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31. 发明申请

WO2004022814A3 DEVICE AND METHOD FOR ELECTROLYTICALLY TREATING AN AT LEAST SUPERFICIALLY ELECTRICALLY CONDUCTING WORK PIECE 审中-公开
标题翻译：用于电解处理至少超导电导体工件的装置和方法
公开(公告)号：WO2004022814A3
公开(公告)日：2005-07-14
申请号：PCT/EP0309526
申请日：2003-08-28
申请人： ATOTECH DEUTSCHLAND GMBH , SCHNEIDER REINHARD , KENNY STEPHAN , KUESSNER TORSTEN , PLOESE WOLFGANG , REENTS BERT , STREUP HERIBERT
发明人： SCHNEIDER REINHARD , KENNY STEPHAN , KUESSNER TORSTEN , PLOESE WOLFGANG , REENTS BERT , STREUP HERIBERT
IPC分类号： C25D7/00 , C25D17/06 , C25D17/08 , C25D17/12 , C25D17/28 , C25F7/00 , H05K3/24
CPC分类号： C25D17/28 , C25D17/06 , H05K3/241
摘要： A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides a device for electrolytically treating an at least superficially electrically conducting work piece having at least two substantially opposing side edges. The device comprises current supply devices for the work piece, said current supply devices each comprising contact strips located on the opposing side edges which are capable of electrically contacting the work piece at the substantially opposing side edges.
摘要翻译：在具有非常薄的碱性金属化的印刷电路板的电解处理期间的问题是，处理在印刷电路板的表面上的各个区域产生不规则的结果。在克服这个问题时，本发明提供一种用于电解处理至少表面上导电的工件的装置，其具有至少两个基本相对的侧边缘。该装置包括用于工件的电流供应装置，所述电流供应装置各自包括位于相对的侧边缘上的接触条，其能够在大致相对的侧边缘处电接触工件。

32. 发明申请

WO2004003258A3 METHOD FOR PRODUCING GALVANICALLY DEPOSITED ANTENNAE FOR RFID LABELS USING AN ADHESIVE THAT IS SELECTIVELY APPLIED 审中-公开
标题翻译：用于生产电沉积的天线，用于RF-ID标签中使用选择性并入GLUE的
公开(公告)号：WO2004003258A3
公开(公告)日：2005-03-03
申请号：PCT/DE0301376
申请日：2003-04-29
申请人： INFINEON TECHNOLOGIES AG , SCHMID GUENTER , KLAUK HAGEN , HALIK MARCUS , ZSCHIESCHANG UTE , WEBER WERNER , MUELLER-HIPPER ANDREAS
发明人： SCHMID GUENTER , KLAUK HAGEN , HALIK MARCUS , ZSCHIESCHANG UTE , WEBER WERNER , MUELLER-HIPPER ANDREAS
IPC分类号： B42D15/10 , C25D1/00 , C25D5/02 , C25D17/12 , G06K19/07 , G06K19/077 , C25D7/00 , C25D1/08 , C25D1/20
CPC分类号： G06K19/07718 , C25D1/00 , C25D1/003 , C25D5/022 , C25D17/12 , G06K19/07749
摘要： The invention relates to a method for producing a structured metal layer, as is used for example as an antenna for RFID labels. The structured metal layer is galvanically deposited on a cathode, on whose surface conductive and non-conductive areas are defined. An adhesive that fills a residual volume is applied to the deposited metal layer, said adhesive being used to glue the structured metal layer to a support layer.
摘要翻译：本发明涉及一种用于制造结构化金属层，例如，使用例如作为用于RF-ID标签的天线。所述图案化金属层被电沉积在导电和非导电区域的表面上的阴极被定义。在粘合剂的残留量被施加到沉积的金属层，与该结构的金属层可以被粘附到载体层。

