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21. 发明申请

WO2004053976A3 METHOD OF MAKING A SOCKET TO PERFORM TESTING ON INTEGRATED CIRCUITS AND SUCH A SOCKET 审中-公开
标题翻译：制作插座的方法，对集成电路进行测试，这样一个插座
公开(公告)号：WO2004053976A3
公开(公告)日：2004-08-05
申请号：PCT/US0338463
申请日：2003-12-02
申请人： FORMFACTOR INC
发明人： KHANDROS IGOR K , MATHIEU GAETAN L , REYNOLDS CARL V
IPC分类号： G01R1/04 , G01R1/073 , G01R3/00
CPC分类号： G01R3/00 , G01R1/0433 , G01R1/0483 , G01R1/07378 , G01R31/2863 , H01L24/13 , H01L2224/131 , H01L2924/01046 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T29/49179 , Y10T29/49197 , Y10T29/49204 , Y10T29/4921 , Y10T29/49211 , Y10T29/49224 , Y10T29/53217 , Y10T29/53265 , H01L2924/014
摘要： A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.
摘要翻译：互连结构廉价地制造并且容易地插入到插座中。通过形成具有由具有与空腔对应的开口的掩模材料覆盖的空腔的牺牲衬底来制造互连结构。通过沉积导电材料，然后在开口内连接线并通过沉积更多导电材料进行另一电镀工艺来执行第一电镀工艺。通过首先去除掩模材料和牺牲衬底来完成互连结构。电线的端部与现在形成的接触结构相对联接到电路板。要完成插座，支持设备耦合到电路板以保持测试的集成电路。

22. 发明申请

WO0033089A3 LITHOGRAPHIC CONTACT ELEMENTS 审中-公开
标题翻译： LITHOGRAPHIC联系元素
公开(公告)号：WO0033089A3
公开(公告)日：2001-03-08
申请号：PCT/US9928597
申请日：1999-12-01
申请人： FORMFACTOR INC
发明人： MATHIEU GAETAN L , ELDRIDGE BENJAMIN N , GRUBE GARY W
IPC分类号： G01R1/073 , G01B7/34 , G01N27/00 , G01R1/067 , G01R3/00 , H01L21/48 , H01L21/60 , H01L21/66 , H01L23/48 , H01R12/16 , H01R33/76 , H05K3/32 , H05K3/40
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06761 , H01L2924/0002 , H01L2924/01005 , H01L2924/14 , H05K3/326 , H05K3/4092 , H01L2924/00
摘要： A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.
摘要翻译：通过光刻技术形成包括弹簧接触元件的互连的方法。在一个实施例中，该方法包括在衬底的第一部分上施加掩模材料，掩模材料具有将限定弹簧结构的第一部分的开口，在开口中沉积结构材料（例如导电材料）并用结构材料过度填充开口，去除结构材料的一部分，以及去除掩模材料的第一部分。在该实施例中，弹簧结构的第一部分的至少一部分没有掩蔽材料。在本发明的一个方面，该方法包括平坦化掩模材料层和结构材料以去除结构材料的一部分。另一方面，形成的弹簧结构包括柱部分，梁部分和尖端结构部分中的一个。

23. 发明申请

WO2004059330A3 MICROELECTRONIC CONTACT STRUCTURE 审中-公开
标题翻译：微电子接触结构
公开(公告)号：WO2004059330A3
公开(公告)日：2004-11-18
申请号：PCT/US0340829
申请日：2003-12-18
申请人： FORMFACTOR INC
发明人： GRUBE GARY W , MATHIEU GAETAN L , MADSEN ALEC
IPC分类号： G01R1/067 , G01R1/073
CPC分类号： G01R1/06733 , G01R1/06716 , G01R1/0675 , G01R1/07314 , G01R3/00
摘要： An elongate, columnar micro-mechanical structure (100) disposed along a central longitudinal axis (101); the structure is made up of laminated structural layers (102, 104, 106), each comprised of a structural material. The layers define a substantially rigid base portion (108) at a proximal end of the structure, a resilient intermediate portion (110) extending from the base portion along the central axis, and a contact tip (112) extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.
摘要翻译：沿着中心纵向轴线（101）设置的细长的柱状微机械结构（100）; 该结构由层压结构层（102,104,106）组成，每层包括结构材料。这些层在结构的近端处限定基本上刚性的基部（108），从基部沿中心轴延伸的弹性中间部分（110）以及从弹性部分延伸的接触尖端结构的远端。接触结构的弹性部分由限定在层中的弹性臂组成。弹性臂的相对端部可以相对于中心轴线彼此成角度地偏移。因此，当接触结构沿轴向压缩时，接触尖端将围绕中心轴线旋转，同时基座保持固定，为接触尖端提供有益的擦拭作用。

