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1. 发明申请

WO1996005614A1 FLIP CHIP BONDING WITH NON-CONDUCTIVE ADHESIVE 审中-公开
标题翻译：与非导电胶粘剂的切片芯片
公开(公告)号：WO1996005614A1
公开(公告)日：1996-02-22
申请号：PCT/EP1995001388
申请日：1995-04-13
申请人： FRAUNHOFER GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , ASCHENBRENNER, Rolf , GWIASDA, Jörg , ZAKEL, Elke , ELDRING, Joachim
发明人： FRAUNHOFER GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： H01L21/58
CPC分类号： H01L24/29 , H01L21/563 , H01L24/11 , H01L24/13 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/00014 , H01L2224/13099 , H01L2924/01014 , H01L2924/00 , H01L2924/3512
摘要： Suggested is a flip chip technology using non-conductive adhesives (20) and gold ball bumps (10) or connectors. The concept is to simultaneously attach and interconnect bare chips with gold ball bumps to organic substrates (30). The chip is fixed by cooling the insulative adhesive. Environmental testing has demonstrated that performance characteristics were acceptable after 1000 hours of continuous exposure to humidity, and were excellent after 1000 temperature cycles. Such stable interconnections can only be realized by the compliance of the flip chip joint. This stability can be achieved by precise control of the bonding parameters such as temperature and pressure. This bonding technique allows quality attachment of bare chips on low cost organic substrates.
摘要翻译：建议使用非导电粘合剂（20）和金球凸点（10）或连接器的倒装芯片技术。这个概念是同时将裸芯片与金球凸点连接并连接到有机基板上（30）。通过冷却绝缘胶来固定芯片。环境试验表明，连续暴露于湿度1000小时后性能特征可以接受，并且在1000个温度循环后是优异的。这种稳定的互连只能通过倒装芯片接头的顺应性来实现。这种稳定性可以通过精确控制诸如温度和压力的键合参数来实现。这种焊接技术允许裸芯片在低成本有机衬底上的质量附着。

2. 发明申请

WO2011141232A1 DOKUMENT UND VERFAHREN ZUR HERSTELLUNG EINES DOKUMENTS 审中-公开
标题翻译：文档及其制造方法的文档
公开(公告)号：WO2011141232A1
公开(公告)日：2011-11-17
申请号：PCT/EP2011/055142
申请日：2011-04-01
申请人： BUNDESDRUCKEREI GMBH , KLOESER, Joachim , PAESCHKE, Manfred , FISCHER, Joerg , ASCHENBRENNER, Rolf , KALLMAYER, Christine
发明人： KLOESER, Joachim , PAESCHKE, Manfred , FISCHER, Joerg , ASCHENBRENNER, Rolf , KALLMAYER, Christine
IPC分类号： G06K19/077 , H01L25/065
CPC分类号： G06K19/077 , B42D25/00 , B42D25/21 , B42D25/23 , B42D25/45 , B42D2033/30 , B42D2033/46 , G06K19/07703
摘要： Die Erfindung betrifft ein Dokument mit einem Dokumentenkörper (148) und einem in dem Dokumentenkörper integrierten elektronischen Gerät, wobei das elektronische Gerät mehrere Komponenten (110, 122, 124, 126) aufweist, die in mehreren Schaltungsebenen (102, 104, 106, 108) in dem Dokument verteiit angeordnet sind, wobei die Komponenten verschiedener Schaltungsebenen galvanisch voneinander getrennt sind.
摘要翻译：本发明涉及一种与文档主体（148）和一个集成在文档主体的电子装置，其中该电子装置的多个部件（110，122，124，126）的文件，其在多个电路面（102，104，106，108）的 verteiit被布置在文档中，其中不同的电路平面的分量电流上彼此分离英寸

