专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明申请

WO2012142415A1 WAFER WITH SPACER INCLUDING HORIZONTAL MEMBER 审中-公开
标题翻译：带有间隔器的水平包括水平构件
公开(公告)号：WO2012142415A1
公开(公告)日：2012-10-18
申请号：PCT/US2012/033524
申请日：2012-04-13
申请人： ROBERT BOSCH GMBH , GRAHAM, Andrew, B. , YAMA, Gary , O'BRIEN, Gary
发明人： GRAHAM, Andrew, B. , YAMA, Gary , O'BRIEN, Gary
IPC分类号： B81C1/00 , H01L21/762
CPC分类号： H01L29/0649 , H01L21/76232 , H01L21/76283 , H01L21/7682 , H01L23/4821 , H01L2924/0002 , H01L2924/00
摘要： In one embodiment, a method of forming an insulating spacer includes providing a base layer, providing an intermediate layer above an upper surface of the base layer, etching a first trench in the intermediate layer, depositing a first insulating material portion within the first trench, depositing a second insulating material portion above an upper surface of the intermediate layer, forming an upper layer above an upper surface of the second insulating material portion, etching a second trench in the upper layer, and depositing a third insulating material portion within the second trench and on the upper surface of the second insulating material portion.
摘要翻译：在一个实施例中，形成绝缘间隔物的方法包括提供基底层，在基底层的上表面上方提供中间层，蚀刻中间层中的第一沟槽，在第一沟槽内沉积第一绝缘材料部分，在所述中间层的上表面上方沉积第二绝缘材料部分，在所述第二绝缘材料部分的上表面上形成上层，蚀刻所述上层中的第二沟槽，以及在所述第二沟槽内沉积第三绝缘材料部分并且在第二绝缘材料部分的上表面上。

32. 发明申请

WO2012142381A1 METHOD OF FORMING NON-PLANAR MEMBRANES USING CMP 审中-公开
标题翻译：使用CMP形成非平面膜的方法
公开(公告)号：WO2012142381A1
公开(公告)日：2012-10-18
申请号：PCT/US2012/033471
申请日：2012-04-13
申请人： ROBERT BOSCH GMBH , GRAHAM, Andrew, B. , YAMA, Gary , O'BRIEN, Gary
发明人： GRAHAM, Andrew, B. , YAMA, Gary , O'BRIEN, Gary
IPC分类号： B81C1/00
CPC分类号： B81C1/00103 , B81B2203/0376 , B81C2201/0104
摘要： A method of shaping a substrate in one embodiment includes providing a first support layer, providing a first shaping pattern on the first support layer, providing a substrate on the first shaping pattern, performing a first chemical mechanical polishing (CMP) process on the substrate positioned on the first shaping pattern, and removing the once polished substrate from the first shaping pattern.
摘要翻译：在一个实施例中，成形衬底的方法包括提供第一支撑层，在第一支撑层上提供第一成形图案，在第一成形图案上提供衬底，在定位的衬底上执行第一化学机械抛光（CMP）在第一成形图案上，并且从第一成形图案去除一次抛光的基板。

33. 发明申请

WO2012142368A1 OUT-OF-PLANE SPACER DEFINED ELECTRODE 审中-公开
标题翻译：平面外平面定义电极
公开(公告)号：WO2012142368A1
公开(公告)日：2012-10-18
申请号：PCT/US2012/033455
申请日：2012-04-13
申请人： ROBERT BOSCH GMBH , GRAHAM, Andrew, B. , YAMA, Gary , O'BRIEN, Gary
发明人： GRAHAM, Andrew, B. , YAMA, Gary , O'BRIEN, Gary
IPC分类号： B81C1/00
CPC分类号： B81B3/0021 , B81B2207/095 , B81C1/00301
摘要： In one embodiment, a method of forming an out-of-plane electrode includes providing an oxide layer above an upper surface of a device layer, providing a first cap layer portion above an upper surface of the oxide layer, etching a first electrode perimeter defining trench extending through the first cap layer portion and stopping at the oxide layer, depositing a first material portion within the first electrode perimeter defining trench, depositing a second cap layer portion above the first material portion, vapor releasing a portion of the oxide layer, depositing a third cap layer portion above the second cap layer portion, etching a second electrode perimeter defining trench extending through the second cap layer portion and the third cap layer portion, and depositing a second material portion within the second electrode perimeter defining trench, such that a spacer including the first material portion and the second material portion define out-of-plane electrode.
摘要翻译：在一个实施例中，形成平面外电极的方法包括在器件层的上表面上方提供氧化物层，在氧化物层的上表面上方提供第一覆盖层部分，蚀刻第一电极周界，沟槽延伸穿过第一盖层部分并在氧化物层处停止，在第一电极周界限定沟槽内沉积第一材料部分，在第一材料部分上方沉积第二盖层部分，释放氧化物层的一部分的蒸气，沉积在所述第二盖层部分上方的第三盖层部分，蚀刻延伸穿过所述第二盖层部分和所述第三盖层部分的第二电极周界限定沟槽，以及在所述第二电极周界限定沟槽内沉积第二材料部分，包括第一材料部分和第二材料部分的间隔件限定了平面外的电极。