33. 发明申请

WO03015870A3 RADIOACTIVE IMPLANTABLE DEVICES AND THEIR PRODUCTION METHODS 审中-公开
标题翻译：放射性可植入器件及其生产方法
公开(公告)号：WO03015870A3
公开(公告)日：2003-05-22
申请号：PCT/US0225709
申请日：2002-08-13
申请人： SCHERING AG , DINKELBORG LUDGER , URICH KLAUS , MONZYK BRUCE F , SCHMITT STEPHEN C , CUCKSEY CHAD M , CAMPBELL DEREK
发明人： DINKELBORG LUDGER , URICH KLAUS , MONZYK BRUCE F , SCHMITT STEPHEN C , CUCKSEY CHAD M , CAMPBELL DEREK
IPC分类号： A61B17/00 , A61F2/00 , A61K51/00 , A61K51/12 , A61M36/04 , A61N5/10 , C23G1/08 , C25D5/10 , C25D7/00 , C25D7/04 , C25D17/12 , C25F3/00
CPC分类号： A61K51/1282 , A61F2210/0095 , A61N5/1002
摘要： A radiolabeled implantable device includes a base, a first layer including Cu and a radioactive isotope on the base, and a second layer including Sn on the first layer. Preferably, the base is formed of stainless steel and the radioactive isotope is a radioisotope of Re, such as Re or Re. Alternately, radioisotopes of the following elements may be used: Be, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, As, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Te, Hf, Ta, W, Os, Ir, Pt, Au, Hg, TI, Pb, Bi, Po, At, Th, Pa, U, Np, Pu, Am, Cm, Bk, Cf, Es, Fm, Md, No, Lr. In addition, a process for producing a radiolabeled implantable device includes depositing a first layer including Cu and a radioactive isotope on a base, and depositing a second layer including Sn on the first layer. The process may further include removing Cr2O3 from the base and/or rinsing the base prior to depositing the first layer thereon.
摘要翻译：放射性标记的可植入装置包括基底，在基底上包括Cu和放射性同位素的第一层和在第一层上包含Sn的第二层。优选地，基底由不锈钢形成，并且放射性同位素是Re的放射性同位素，例如<188> Re或<186> Re。或者，可以使用以下元素的放射性同位素：Be，Sc，Ti，V，Cr，Mn，Fe，Co，Ni，Cu，Zn，Ga，Ge，As，Y，Zr，Nb，Mo，Tc，Ru ，Rh，Pd，Ag，Cd，In，Sn，Sb，Te，Hf，Ta，W，Os，Ir，Pt，Au，Hg，TI，Pb，Bi，Po，At，Th，Pa，U，Np ，Pu，Am，Cm，Bk，Cf，Es，Fm，Md，No，Lr。此外，生产放射性标记的可植入装置的方法包括在基底上沉积包含Cu和放射性同位素的第一层，并在第一层上沉积包含Sn的第二层。该方法还可以包括在沉积第一层之前从基底中除去Cr 2 O 3和/或漂洗基底。

34. 发明申请

WO02090624A3 A PROCESS AND APPARATUS FOR CLEANING AND/OR COATING METAL SURFACES 审中-公开
标题翻译： A清洁和/或涂覆金属表面的方法和装置
公开(公告)号：WO02090624A3
公开(公告)日：2003-05-22
申请号：PCT/GB0202172
申请日：2002-05-10
申请人： EPCAD SYSTEMS LLC , ANDREWS EDGAR HAROLD , STEBLIANKO VALERIJ LEONTIEVICH
发明人： ANDREWS EDGAR HAROLD , STEBLIANKO VALERIJ LEONTIEVICH
IPC分类号： B08B7/00 , C25D5/00 , C25D7/12 , C25F1/00 , C25F7/00 , B23K10/00 , C25D17/12
CPC分类号： C25F7/00 , B08B7/00 , C25D5/003 , C25D5/06 , C25D7/12 , C25D21/04 , C25F1/00
摘要： A process and apparatus for cleaning an electrically conductive surface by arranging for the surface to form the surface of a cathode of an electrolytic cell in which the anode is maintained at a DC voltage in excess of 30v and an electrical arc discharge electro-plasma is established at the surface of the workpiece.The conductive medium in contact with the workpiece is an electrically conducting foam. One or more vents are provided to allow the escape of gas from the foam-filled treatment zone.
摘要翻译：一种用于清洁导电表面的方法和装置，其中所述表面布置以形成其中阳极维持在超过30v的直流电压并且形成电弧放电电浆的电解池的阴极的表面在工件的表面。与工件接触的导电介质是导电泡沫。提供一个或多个通风口以允许气体从泡沫填充的处理区域逸出。

