体设备。

8. 发明申请

WO2003037718A3 METHOD AND APPARATUS FOR FLATTENING COVER TAPE 审中-公开
公开(公告)号：WO2003037718A3
公开(公告)日：2003-05-08
申请号：PCT/US2002/034602
申请日：2002-10-30
申请人： ROBOTIC VISION SYSTEMS, INC. , BEHNKE, Merlin, E.
发明人： BEHNKE, Merlin, E.
IPC分类号： B65B7/16
摘要： A method and apparatus for flattening cover tape prior to the cover tape being sealed to a carrier tape. The apparatus includes a cover tape flattener with a leading edge angled in the direction of the moving carrier tape and cover tape. The method and apparatus provide for smoothing the cover tape and sealing the cover tape to the carrier tape.

9. 发明申请

WO03037718A2 METHOD AND APPARATUS FOR FLATTENING COVER TAPE 审中-公开
标题翻译：用于压盖胶带的方法和装置
公开(公告)号：WO03037718A2
公开(公告)日：2003-05-08
申请号：PCT/US0234602
申请日：2002-10-30
申请人： ROBOTIC VISION SYSTEMS , BEHNKE MERLIN E
发明人： BEHNKE MERLIN E
IPC分类号： B65B7/16 , B65B11/50 , B65B15/04 , H05K13/04
CPC分类号： B65B11/50 , B65B7/164 , B65B15/04
摘要： A method and apparatus for flattening cover tape prior to the cover tape being sealed to a carrier tape. The apparatus includes a cover tape flattener with a leading edge angled in the direction of the moving carrier tape and cover tape. The method and apparatus provide for smoothing the cover tape and sealing the cover tape to the carrier tape.
摘要翻译：一种用于在盖带被密封到载带之前使覆盖带平坦化的方法和装置。该装置包括一个盖带平整器，其前缘沿着移动的载带和覆盖带的方向成角度。该方法和装置提供了使盖带平滑并将盖带密封到载带上。

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