34. 发明申请

WO2010083158A1 METHOD OF FORMING A DEVICE WITH A PIEZORESISTOR AND ACCELEROMETER 审中-公开
标题翻译：用PIEZORESISTOR和加速度计形成装置的方法
公开(公告)号：WO2010083158A1
公开(公告)日：2010-07-22
申请号：PCT/US2010/020750
申请日：2010-01-12
申请人： ROBERT BOSCH GMBH , YAMA, Gary , PRUITT, Beth , BARLIAN, Arnoldus, Alvin
发明人： YAMA, Gary , PRUITT, Beth , BARLIAN, Arnoldus, Alvin
IPC分类号： G01P15/12 , G01C19/56 , H01L21/762 , H01L27/12
CPC分类号： G01C19/56 , G01P15/0802 , G01P15/123 , G01P2015/0817
摘要： A method of forming a device with a piezoresistor is disclosed herein. In one embodiment, the method includes providing a substrate, etching a trench in the substrate to form a vertical wall, growing a piezoresistor layer epitaxially on the vertical wall, and separating the vertical wall from an underlying layer of the substrate that extends along a horizontal plane such that the piezoresistor layer is movable with respect to the underlying layer within the horizontal plane.
摘要翻译：本文公开了一种用压电电阻器形成器件的方法。在一个实施例中，该方法包括提供衬底，蚀刻衬底中的沟槽以形成垂直壁，在垂直壁上外延生长压敏电阻层，以及将垂直壁与沿着水平延伸的衬底的下层分离使得压电电阻层相对于水平面内的下层是可移动的。

35. 发明申请

WO2007021396A2 MICROELECTROMECHANICAL DEVICES AND FABRICATION METHODS 审中-公开
标题翻译：微电子机械装置和制造方法
公开(公告)号：WO2007021396A2
公开(公告)日：2007-02-22
申请号：PCT/US2006/026531
申请日：2006-07-07
申请人： ROBERT BOSCH GMBH , YAMA, Gary
发明人： YAMA, Gary
IPC分类号： B81C5/00
CPC分类号： B81C1/00333
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes a buried polysilicon layer and a "protective layer" deposited over the buried polysilicon layer to prevent possible erosion of, or damage to the buried polysilicon layer during processing steps. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.
摘要翻译：这里描述和说明了许多发明。在一个方面，本发明涉及MEMS器件以及制造或制造MEMS器件的技术，其具有在最终封装之前封装在室中的机械结构。一个实施例还包括埋入式多晶硅层和“保护层” 沉积在掩埋的多晶硅层上方以防止在处理步骤期间可能侵蚀或损害掩埋的多晶硅层。当沉积时，封装机械结构的材料包括以下属性中的一个或多个：低拉伸应力，良好的阶梯覆盖率，在进行后续处理时保持其完整性，不会显着和/或不利地影响机械结构的性能特性腔室中的机械结构（如果在沉积期间涂覆有材料），和/或促进与高性能集成电路的集成。在一个实施例中，封装机械结构的材料例如是硅（多晶硅，非晶硅或多孔硅，无论是掺杂的还是未掺杂的），碳化硅，硅 - 锗，锗或砷化镓。