35. 发明申请

WO01048800A1 SEMICONDUCTOR WAFER PROCESSING APPARATUS AND PROCESSING METHOD 审中-公开
标题翻译：半导体加工设备和加工方法
公开(公告)号：WO01048800A1
公开(公告)日：2001-07-05
申请号：PCT/JP2000/009183
申请日：2000-12-25
IPC分类号： B24B37/04 , C23C18/16 , C25D7/12 , C25D17/12 , C25D17/14 , H01L21/00 , H01L21/02 , H01L21/288 , H01L21/306 , H01L21/321 , H01L21/3213 , H01L21/677 , H01L21/768 , H05K3/42
CPC分类号： H01L21/67161 , B24B37/04 , C23C18/1619 , C23C18/1632 , C23C18/1678 , C23C18/1692 , C25D7/123 , C25D17/001 , C25D17/12 , C25D17/14 , H01L21/02063 , H01L21/02074 , H01L21/02087 , H01L21/0209 , H01L21/288 , H01L21/2885 , H01L21/3212 , H01L21/32134 , H01L21/67046 , H01L21/67051 , H01L21/6708 , H01L21/6715 , H01L21/67173 , H01L21/67184 , H01L21/6719 , H01L21/67219 , H01L21/67253 , H01L21/67742 , H01L21/76843 , H01L21/76849 , H01L21/76873 , H01L21/76877 , H01L2221/1089 , H05K3/423
摘要： A semiconductor wafer processing apparatus and processing method, in which a circuit pattern groove and/or hole formed in a semiconductor wafer is filled with a metal plating film and the metal plating film is removed except for the portion in the groove/hole so as to fabricate circuit wiring. The semiconductor wafer processing apparatus comprises a load/unload unit (1) for loading/unloading a semiconductor wafer (W) in a dried state on which a circuit is fabriacated, a film forming unit (2) for forming a metal plating film on the loaded semiconductor wafer, a bevel-etching unit (116) for etching the peripheral part of the semiconductor wafer, polishing units (10, 11) for polishing at least a part of the metal plating film on the semiconductor wafer, and robots (3, 8) for transferring the semiconductor wafer between the units.
摘要翻译：一种半导体晶片处理装置和处理方法，其中形成在半导体晶片中的电路图形凹槽和/或孔填充有金属镀膜，除了凹槽/孔中的部分之外除去金属镀膜，以便制造电路布线。半导体晶片处理装置包括用于在干燥状态下加载/卸载半导体晶片（W）的装载/卸载单元（1），在其上形成电路的干燥状态，用于在其上形成金属电镀膜的成膜单元（2）用于蚀刻半导体晶片的周边部分的斜面蚀刻单元（116），用于抛光半导体晶片上的金属电镀膜的至少一部分的抛光单元（10,11），机器人（3， 8），用于在所述单元之间传送半导体晶片。

36. 发明申请

WO01031095A1 PROCESS AND APPARATUS FOR THE MANUFACTURE OF HIGH PEEL-STRENGTH COPPER FOIL 审中-公开
标题翻译：高强度铜箔制造工艺及装置
公开(公告)号：WO01031095A1
公开(公告)日：2001-05-03
申请号：PCT/US2000/028730
申请日：2000-10-18
IPC分类号： C25D1/04 , C25D7/06 , C25D17/12 , H05K3/24 , H05K3/38 , B21C37/00 , B32B15/08 , C25D5/00 , C25D5/10 , C25D17/00
CPC分类号： C25D7/0642 , C25D1/04 , C25D7/0635 , C25D17/12 , H05K3/241 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10T428/31504
摘要： A one-step, integrated process and apparatus for producing electrolytic copper foil (10) having a dual-layer copper bond enhancing treatment electrodeposited on the matter side of the foil, which employs two "super-anodes" (27, 28) on a rotating drum cathode (21) to deposit the treatment.
摘要翻译：一种用于生产电解铜箔（10）的一步法，一体化方法和装置，其具有电沉积在箔的物质侧上的双层铜键增强处理，其在两个“超阳极”（27,28）上使用旋转鼓式阴极（21）沉积治疗。

