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51. 发明申请

WO2009003029A2 HIGH-TEMPERATURE SPIN-ON TEMPORARY BONDING COMPOSITIONS 审中-公开
标题翻译：高温旋转临时粘结组合物
公开(公告)号：WO2009003029A2
公开(公告)日：2008-12-31
申请号：PCT/US2008/068170
申请日：2008-06-25
申请人： BREWER SCIENCE INC. , HONG, Wenbin , PILLALAMARRI, Sunil, K.
发明人： HONG, Wenbin , PILLALAMARRI, Sunil, K.
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , C09J5/06 , C09J2203/326 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2924/30105 , Y10T156/11 , Y10T428/24355
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.
摘要翻译：提供了使用这些组合物作为粘合组合物的新组合物和方法。组合物优选是热塑性的，并且包括分散或溶解在溶剂体系中的酰亚胺，酰胺酰亚胺和/或酰胺酰亚胺 - 硅氧烷（以聚合或低聚形式），并且可用于将活性晶片结合到载体晶片或基底以辅助在后续处理和处理期间保护活性晶片及其活性位点。组合物形成化学和耐热的粘合层，但是也可以软化以使晶片在制造过程中的适当阶段分开。

52. 发明申请

WO2008039705A1 METHOD OF CREATING PHOTOLITHOGRAPHIC STRUCTURES WITH DEVELOPER-TRIMMED HARD MASK 审中-公开
标题翻译：用开发者 - 修剪硬掩模创建光刻结构的方法
公开(公告)号：WO2008039705A1
公开(公告)日：2008-04-03
申请号：PCT/US2007/079217
申请日：2007-09-21
申请人： BREWER SCIENCE INC. , SUN, Sam, X.
发明人： SUN, Sam, X.
IPC分类号： G03F7/004 , G03F7/11
CPC分类号： G03F7/11 , H01L21/0271 , H01L21/312
摘要： Novel, developer-soluble, hard mask compositions and methods of using those compositions to form microelectronic structures are provided. The composition comprises the compound (INSERT FORMULA) a compound for controlling development rate, and a crosslinking agent in a solvent system. The methods involve applying the composition to a substrate and curing the composition. An imaging layer is applied to the composition, followed by light exposure and developing, during which the light-exposed portions of the imaging layer are removed, along with portions of the hard mask composition adjacent said light-exposed portions. The size of the hard mask composition structures are controlled by the development rate, and they yield feature sizes that are a fraction of the imaging layer feature sizes, to give a pattern that can ultimately be transferred to the substrate.
摘要翻译：提供了新颖的显影剂可溶性硬掩模组合物和使用这些组合物形成微电子结构的方法。组合物包含化合物（INSERT FORMULA）用于控制显影速率的化合物和溶剂体系中的交联剂。所述方法包括将组合物施用于基材并固化组合物。将成像层施加到组合物上，然后曝光和显影，在此期间，除去成像层的光曝光部分以及邻近所述光曝光部分的硬掩模组合物的部分。硬掩模组合物结构的尺寸由显影速率控制，并且它们产生作为成像层特征尺寸的一部分的特征尺寸，以产生最终可以转移到基底的图案。

53. 发明申请

WO2006101902A2 DEPOSITION OF POLYMERIC MATERIALS AND PRECURSORS THEREFOR 审中-公开
标题翻译：聚合材料及其前体的沉积
公开(公告)号：WO2006101902A2
公开(公告)日：2006-09-28
申请号：PCT/US2006/009347
申请日：2006-03-15
申请人： BREWER SCIENCE INC. , SENKEVICH, John, J.
发明人： SENKEVICH, John, J.
IPC分类号： B05D3/02
CPC分类号： H01L21/02205 , B05D1/60 , H01L21/02118 , H01L21/02203 , H01L21/02271 , H01L21/312
摘要： Substituted paracyclophanes are particularly useful as precursors in the formation of a cross-linkable polymer on a deposition substrate such as an electronic device being processed. The paracyclophane precursor including a cross-linkable substituent such as an alkynyl is cracked at the phenyl linkages. The substrate is subjected to the*cracked precursor. As a result, an organic polymer is formed on the substrate. Cross-linking of the polymer through reaction, e.g. thermally induced reaction, of the cross-linkable substituents produces a thermally stable cross-linked polymer. The deposition of such cross-linked polymer is particularly useful for sealing ultra low k dielectric materials used in the damascene process in the production of integrated circuits. Alternatively the polymer is also advantageous as an adhesive in wafer-to-wafer bonding. Alternatively, the polymer is useful as a hardmask to replace silicon nitride and silicon carbide in the back-end-of-the-line processing of electronic devices.
摘要翻译：取代的对环磷腺苷在作为正在加工的电子器件的沉积基底上形成可交联聚合物时特别有用。包括可交联取代基如炔基的对环烷前体在苯基键处裂解。使基板经受*破裂的前体。结果，在基板上形成有机聚合物。通过反应交联聚合物，例如，可交联取代基的热诱导反应产生热稳定的交联聚合物。这种交联聚合物的沉积特别可用于密封用于集成电路生产中的镶嵌工艺中使用的超低k电介质材料。或者，聚合物作为晶片到晶片粘合中的粘合剂也是有利的。或者，聚合物可用作硬掩模以在电子设备的后端处理中替代氮化硅和碳化硅。