36. 发明申请

WO2010107619A2 SUBSTRATE WITH MULTIPLE ENCAPSULATED PRESSURES 审中-公开
标题翻译：带有多个封装压力的基板
公开(公告)号：WO2010107619A2
公开(公告)日：2010-09-23
申请号：PCT/US2010/026685
申请日：2010-03-09
申请人： ROBERT BOSCH GMBH , CANDLER, Robert, N. , YAMA, Gary
发明人： CANDLER, Robert, N. , YAMA, Gary
IPC分类号： B81B7/02
CPC分类号： H01L23/3171 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81C1/00293 , B81C2203/0136 , H01L2924/0002 , H01L2924/00
摘要： A method of forming a device with multiple encapsulated pressures is disclosed herein. In accordance with one embodiment of the present invention, there is provided a method of forming a device with multiple encapsulated pressures, including providing a substrate, forming a functional layer on top of a surface of the substrate, the functional layer including a first device portion at a first location, and a second device portion at a second location adjacent to the first location, encapsulating the functional layer, forming at least one diffusion resistant layer above the encapsulated functional layer at a location above the first location and not above the second location, modifying an environment adjacent the at least one diffusion resistant layer, and diffusing a gas into the second location as a result of the modified environment.
摘要翻译：本文公开了形成具有多个封装压力的装置的方法。根据本发明的一个实施例，提供了一种形成具有多个封装压力的器件的方法，包括提供衬底，在衬底的表面的顶部上形成功能层，所述功能层包括第一器件部分在第一位置处的第二设备部分和与第一位置相邻的第二位置处的第二设备部分，封装功能层，在第一位置上方并且不在第二位置之上的位置处在封装的功能层上方形成至少一个扩散阻挡层改变邻近所述至少一个扩散阻挡层的环境，以及由于所述改进的环境而将气体扩散到所述第二位置。

37. 发明申请

WO2016100096A1 FLEXIBLE DISPOSABLE MEMS PRESSURE SENSOR 审中-公开
标题翻译：柔性可置换MEMS压力传感器
公开(公告)号：WO2016100096A1
公开(公告)日：2016-06-23
申请号：PCT/US2015/065084
申请日：2015-12-10
申请人： ROBERT BOSCH GMBH , YEE, Seow, Yuen , YAMA, Gary
发明人： YEE, Seow, Yuen , YAMA, Gary
IPC分类号： G01L9/12 , G01L1/14 , B81B7/02
CPC分类号： B81C99/008 , B81B7/0058 , B81B7/02 , B81B2201/0264 , B81C2201/038 , B81C2201/056 , G01L9/0005 , G01L19/144 , G01L19/147
摘要： A MEMS device, e.g., a flexible MEMS pressure sensor, is formed by disposing a sacrificial layer, such as photoresist, on a substrate. A first flexible support layer is disposed on the substrate, and a first conductive layer is disposed over a portion of the first support layer. A liquid or gel separator, e.g., silicone oil, is disposed on an internal region of the first conductive layer. A second flexible support layer encapsulates the first conductive layer and the separator. A second conductive layer disposed over the second support layer at least partially overlaps the first conductive layer and forms a parallel plate capacitor. A third flexible support layer encapsulates the second conductive layer and second support layer. Soaking the sensor in hot water releases the sensor from the sacrificial layer.
摘要翻译：通过在衬底上设置诸如光致抗蚀剂的牺牲层来形成MEMS器件，例如柔性MEMS压力传感器。第一柔性支撑层设置在基板上，并且第一导电层设置在第一支撑层的一部分上。液体或凝胶分离器，例如硅油，设置在第一导电层的内部区域上。第二柔性支撑层封装第一导电层和隔板。设置在第二支撑层上的第二导电层至少部分地与第一导电层重叠并形成平行板电容器。第三柔性支撑层封装第二导电层和第二支撑层。将传感器浸入热水中将传感器从牺牲层释放出来。

38. 发明申请

WO2008067097A2 MICROELECTROMECHANICAL DEVICES AND FABRICATION METHODS 审中-公开
标题翻译：微电子机械装置和制造方法
公开(公告)号：WO2008067097A2
公开(公告)日：2008-06-05
申请号：PCT/US2007/082882
申请日：2007-10-29
申请人： ROBERT BOSCH GMBH , METZ, Matthias , PAN, Zhiyu , STARK, Brian , ULM, Markus , YAMA, Gary
发明人： METZ, Matthias , PAN, Zhiyu , STARK, Brian , ULM, Markus , YAMA, Gary
IPC分类号： B81C1/00
CPC分类号： B81C1/00301 , B81B2207/015 , B81B2207/097 , B81C2203/0136 , B81C2203/0145 , H01L21/56 , H01L2924/0002 , H01L2924/00
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.
摘要翻译：这里描述和说明了许多发明。在一个方面，本发明涉及MEMS器件以及制造或制造MEMS器件的技术，其具有在最终封装之前封装在室中的机械结构。一个实施例还包括作为半导体感测结构的一部分的压电材料的位置。结合压电材料的半导体感测结构可以用作感测装置以提供与感测到的事件相关联的输出信号。