3. 发明申请

WO2010086111A3 METHOD FOR GENERATING METAL CRYSTALLINE SURFACE STRUCTURES IN THE COURSE OF GALVANIC METAL DEPOSITION 审中-公开
标题翻译：用金属分离法生产金属晶体表面结构的方法
公开(公告)号：WO2010086111A3
公开(公告)日：2010-10-07
申请号：PCT/EP2010000331
申请日：2010-01-20
申请人： FRAUNHOFER GES FORSCHUNG , SCHMIDT RALF , ZWANZIG MICHAEL , FIEDLER STEFAN , OSTMANN ANDREAS , ASCHENBRENNER ROLF
发明人： SCHMIDT RALF , ZWANZIG MICHAEL , FIEDLER STEFAN , OSTMANN ANDREAS , ASCHENBRENNER ROLF
IPC分类号： C25D7/06 , C25D17/00
CPC分类号： C25D7/00 , C25D5/00 , C25D5/006 , C25D17/001
摘要： The invention relates to a method for generating metal crystalline surface structures in the course of a galvanic metal deposition on an electrode surface disposed within an electrolyte fluid relative to a counter-electrode comprising the metal to be deposited. The invention is characterized in that the electrode surface and a surface that can be associated with the counter-electrode are disposed such that the electrode and counter-electrode surface are at rest relative to the electrolyte fluid, and that an electrical voltage is applied between the electrode and counter-electrode surface, wherein a layer forms within the electrolyte fluid adjacent to the electrode surface and having a layer thickness extending orthogonally to the electrode surface, within which a concentration gradient determined by the metal ions and oriented orthogonally to the electrode surface, and a density gradient resulting therefrom, are initiated.
摘要翻译：公开了一种用于通过在电极表面上电镀的金属沉积，其中包含对置电极被定位成抵靠金属的电解质流体中待沉积的手段制备金属结晶表面结构的方法。本发明的特征在于，在电极表面和对电极可归因表面水平设置，使得在相对于所述电解质流体其余部分的电极和反电极的表面，并且所述电极和反电极的表面之间的电施加电压时，在该相邻的具有正交ersteckenden到电极表面层厚度到电极表面，在其内是一对流形成其由一个条件中的金属离子的仅启动和正交地定向到电极表面的浓度梯度，所得到的密度梯度形成电解流体内的层。

4. 发明申请

WO2010086111A2 VERFAHREN ZUR ERZEUGUNG METALLISCH KRISTALLINER OBERFLÄCHENSTRUKTUREN IM WEGE EINER GALVANISCHEN METALLABSCHEIDUNG 审中-公开
标题翻译：方法制备金属结晶表面结构由电镀法
公开(公告)号：WO2010086111A2
公开(公告)日：2010-08-05
申请号：PCT/EP2010/000331
申请日：2010-01-20
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , SCHMIDT, Ralf , ZWANZIG, Michael , FIEDLER, Stefan , OSTMANN, Andreas , ASCHENBRENNER, Rolf
发明人： SCHMIDT, Ralf , ZWANZIG, Michael , FIEDLER, Stefan , OSTMANN, Andreas , ASCHENBRENNER, Rolf
IPC分类号： C25D7/06
CPC分类号： C25D7/00 , C25D5/00 , C25D5/006 , C25D17/001
摘要： Beschrieben wird ein Verfahren zur Erzeugung metallisch kristalliner Oberflächenstrukturen im Wege einer galvanischen Metallabscheidung auf einer Elektrodenoberfläche, die innerhalb einer Elektrolytflüssigkeit gegenüber einer das abzuscheidende Metall enthaltenden Gegenelektrode angeordnet wird. Die Erfindung zeichnet sich dadurch aus, dass die Elektrodenoberfläche und eine der Gegenelektrode zuordenbare Oberfläche horizontal derart angeordnet werden, dass die Elektroden- und Gegenelektrodenoberfläche relativ zur Elektrolytflüssigkeit ruhen, und dass zwischen der Elektroden- und Gegenelektrodenoberfläche eine elektrische Spannung angelegt wird, bei der sich angrenzend an die Elektrodenoberfläche eine Schicht innerhalb der Elektrolytflüssigkeit mit einer sich orthogonal zur Elektrodenoberfläche ersteckenden Schichtdicke ausbildet, innerhalb der sich eine Konvektionsströmung ausbildet, die ausschließlich durch einen von den Metallionen bedingten und orthogonal zur Elektrodenoberfläche orientierten Konzentrationsgradienten und einem daraus resultierenden Dichtegradienten initiiert wird.
摘要翻译：公开了一种用于通过在电极表面上电镀的金属沉积，其中包含对置电极被定位成抵靠金属的电解质流体中待沉积的手段制备金属结晶表面结构的方法。本发明的特征在于，在电极表面和对电极可归因表面水平设置，使得在相对于所述电解质流体其余部分的电极和反电极的表面，并且所述电极和反电极的表面之间的电施加电压时，在该相邻的具有正交ersteckenden到电极表面层厚度到电极表面，在其内是一对流形成其由一个条件中的金属离子的仅启动和正交地定向到电极表面的浓度梯度，所得到的密度梯度形成电解流体内的层。

