专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2008027386A3 CONTROLLED AMBIENT SYSTEM FOR INTERFACE ENGINEERING 审中-公开
标题翻译：用于界面工程的控制环境系统
公开(公告)号：WO2008027386A3
公开(公告)日：2008-08-21
申请号：PCT/US2007018924
申请日：2007-08-28
申请人： LAM RES CORP , BOYD JOHN , DORDI YEZDI , ARUNAGIRI TIRUCHIRAPALLI , MOORING BENJAMIN W , PARKS JOHN , THIE WILLIAM , REDEKER FRITZ C , HOWALD ARTHUR M , SCHOEPP ALAN , HEMKER DAVID
发明人： BOYD JOHN , DORDI YEZDI , ARUNAGIRI TIRUCHIRAPALLI , MOORING BENJAMIN W , PARKS JOHN , THIE WILLIAM , REDEKER FRITZ C , HOWALD ARTHUR M , SCHOEPP ALAN , HEMKER DAVID
IPC分类号： H01L21/00 , H01L21/20
CPC分类号： H01L21/67184 , H01L21/67017 , H01L21/67207 , H01L21/67745
摘要： A cluster architecture including a lab-ambient controlled transfer module that is coupled to one or more wet substrate processing modules The lab-ambient controlled transfer module and the one or more wet substrate processing modules manage a first ambient environment having a vacuum transfer module coupled to the lab-ambient controlled transfer module and one or more plasma processing modules The vacuum transfer module and the one or more plasma processing modules manage a second ambient environment A controlled ambient transfer module coupled to the vacuum transfer module and one or more ambient processing modules manage a third ambient environment The cluster architecture therefore enables controlled processing of the substrate in eith the first, second or third ambient environments, as well as dupng associated transitions The embodiments also provide for efficient methods for filling a trench of a substrate
摘要翻译：一种集群架构，包括耦合到一个或多个湿式衬底处理模块的实验室环境受控传输模块。实验室环境受控传输模块和一个或多个湿衬底处理模块管理第一环境环境，其具有耦合到实验室环境控制转移模块和一个或多个等离子体处理模块真空转移模块和一个或多个等离子体处理模块管理第二周围环境。耦合到真空转移模块的受控环境转移模块和一个或多个环境处理模块管理第三环境环境因此，集群体系结构能够在第一，第二或第三环境环境中进行衬底的受控处理，以及重复相关的过渡。实施例还提供用于填充衬底的沟槽的有效方法

2. 发明申请

WO2007078642A3 METHOD AND APPARATUS FOR REMOVING CONTAMINATION FROM SUBSTRATE 审中-公开
标题翻译：用于从基板去除污染的方法和设备
公开(公告)号：WO2007078642A3
公开(公告)日：2007-12-27
申请号：PCT/US2006047119
申请日：2006-12-08
申请人： LAM RES CORP , FREER ERIK M , DE LARIOS JOHN M , MIKHAYLICHENKO KATRINA , RAVKIN MICHAEL , KOROLIK MIKHAIL , REDEKER FRED C , THOMAS CLINT , PARKS JOHN
发明人： FREER ERIK M , DE LARIOS JOHN M , MIKHAYLICHENKO KATRINA , RAVKIN MICHAEL , KOROLIK MIKHAIL , REDEKER FRED C , THOMAS CLINT , PARKS JOHN
IPC分类号： B08B7/00
CPC分类号： H01L21/02057 , B05D3/10 , B08B7/02 , C11D1/04 , C11D3/042 , C11D3/044 , C11D3/18 , C11D3/2079 , C11D3/222 , C11D3/225 , C11D3/3765 , C11D9/00 , C11D9/02 , C11D9/267 , C11D11/0047 , C11D17/0004 , C11D17/0013 , C11D17/0017 , C11D17/003 , C11D17/041 , C23G1/00 , C23G1/18 , G03F7/42 , G03F7/423 , H01L21/02052 , H01L21/02096 , H01L21/31133 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086
摘要： A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.
摘要翻译：清洁材料设置在基板上。清洁材料包括分散在液体介质内的固体组分。对液体介质内的固体组分施加力以使固体组分接近衬底上存在的污染物。施加到固体组分上的力可以由液体介质内的不混溶组分施加。当固体组分充分接近污染物时，在固体组分和污染物之间建立相互作用。然后，将固体组分移离基底，使得从基底去除与固体组分相互作用的污染物。