54. 发明申请

WO2006071363A3 DEVICE FOR COATING THE OUTER EDGE OF A SUBSTRATE DURING MICROELECTRONICS MANUFACTURING 审中-公开
公开(公告)号：WO2006071363A3
公开(公告)日：2006-07-06
申请号：PCT/US2005/040433
申请日：2005-11-07
申请人： BREWER SCIENCE INC. , BRAND, Gary, J. , ALLEN, Phillip, H. , TRICHUR, Ramachandran, K.
发明人： BRAND, Gary, J. , ALLEN, Phillip, H. , TRICHUR, Ramachandran, K.
IPC分类号： B05C11/02 , B05B1/28
摘要： New baffles and methods of using these baffles are provided. The baffles comprise a body having an edge wall configured to direct the flow of a composition against a substrate (e.g., silicon wafer) edge. The edge wall comprises a vertical surface (38), a curved sidewall (42) coupled to the vertical surface, and a lip (40) coupled to the curved sidewall. A preferred baffle is annular in shape and formed from a synthetic resinous composition. Even more preferably, the baffle is not formed of a metal. The inventive methods comprise positioning the baffle adjacent a substrate during a spin coating process so that the edge wall causes the composition to cover the edges of the substrate and preferably a portion of the back side of the substrate.

55. 发明申请

WO2005008734A3 AUTOMATED PROCESS AND APPARATUS FOR PLANARIZATION OF TOPOGRAPHICAL SURFACES 审中-公开
标题翻译：自动化过程和设备的地形表面平面设计
公开(公告)号：WO2005008734A3
公开(公告)日：2006-05-11
申请号：PCT/US2004022445
申请日：2004-07-09
申请人： BREWER SCIENCE INC , MCCUTCHEON JEREMY W
发明人： MCCUTCHEON JEREMY W
IPC分类号： B05D3/02 , B05C11/02 , B05D3/12 , H01L20060101
CPC分类号： H01L21/31058 , H01L21/67115 , H01L21/6719 , H01L21/68707 , H01L21/68785
摘要： An improved apparatus (20) and method are provided for effective, high speed contact planarization of coated curable substrates such as microelectronic devices to achieve very high degrees of planarization. The apparatus (20) includes a planarizing unit (28) preferably having an optical flat flexible sheet (88) and a backup optical flat body (82), and a curing assembly (30). In operation, a substrate (78) having a planarizable coating (76) is placed within a vacuum chamber (26) beneath sheet (88) and body (82). A pressure differential is created across sheet (88) so as to deflect the sheet into contact with a central region C of the coating (76), whereupon the coating (76) is brought into full planarizing contact with sheet (88) and body (82) by means of a support (114) and vacuum chuck (120); at this point the coating (76) is cured using assembly (30). After curing, a pressure differential is established across sheet (88) for sequentially separating the sheet from the peripheral portion P of the coating, and then full separation of the sheet (88) and coating (76).
摘要翻译：提供了一种改进的装置（20）和方法，用于有效的高速接触平面化涂覆的可固化基板例如微电子器件以实现非常高的平坦度。装置（20）包括平坦化单元（28），优选地具有光学平面柔性片（88）和备用光学平坦体（82），以及固化组件（30）。在操作中，具有可平面化涂层（76）的基板（78）被放置在薄片（88）和主体（82）下方的真空室（26）内。在片材（88）之间产生压差，以便将片材偏转成与涂层（76）的中心区域C接触，于是涂层（76）与片材（88）和主体（88）完全平坦化接触 82）通过支撑件（114）和真空卡盘（120）; 在这一点上，涂层（76）使用组件（30）固化。固化后，在片材（88）之间建立用于将片材从涂层的周边部分P顺序分离，然后片材（88）和涂层（76）的完全分离的压力差。