37. 发明申请

WO00060141A1 THREE LAYER ANODE AND METHODS OF MANUFACTURE 审中-公开
标题翻译：三层阳极及其制造方法
公开(公告)号：WO00060141A1
公开(公告)日：2000-10-12
申请号：PCT/US2000/009435
申请日：2000-04-07
IPC分类号： C25B11/04 , C25B11/08 , C25B11/10 , C25D17/10 , C25D17/12
CPC分类号： C25B11/0484
摘要： The present invention provides an improved anode formulation and an improved method of manufacture. More specifically, the invention provides a tri-layer anode having an improved service life when used, for example, for steel strip electrogalvanizing. In one embodiment of the invention, the anode is comprised of a titanium substrate which is roughened and heat treated and subsequently coated with a first coating of iridium oxide/tantalum oxide. After the anode is heat treated, it is next coated, preferably by an electrodeposition process with a second coating of platinum. Finally, the anode is coated with a third coating of iridium oxide/tantalum oxide and subsequently heat treated.
摘要翻译：本发明提供改进的阳极配方和改进的制造方法。更具体地说，本发明提供一种当用于钢带电镀锌时具有改善的使用寿命的三层阳极。在本发明的一个实施方案中，阳极由钛基底组成，其被粗糙化并进行热处理，随后用氧化铱/氧化钽的第一涂层涂覆。在阳极被热处理之后，接下来涂覆，优选通过电沉积工艺与第二层铂。最后，用氧化铱/氧化钽的第三涂层涂覆阳极，随后进行热处理。

38. 发明申请

WO00011679A2 CONTACT ELEMENT 审中-公开
标题翻译：接触元
公开(公告)号：WO00011679A2
公开(公告)日：2000-03-02
申请号：PCT/DE1999/002187
申请日：1999-07-13
IPC分类号： C25D7/00 , C25D17/00 , C25D17/06 , C25D17/08 , C25D17/12 , H01B20060101 , H05K3/18 , H05K3/24 , H01B
CPC分类号： C25D7/00 , C25D7/0614 , C25D17/00 , C25D17/06 , C25D17/08 , C25D17/12 , H01B1/00 , H05K3/18 , H05K3/24
摘要： It is difficult to transmit large processing current on the surfaces of printed circuit boards (L) using clamp-type contact organs ( 6, 7). In order to solve said problem, contact elements (15, 16) having one or more contact surfaces (26) are disposed on the contact organs (6, 7). The shape of the contact surfaces (26) are configured in such a way that no damages occur in the areas of the conductive surfaces adjacent to the contact surfaces (26) when large currents are transmitted from the contact elements (15, 16) printed on the electrically conductive surface of printed board material (L) on the contact surfaces to the conductive surface.
摘要翻译：带有钳形的Kontaktierungsorganen（6,7）是难以在印刷电路板（L）的表面上传递大的处理电流。为了解决这个问题，描述了布置在接触构件（6,7）上的接触元件（15,16），其具有一个或多个接触表面（26）。的接触表面的形状（26）在接触面设计成使得在高电流的传输中由上键合焊盘的印刷电路板材料（L）的接触元件（15，16）的导电表面上表达（导电表面上 26）导电表面的相邻区域不会发生损坏。