3. 发明申请

WO2006065532A3 WAFER HEATING AND TEMPERATURE CONTROL BY BACKSIDE FLUID INJECTION 审中-公开
标题翻译：背面流体注射的加热和温度控制
公开(公告)号：WO2006065532A3
公开(公告)日：2007-04-19
申请号：PCT/US2005043256
申请日：2005-11-29
申请人： LAM RES CORP , MOORING BEN , PARKS JOHN , HYMES DIANE J
发明人： MOORING BEN , PARKS JOHN , HYMES DIANE J
IPC分类号： C23C16/00 , C23F1/00
CPC分类号： H01L21/67109
摘要： In one of the many embodiments, an apparatus for processing a substrate is provided which includes a substrate processing chamber where the substrate is positioned within the substrate processing chamber so the substrate at least partially separates the substrate processing chamber into a first chamber and a second chamber. The apparatus further includes a first chamber inlet configured to input a first fluid of a first temperature into the first chamber at a first pressure and a second chamber inlet configured to input a second fluid of a second temperature into the second chamber at a second pressure wherein the first pressure and the second pressure are substantially equal. The second temperature is capable of being utilized to manage substrate temperature.
摘要翻译：在许多实施例中的一个实施例中，提供了一种用于处理衬底的装置，其包括衬底处理室，其中衬底位于衬底处理室内，使得衬底至少部分地将衬底处理室分离成第一腔室和第二腔室。该装置还包括第一室入口，其构造成在第一压力下将第一温度的第一流体输入到第一室中，并且第二室入口构造成在第二压力下将第二温度的第二流体输入到第二室中，第一压力和第二压力基本相等。第二个温度可以用来管理衬底温度。

4. 发明申请

WO2006039127A2 WAFER EDGE WHEEL WITH DRYING FUNCTION 审中-公开
标题翻译：具有干燥功能的WAFER边缘轮
公开(公告)号：WO2006039127A2
公开(公告)日：2006-04-13
申请号：PCT/US2005033301
申请日：2005-09-16
申请人： LAM RES CORP , PARKS JOHN
发明人： PARKS JOHN
IPC分类号： F26B5/04
CPC分类号： H01L21/67034 , H01L21/6838
摘要： An edge wheel for supporting and rotating a disk-shaped substrate includes a wheel body having a peripheral groove configured to support and edge of a substrate and at least one radial channel extending into said wheel body from said peripheral groove. An edge wheel dryer and a method for processing a disk-shaped substrate are also described.
摘要翻译：用于支撑和旋转盘形基板的边缘轮包括具有构造成支撑基板的边缘的周边槽和从所述外围槽延伸到所述车轮主体中的至少一个径向通道的车轮主体。还描述了边缘轮干燥器和用于处理盘形基底的方法。

5. 发明申请

WO2004093166A2 CHAMBER AND ASSOCIATED METHODS FOR WAFER PROCESSING 审中-公开
标题翻译：用于波浪加工的室和相关方法
公开(公告)号：WO2004093166A2
公开(公告)日：2004-10-28
申请号：PCT/US2004008994
申请日：2004-03-23
申请人： LAM RES CORP , PARKS JOHN
发明人： PARKS JOHN
IPC分类号： B08B7/00 , H01L21/00 , H01L21/683 , H01L21/687
CPC分类号： H01L21/67126 , B08B7/0021 , H01L21/67051 , H01L21/67109 , H01L21/67751 , H01L21/6838
摘要： A wafer processing chamber is provided for allowing a fluid flow and a fluid pressure within the chamber to be controlled in a variable manner. The chamber utilizes removable plates that can be configured to control the fluid flow and the fluid pressure in an inner volume within the chamber. Also, the removable plates can be used to separate the inner volume within the chamber from an outer volume within the chamber. Additionally, a wafer clamping apparatus is provided for use in the chamber. The wafer clamping apparatus uses a pressure differential between a top surface and a bottom surface of the wafer to pull the wafer toward a wafer support structure in contact with the wafer bottom surface, whereby the wafer is secured and maintained in an immobile state. Furthermore, high-pressure chamber configurations are provided.
摘要翻译：提供晶片处理室以允许以可变的方式控制腔室内的流体流动和流体压力。该室利用可移动的板，其可被构造成控制腔内的内部体积中的流体流动和流体压力。而且，可拆卸的板可用于将腔室内的体积与室内的外部容积分开。此外，提供晶片夹紧装置用于室中。晶片夹紧装置使用晶片的顶表面和底表面之间的压力差将晶片拉向与晶片底表面接触的晶片支撑结构，由此晶片被固定并保持在固定状态。此外，还提供了高压室配置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式