5. 发明申请

WO1999023606A1 METHOD FOR PRODUCING CONTACTLESS CHIP CARDS AND CORRESPONDING CONTACTLESS CHIP CARD 审中-公开
标题翻译：用于生产接触式智能卡和非接触式芯片卡
公开(公告)号：WO1999023606A1
公开(公告)日：1999-05-14
申请号：PCT/EP1997006088
申请日：1997-11-04
申请人： ZAKEL, Elke , ASCHENBRENNER, Rolf , ANSORGE, Frank , KASULKE, Paul
IPC分类号： G06K19/077
CPC分类号： G06K19/07752 , G06K19/07749 , G06K19/07779 , G06K19/07783
摘要： The invention relates to a method for producing a contactless chip card. In a first stage of the method, a card body with one or more recesses on one of its sides is produced from a thermoplastic, preferably by injection moulding. Printed conductors are then impressed directly onto surface areas of the side of the card body with the recesses using a hot-stamping technique. The printed conductors correspond to a coil which serves as the printed conductor pattern, and are impressed especially also onto surface areas inside the recesses. One or more chips are then aligned in the recesses and contacted with the printed conductors in the recesses. The inventive method for producing a chip card has the advantages of being simple and consisting of only a few stages, with the result that it is also economical. A chip card produced according to this method is both mechanically stable and reliable since it consists of very few individual layers and since the printed conductors of the coil are impressed directly onto the card body.
摘要翻译：本发明描述了生产非接触式芯片卡的方法。在第一步骤中，对卡体侧面的一个或多个凹部的卡体优选通过注射成型由热塑性材料制成。随后，将含有卡主体侧凹部根据一个线圈作为热冲压的导体图案被直接施加导体轨迹在技术上是表面积。互连是特别深刻的印象，从而在凹槽内的表面积。此后，一个或多个芯片被在凹部，并接触到在凹部的导体轨迹对准。简单，auskommende少的工艺步骤和成本效益的生产的芯片卡是有利的。此外，这种芯片卡具有良好的机械强度和可靠性，因为它由很少的各个层的与所述线圈的导体轨道被直接施加到所述卡体。

