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    • 21. 发明申请
    • A SUPERCRITICAL FLUID CLEANING SYSTEM AND METHOD
    • 超临界流体清洗系统及方法
    • WO2004064121A3
    • 2005-01-27
    • PCT/US2004000640
    • 2004-01-12
    • S C FLUIDS INCMOUNT DAVID J
    • MOUNT DAVID J
    • B08B7/00H01L21/00H01L21/02B08B3/10
    • H01L21/02101B08B7/0021H01L21/67051H01L21/6719
    • A supercritical fluid cleaning system and method comprising mainly a pressure chamber (2), a closable lid, a substrate support for holding at least one substrate, a rotable shaft (14) extending outward from within the chamber, an external rotary power source coupled magnetically or otherwise to the shaft (14), and a rotable component or impeller (20) attached to the chamber end of the shaft in close proximity to the substrate holding position, and baffles (16) located close to the rotable component. The rotable component is configured for rotation within the supercritical phase fluid in the chamber close to the surface of the wafer for causing agitation and turbulent fluid flow against the surface of the substrate, and increased intra-chamber fluid circulation.
    • 一种超临界流体清洁系统和方法,主要包括压力室(2),可关闭盖,用于保持至少一个基板的基板支撑件,从室内向外延伸的可旋转轴(14),磁耦合的外部旋转电源 或其他方式连接到轴(14)上,以及可旋转的组件或叶轮(20),其附接到轴的腔室端部,其紧邻衬底保持位置,以及靠近可旋转部件的挡板(16)。 可旋转部件被配置为在室内的超临界相流体内旋转,靠近晶片表面,以引起对衬底表面的搅动和湍流流体流动,并增加了室内流体循环。
    • 23. 发明申请
    • MICROELECTRONIC DEVICE MANUFACTURING IN COORDINATED CARBON DIOXIDE PROCESSING CHAMBERS
    • 协调二氧化碳加工炉中的微电子设备制造
    • WO2004094696A1
    • 2004-11-04
    • PCT/US2004/005220
    • 2004-02-23
    • MICELL TECHNOLOGIES INC.DEYOUNG, James, P.MCCLAIN, James, B.
    • DEYOUNG, James, P.MCCLAIN, James, B.
    • C23F1/00
    • H01L21/67207B08B7/0021H01L21/67253
    • A system for processing microelectronic substrates in a liquid or supercritical carbon dioxide process media comprises (a) a plurality of carbon dioxide processing chambers; (b) a carbon dioxide supply vessel operatively associated with each of the carbon dioxide processing chambers; (c) a first process chemical supply vessel operatively associated with at least one of the carbon dioxide processing chambers; (d) a waste collection vessel operatively associated with at least one of the carbon dioxide processing chambers; and (e) a controller operatively associated with the plurality of processing chambers, the carbon dioxide supply vessel, the vacuum pump if present, the first process chemical supply vessel, and the waste collection vessel, the controller configured to independently process microelectronic substrates in each of the processing chambers.
    • 用于在液体或超临界二氧化碳过程介质中处理微电子衬底的系统包括(a)多个二氧化碳处理室; (b)与每个二氧化碳处理室可操作地连接的二氧化碳供应容器; (c)可操作地与至少一个二氧化碳处理室相关联的第一过程化学品供给容器; (d)与至少一个二氧化碳处理室可操作地相关联的废物收集容器; 和(e)与所述多个处理室,所述二氧化碳供应容器,所述真空泵(如果存在的话),所述第一过程化学品供应容器和所述废物收集容器操作地相关联的控制器,所述控制器被配置为在每个处理室中独立地处理微电子衬底 的处理室。
    • 24. 发明申请
    • CHAMBER AND ASSOCIATED METHODS FOR WAFER PROCESSING
    • 用于波浪加工的室和相关方法
    • WO2004093166A2
    • 2004-10-28
    • PCT/US2004008994
    • 2004-03-23
    • LAM RES CORPPARKS JOHN
    • PARKS JOHN
    • B08B7/00H01L21/00H01L21/683H01L21/687
    • H01L21/67126B08B7/0021H01L21/67051H01L21/67109H01L21/67751H01L21/6838
    • A wafer processing chamber is provided for allowing a fluid flow and a fluid pressure within the chamber to be controlled in a variable manner. The chamber utilizes removable plates that can be configured to control the fluid flow and the fluid pressure in an inner volume within the chamber. Also, the removable plates can be used to separate the inner volume within the chamber from an outer volume within the chamber. Additionally, a wafer clamping apparatus is provided for use in the chamber. The wafer clamping apparatus uses a pressure differential between a top surface and a bottom surface of the wafer to pull the wafer toward a wafer support structure in contact with the wafer bottom surface, whereby the wafer is secured and maintained in an immobile state. Furthermore, high-pressure chamber configurations are provided.
    • 提供晶片处理室以允许以可变的方式控制腔室内的流体流动和流体压力。 该室利用可移动的板,其可被构造成控制腔内的内部体积中的流体流动和流体压力。 而且,可拆卸的板可用于将腔室内的体积与室内的外部容积分开。 此外,提供晶片夹紧装置用于室中。 晶片夹紧装置使用晶片的顶表面和底表面之间的压力差将晶片拉向与晶片底表面接触的晶片支撑结构,由此晶片被固定并保持在固定状态。 此外,还提供了高压室配置。