39. 发明申请

WO99067448A1 FREELY DETACHABLE INSOLUBLE ANODE 审中-公开
标题翻译： FREELY可拆卸绝缘阳极
公开(公告)号：WO99067448A1
公开(公告)日：1999-12-29
申请号：PCT/JP1998/003307
申请日：1998-07-24
IPC分类号： C25D7/06 , C25D17/12
CPC分类号： C25D7/0642 , C25D17/12
摘要： A freely detachable anode (7) for continuously applying electroplating to a blank plating sheet such as a steel strip, capable of avoiding the occurrence of local non-conduction portions by a plurality of recess portions formed in the anode surface for inserting bolt heads, and avoiding non-uniform plating in the product, comprising an anode plate (1) freely detachably fitted to an electrode substrate (2) by a plurality of bolts (3) screwed from the anode plate side, wherein the sum of the occupied area of each of a plurality of recess portions (9) formed in the anode surface (8) for inserting the bolt heads inside an imaginary region of one rectangle defined by the length of the anode plate and an arbitrary width of the full width is not greater than 10 %, preferably not greater than 8 % and most preferably not greater than 5 %, of the area of the imaginary region.
摘要翻译：一种可自由拆卸的阳极（7），用于将电镀连续地施加到诸如钢带的空白电镀板上，能够通过形成在阳极表面中的多个凹部产生局部非导通部分，用于插入螺栓头;以及避免产品中的不均匀电镀，包括通过多个从阳极板螺纹连接的螺栓（3）可自由地拆卸地装配到电极基板（2）的阳极板（1），其中每个形成在阳极表面（8）中的多个凹部（9），用于将螺栓头插入由阳极板的长度限定的一个矩形的假想区域内，并且全宽度的任意宽度不大于10 ％，优选不大于8％，最优选不大于5％。

40. 发明申请

WO1997034029A1 COMPOUND ELECTRODE FOR ELECTROLYSIS 审中-公开
标题翻译：用于电解的化合物电极
公开(公告)号：WO1997034029A1
公开(公告)日：1997-09-18
申请号：PCT/JP1996000633
申请日：1996-03-14
申请人： ISHIFUKU METAL INDUSTRY CO., LTD. , SHOWA CO., LTD. , ASAKI, Tomoyoshi , ARAI, Yukio , MORI, Toshimi , TAKAYASU, Teruki
发明人： ISHIFUKU METAL INDUSTRY CO., LTD. , SHOWA CO., LTD.
IPC分类号： C25D17/12
CPC分类号： C25D17/12
摘要： A compound electrode for electrolysis which is provided with a cathode comprising a rotated drum, and an anode opposed to the cathode across a predetermined space and having an arcuate inner surface, and which is capable of retaining an electrolyte between the anode and cathode. The anode is provided with a first electrode base member formed at at least the portion thereof which contacts the electrolyte out of a corrosion-resistant metal and having a plurality of female threads along a line parallel to a rotary shaft of the drum, a second electrode base member covered at one surface thereof with an electrode catalyst, formed by titanium strips separated along a plurality of dividing planes parallel to the rotary shaft of the drum, and having a plurality of holes made on an axis parallel to the dividing planes, bolts extending through the holes in the second electrode base member, engaged with the female threads and fixing the second electrode base member to the first electrode base member, first intermediate members provided on the circumferential portions of the bolts which are between the first and second electrode base members, and second intermediate members provided in the vicinity of the circumferences of the second electrode base member which are between the first and second electrode base members.
摘要翻译：一种用于电解的复合电极，其具有包括旋转的鼓的阴极和与预定空间相对的阴极并且具有弧形内表面，并且能够在阳极和阴极之间保持电解质。阳极设置有第一电极基体部件，该第一电极基体部件至少形成在与耐腐蚀金属接触的电解质部分上，并且沿着与滚筒的旋转轴平行的线路具有多个阴螺纹，第二电极在其一个表面上覆盖有电极催化剂的基底构件，其由沿着与滚筒的旋转轴平行的多个分割平面分离的钛条形成，并且具有在平行于分割平面的轴线上形成的多个孔，螺栓延伸通过第二电极基体部件中的孔与内螺纹接合并将第二电极基体固定到第一电极基体上，设置在第一和第二电极基体之间的螺栓周向部分上的第一中间部件以及设置在所述第二电极基体的周围附近的第二中间部件 n是第一和第二电极基体。

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