56. 发明申请

WO2005111719A2 ANTI-REFLECTIVE COATINGS USING VINYL ETHER CROSSLINKERS 审中-公开
标题翻译：使用乙烯基交联剂的抗反射涂层
公开(公告)号：WO2005111719A2
公开(公告)日：2005-11-24
申请号：PCT/US2005/012851
申请日：2005-04-15
申请人： BREWER SCIENCE INC. , GUERRERO, Douglas, J. , COX, Robert, C. , WEIMER, Marc, W.
发明人： GUERRERO, Douglas, J. , COX, Robert, C. , WEIMER, Marc, W.
IPC分类号： G03C1/492
CPC分类号： G03F7/091 , C07C43/166 , G03F7/039 , G03F7/0392 , G03F7/094 , G03F7/11 , G03F7/168 , G03F7/40 , Y10S438/952 , Y10T428/31667 , Y10T428/31699 , Y10T428/31935
摘要： Novel, wet developable anti-reflective coating compositions and methods of using those compositions are provided. The compositions comprise a polymer and/or oligomer having acid functional groups and dissolved in a solvent system along with a crosslinker and a photoacid generator. The preferred acid functional group is a carboxylic acid, while the preferred crosslinker is a vinyl ether crosslinker. In use, the compositions are applied to a substrate and thermally crosslinked. Upon exposure to light, the cured compositions will decrosslink, rendering them soluble in typical photoresist developing solutions (e.g., alkaline developers).
摘要翻译：提供了新型的湿显影抗反射涂层组合物和使用这些组合物的方法。组合物包含具有酸官能团并且与交联剂和光酸产生剂一起溶解在溶剂体系中的聚合物和/或低聚物。优选的酸官能团是羧酸，而优选的交联剂是乙烯基醚交联剂。在使用中，将组合物施加到基底上并进行热交联。曝光时，固化的组合物将脱链，使其溶于典型的光致抗蚀剂显影溶液（例如碱性显影剂）中。

57. 发明申请

WO2005038878A3 DEVELOPER-SOLUBLE MATERIALS AND METHODS OF USING THE SAME IN VIA-FIRST DUAL DAMASCENE APPLICATIONS 审中-公开
公开(公告)号：WO2005038878A3
公开(公告)日：2005-04-28
申请号：PCT/US2004/034495
申请日：2004-10-15
申请人： BREWER SCIENCE INC. , BHAVE, Mandar , WASHBURN, Carlton, A. , PULIGADDA, Rama , EDWARDS, Kevin
发明人： BHAVE, Mandar , WASHBURN, Carlton, A. , PULIGADDA, Rama , EDWARDS, Kevin
IPC分类号： G03F7/00 , G03F7/004 , G03F7/037 , G03F7/11 , G03F7/26 , G03F7/30 , G03F7/40 , H01L21/31 , H01L21/311
摘要： Wet-recess (develop) gap-fill and bottom anti-reflective coatings based on a polyamic acid or polyester platform are provided. The polyamic acid platform allows imidization to form a polyimide when supplied with thermal energy. The gap-fill and bottom anti-reflective coatings are soluble in standard aqueous developers, and are useful for patterning via holes and trenches on semiconductor substrates in a dual damascene patterning scheme. In one embodiment, compositions composed of polyamic acids can be used as gap-filling (via-filling) materials having no anti-reflective function in a copper dual damascene process to improve iso-dense fill bias across different via arrays. In another embodiment, the same composition can be used for anti-reflective purposes, wherein the photoresist can be directly coated over the rescessed surface, while it also acts as a fill material to planarize via holes on the substrate. The compositions described here are particular suitable for use at exposure wavelengths of less than about 370 nm.

58. 发明申请

WO2004108777A1 BOTTOM ANTI-REFLECTIVE COATING COMPOSITIONS COMPRISING SILICON CONTAINING POLYMERS TO IMPROVE ADHESION TOWARDS PHOTORESISTS 审中-公开
标题翻译：包含含硅聚合物的底部防反射涂料组合物，以提高粘合剂的粘附力
公开(公告)号：WO2004108777A1
公开(公告)日：2004-12-16
申请号：PCT/US2004/016721
申请日：2004-05-26
申请人： BREWER SCIENCE INC. , MANDAR, Bhave, R.
发明人： MANDAR, Bhave, R.
IPC分类号： C08F220/10
CPC分类号： G03F7/0758 , G03F7/091
摘要： New anti-reflective compositions for use in 193 nm applications are provided. The compositions comprise a polymer having recurring silane monomers. The inventive compositions can be applied to substrates (e.g., silicon wafers) to form antireflective coating layers having improved adhesion ofphotoresists to the anti-reflective coating layer, thereby reducing or preventing the occurrence of photoresist pattern collapse typically seen in feature sizes of 100 nm or smaller.
摘要翻译：提供了用于193nm应用的新的抗反射组合物。组合物包含具有重复的硅烷单体的聚合物。本发明的组合物可以应用于基底（例如，硅晶片）以形成具有改善的光致抗蚀剂与抗反射涂层粘附性的抗反射涂层，从而减少或防止通常在特征尺寸为100nm或小。