6. 发明申请

WO1997006557A1 CHIP-CONTACTING METHOD REQUIRING NO CONTACT BUMPS, AND ELECTRONIC CIRCUIT PRODUCED IN THIS WAY 审中-公开
标题翻译：联系松散HÖCKER和CHIPKONTAKTIERUNGSVERFAHREN这样产生电子电路
公开(公告)号：WO1997006557A1
公开(公告)日：1997-02-20
申请号：PCT/EP1996003351
申请日：1996-07-30
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , ASCHENBRENNER, Rolf , ZAKEL, Elke , OPPERMANN, Hans-Hermann , AZDASHT, Ghassem
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： H01L21/56
CPC分类号： H01L24/83 , H01L24/29 , H01L24/81 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2224/83192 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/00 , H01L2924/3512
摘要： Proposed is a method, requiring no contact bumps, of contacting a chip (108) having a plurality of conducting contact areas (110) which have no additional metallization film. The method calls for a substrate (100) to be produced with a first surface (102) on which a plurality of conducting connection zones (104) are located, a non-conducting adhesive film (106) being located on the first surface (102) of the substrate (100). The substrate (100) is disposed in such a way with respect to the chip (108) to be contacted that the plurality of conducting contact areas (110) on the chip (108) are aligned with the connection zones (104) on the first surface (102) of the substrate (100). The substrate (100) is joined to the chip (108) by the adhesive film (106) in such a way that the connection zones (104) on the substrate (100) and the contact areas (110) on the chip (108) make pressure contact with each other without any intermetallic contact occurring.
摘要翻译：在一个无凸块Chipkontaktierungsverfahren用于具有多个导电接触区（110），这是不设置有附加的金属化层的芯片（108）接触，提供了一种支撑衬底（100），其具有第一表面（102）在其上被布置的多个导电连接部（104）具有非导电性粘接剂层（106）的设置在所述载体基板（100）的第一表面（102）上; 然后将具有定向成一个要接触芯片（108）的载体基板（100），其将多个被接触芯片（108）到所述载体基板的第一表面（102）上的端子部（104）上的导电接触区（110）的（ 100）是对齐的; 和支撑衬底（100）被接触芯片（108）通过粘合层的装置（106），使得通过压力接触静止的装置芯片（108）的载体基板（100）和接触区域（110）的端子部（104）相对于彼此，不发生的金属间化合物。

7. 发明申请

WO1996017382A1 SOLDER BUMPS FOR MOUNTING FLIP-CHIPS, AND METHOD OF PRODUCING SUCH BUMPS 审中-公开
标题翻译：凸块的倒装芯片封装及其方法
公开(公告)号：WO1996017382A1
公开(公告)日：1996-06-06
申请号：PCT/DE1995001590
申请日：1995-11-10
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , ZAKEL, Elke , ASCHENBRENNER, Rolf
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： H01L23/485
CPC分类号： H01L24/12 , H01L24/11 , H01L2224/05624 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01046 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/19043 , H01L2924/351 , H01R4/02 , H01L2924/00 , H01L2924/00014
摘要： The invention concerns flip-chip mounting bumps consisting of a core (4) containing a high proportion of a soft, high-conductivity metal, in particular gold, and a diffusion-barrier film (5) deposited on the core. The role of the diffusion-barrier film, as in the prior art, is to prevent the formation of intermetallic compounds between the gold in the bump core and the solder, in particular tin/lead solder, since such compounds reduce the mechanical stability of the solder connection. In order that the diffusion-barrier film, usually made of nickel, adheres well to the bump core, it has been necessary in the past to clean the core with a cleaning solution or in a nucleation bath. The invention makes this preliminary cleaning step unnecessary since it calls for small amounts of a material which acts as a nucleation agent for the diffusion-barrier film to be added to the bump core. Such bump cores can be produced mechanically very simply and inexpensively as ball bumps (with about 98 % gold and 2 % palladium). The invention makes it possible to produce flip-chip contacts with gold bumps at high rates on an industrial scale. The solder bumps proposed, using gold ball bumps as cores, occupy little space and open up new fields of application, such as the manufacture of miniature components for use in microsurgery.
摘要翻译：本发明描述了一种用于倒装芯片安装，它由一个芯部（4）用柔软的高导电性金属的比例高，特别是金的焊料凸块，以及沉积在焊料凸块核心扩散阻挡层（5）上。扩散阻挡层是已知的，以防止所述芯的金凸点和钎焊材料之间的金属间化合物，特别是锡 - 铅焊料，如它们在其它情况减少焊料连接的机械强度。使得扩散阻挡层，通常是镍，很好地粘附到焊料凸块核心，预先用清洗溶液或Bekeimungsbad所需的预处理。这个预处理工艺步骤在本发明中不再需要，因为焊料凸点铁心的材料以少量添加，扩散阻挡层作为晶种材料的效果。这种焊料凸点芯是例如非常简单和廉价的机械作为生产（具有约98％的金及含钯2％）球凸块。本发明能够与金凸块与在工业水平的高通量生产的倒装芯片触点。金球凸起作为焊料凸块核心的基础上的新型焊料凸点有一点空间，开辟为新的应用领域中的微型器件的制造中，例如在显微。

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