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    • 3. 发明申请
    • SEMICONDUCTOR PROCESSING
    • 半导体处理
    • WO2009045250A1
    • 2009-04-09
    • PCT/US2008/009457
    • 2008-08-07
    • MICRON TECHNOLOGY, INC.SURTHI, Shyam
    • SURTHI, Shyam
    • H01L21/205
    • C23C16/45546C23C16/45578C23C16/46H01L21/02164H01L21/02211H01L21/0228H01L21/3141H01L21/31608
    • Embodiments of the present disclosure include semiconductor processing methods and systems. One method includes forming a material layer (104-1, 104-2) on a semiconductor substrate by exposing a deposition surface of the substrate to at least a first (REACTANTl, Rl) and a second (REACTANT2, R2) reactant sequentially introduced into a reaction chamber (202, 402) having an associated process temperature. The method includes removing residual first reactant (REACTANTl, Rl) from the chamber (202, 402) after introduction of the first reactant (REACTANTl, Rl), removing residual second reactant (REACTANT2, R2) from the chamber (202, 402) after introduction of the second reactant(REACTANT2, R2), and establishing a temperature differential substantially between an edge of the substrate and a center (105)of the substrate via a purge process.
    • 本公开的实施例包括半导体处理方法和系统。 一种方法包括在半导体衬底上形成材料层(104-1,104-2),通过将衬底的沉积表面暴露于至少第一(REACTANT1,R1)和第二(REACTANT2,R2) 具有相关联的处理温度的反应室(202,402)。 该方法包括在引入第一反应物(REACTANT1,R1)之后从腔室(202,402)中除去残余的第一反应物(REACTANT1,R1),然后从腔室(202,402)中除去残留的第二反应物(REACTANT2,R2) 引入第二反应物(REACTANT2,R2),以及通过净化过程基本上在衬底的边缘和衬底的中心(105)之间建立温差。