59. 发明申请

WO2004040369A3 ANTI-REFLECTIVE COATINGS AND DUAL DAMASCENE FILL COMPOSITIONS COMPRISING STYRENE-ALLYL ALCOHOL COPOLYMERS 审中-公开
标题翻译：包含苯乙烯 - 烯醇共聚物的抗反射涂层和双层填料组合物
公开(公告)号：WO2004040369A3
公开(公告)日：2004-07-08
申请号：PCT/US0315164
申请日：2003-05-13
申请人： BREWER SCIENCE INC
发明人： XU GU , MEADOR JIMMY D , BHAVE MANDAR R , DESHPANDE SHREERAM V , NOWAK KELLY A
IPC分类号： C09D101/00 , C09D129/08 , G02B1/11 , G03F7/09 , H01L21/768 , C08F12/02 , C08F16/36 , C08F20/10 , C08F212/00
CPC分类号： H01L21/76808 , G02B1/111 , G03F7/091 , Y10S430/136 , Y10S430/151
摘要： New anti-reflective or fill compositions having improved flow properties are provided. The compositions comprise a styrene-allyl alcohol polymer and preferably at least one other polymer (e.g., cellulosic polymers) in addition to the styrene-allyl alcohol polymer. The inventive compositions can be used to protect contact or via holes from degradation during subsequent etching in the dual damascene process. The inventive compositions can also be applied to substrates (e.g., silicon wafers) to form anti-reflective coating layers having high etch rates which minimize or prevent reflection during subsequent photoresist exposure and developing.
摘要翻译：提供了具有改进流动性能的新型抗反射或填充组合物。除了苯乙烯 - 烯丙醇聚合物之外，组合物还包含苯乙烯 - 烯丙醇聚合物，优选至少一种其他聚合物（例如纤维素聚合物）。本发明的组合物可以用于在双镶嵌工艺的后续蚀刻期间保护接触或通孔免于降解。本发明的组合物也可以用于基底（例如硅晶片）以形成具有高蚀刻速率的抗反射涂层，该蚀刻速率最小化或防止后续光致抗蚀剂曝光和显影期间的反射。

60. 发明申请

WO2004040369A2 ANTI-REFLECTIVE COATINGS AND DUAL DAMASCENE FILL COMPOSITIONS COMPRISING STYRENE-ALLYL ALCOHOL COPOLYMERS 审中-公开
标题翻译：抗反射涂料和双组分包含苯乙烯 - 乙醇共聚物的双组分填料组合物
公开(公告)号：WO2004040369A2
公开(公告)日：2004-05-13
申请号：PCT/US2003/015164
申请日：2003-05-13
申请人： BREWER SCIENCE, INC.
发明人： XU, Gu , MEADOR, Jimmy, D. , BEHAVE, Mander, R. , DESHPANDE, Shreeram, V. , NOWAK, Kelly, A.
IPC分类号： G03F
CPC分类号： H01L21/76808 , G02B1/111 , G03F7/091 , Y10S430/136 , Y10S430/151
摘要： New anti-reflective or fill compositions having improved flow properties are provided. The compositions comprise a styrene-allyl alcohol polymer and preferably at least one other polymer (e.g., cellulosic polymers) in addition to the styrene-allyl alcohol polymer. The inventive compositions can be used to protect contact or via holes from degradation during subsequent etching in the dual damascene process. The inventive compositions can also be applied to substrates ( e.g., silicon wafers) to form anti-reflective coating layers having high etch rates which minimize or prevent reflection during subsequent photoresist exposure and developing.
摘要翻译：提供了具有改善的流动性能的新的抗反射或填充组合物。组合物除了苯乙烯 - 烯丙醇聚合物之外还包含苯乙烯 - 烯丙醇聚合物，优选至少一种其它聚合物（例如，纤维素聚合物）。本发明的组合物可用于在双镶嵌工艺中的后续蚀刻期间保护接触或通孔免于降解。本发明的组合物还可以施加到基底（例如，硅晶片）以形成具有高蚀刻速率的抗反射涂层，其在随后的光致抗蚀剂曝光和显影期间最小化或防止反射。

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