39. 发明申请

WO2008021534A1 DUAL-AXIS YAW RATE SENSING UNIT HAVING A TUNING FORK GYROSCOPE ARRANGEMENT 审中-公开
标题翻译：具有调音台陀螺仪布置的双轴感应传感器
公开(公告)号：WO2008021534A1
公开(公告)日：2008-02-21
申请号：PCT/US2007/018337
申请日：2007-08-16
申请人： ROBERT BOSCH GMBH , PAN, Zhiyu , LANG, Christoph , YAMA, Gary
发明人： PAN, Zhiyu , LANG, Christoph , YAMA, Gary
IPC分类号： G01P9/04 , H01L41/08
CPC分类号： G01C19/5607
摘要： A dual-axis tuning fork gyroscope includes four open-ended tuning forks arranged coplanarly in two opposite pairs, a first pair of open-ended tuning forks being arranged opposite one another along a first axis, a second pair of open-ended tuning forks being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another. The four open-ended tuning forks are mechanically coupled together so that all four tuning forks vibrate in the same manner in terms of frequency and phase.
摘要翻译：双轴音叉陀螺仪包括四个以两对相对共面布置的开放式调谐叉，第一对开放式调谐叉沿着第一轴线彼此相对布置，第二对开放式调音叉为沿着第二轴线彼此相对布置，第一轴线和第二轴线彼此垂直。四个开放式调谐叉机械耦合在一起，使得所有四个调谐叉在频率和相位方面以相同的方式振动。

40. 发明申请

WO2007046869A2 IN-PLANE MECHANICALLY COUPLED MICROELECTROMECHANICAL TUNING FORK RESONATORS 审中-公开
标题翻译：平面机械耦合微电子机械调谐器谐振器
公开(公告)号：WO2007046869A2
公开(公告)日：2007-04-26
申请号：PCT/US2006/019531
申请日：2006-05-19
申请人： ROBERT BOSCH GMBH , THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY , PAN, Zhiyu , CHANDLER, Rob, Norris , LUTZ, Markus , PARTRIDGE, Aaron , MATERNA, Volker , YAMA, Gary , FREY, Wilhelm
发明人： PAN, Zhiyu , CHANDLER, Rob, Norris , LUTZ, Markus , PARTRIDGE, Aaron , MATERNA, Volker , YAMA, Gary , FREY, Wilhelm
CPC分类号： H03H9/505 , H03H9/0023 , H03H9/02338 , H03H9/2468 , H03H2009/02496
摘要： There are many inventions described and illustrated herein, as well as many aspects and embodiments of those inventions. In one aspect, the present invention is directed to a resonator architecture including a plurality of in-plane vibration microelectromechanical resonators (for example, 2 or 4 resonators) that are mechanically coupled to provide, for example, a differential signal output. In one embodiment, the present invention includes four commonly shaped microelectromechanical tuning fork resonators (for example, tuning fork resonators having two or more rectangular-shaped or square-shaped tines). Each resonator is mechanically coupled to another resonator of the architecture. For example, each resonator of the architecture is mechanically coupled to another one of the resonators on one side or a corner of one of the sides. In this way, all of the resonators, when induced, vibrate at the same frequency.
摘要翻译：这里描述和示出了许多发明，以及这些发明的许多方面和实施例。在一个方面，本发明涉及一种包括机械耦合以提供例如差分信号输出的多个平面内振动微机电谐振器（例如，2或4个谐振器）的谐振器结构。在一个实施例中，本发明包括四个通常形状的微机电音叉谐振器（例如，具有两个或更多个矩形或正方形形状的叉的音叉谐振器）。每个谐振器机械耦合到该架构的另一谐振器。例如，该架构的每个谐振器在其中一个侧面的一侧或拐角上机械耦合到另一个谐振器。以这种方式，所有谐振器在被感应时以相同的频率振动。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式