24. 发明申请

WO02058137A3 COMPOSITE MICROELECTRONIC SPRING STRUCTURE AND METHOD FOR MAKING SAME 审中-公开
标题翻译：复合微电极弹簧结构及其制造方法
公开(公告)号：WO02058137A3
公开(公告)日：2003-01-16
申请号：PCT/US0149398
申请日：2001-12-19
申请人： FORMFACTOR INC
发明人： GRUBE GARY W , KHANDROS IGOR K , MATHIEU GAETAN L
IPC分类号： B81B3/00 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01H1/00 , H01L23/48 , H01L23/485 , H01L23/498 , H05K3/20 , H05K3/34
CPC分类号： G01R1/06727 , G01R1/06744 , G01R1/07342 , G01R3/00 , H01H1/0036 , H01L23/49811 , H01L24/06 , H01L24/10 , H01L24/72 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/45144 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/30105 , H05K3/20 , H05K3/3421 , H01L2224/13099 , H01L2224/29099 , H01L2924/00
摘要： An improved microelectronic spring structure, and method of making the same, are disclosed. The improvement comprises, in a spring contact of the type comprising a beam (104) attached to a post, of replacing the post with a plurality of column elements (102). The beam component (104) is thus provided with one or more column elements (102) which both structurally support and electrically connect one end of the beam to an electronic component. The column elements (102) are preferably comprised of relatively straight segments of wire elements that are ball-bonded to a substrate (114) and are over-coated with suitable structural and/or conducting materials. In the alternative, the improvement comprises a single column element comprised of a relatively straight segment of wire that is ball-bonded to a substrate and over-coated with suitable structural and conducting materials, wherein the column element is essentially rigid. The improved spring structures are especially useful for use as spring contacts on substrates such as probe cards, interposers, semiconductor devices, and other electronic components.
摘要翻译：公开了一种改进的微电子弹簧结构及其制造方法。该改进包括在包括附接到柱的梁（104）的类型的弹簧接触中，用多个柱元件（102）替换柱。梁部件（104）因此设置有一个或多个列元件（102），其两个结构上支撑并将电子束的一端电连接到电子部件。柱元件（102）优选地由相对直的线元件组成，其被球形结合到基底（114）并且被适当的结构和/或导电材料覆盖。在替代方案中，改进包括单柱元件，其由相对直的导线段组成，其与球体结合到基底上并用适当的结构和导电材料涂覆，其中柱元件基本上是刚性的。改进的弹簧结构特别适用于诸如探针卡，插入件，半导体器件和其它电子部件的基板上的弹簧触点。

25. 发明申请

WO0148870A2 INTERCONNECT FOR MICROELECTRONIC STRUCTURES WITH ENHANCED SPRING CHARACTERISTICS 审中-公开
标题翻译：具有增强弹簧特性的微电子结构互连
公开(公告)号：WO0148870A2
公开(公告)日：2001-07-05
申请号：PCT/US0035450
申请日：2000-12-27
申请人： FORMFACTOR INC
发明人： MATHIEU GAETAN L , ELDRIDGE BENJAMIN N
IPC分类号： H01L21/48 , H01L23/48 , H01L23/485 , H01R12/00 , H01R13/24
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06761 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/71 , H01L24/72 , H01L2224/05001 , H01L2224/05568 , H01L2224/11002 , H01L2224/11003 , H01L2224/13099 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01061 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/3011 , H01R12/57 , H01R12/718 , H01R13/03 , H01R13/24 , H05K3/326 , H05K3/4092 , H05K2201/0311 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： An interconnection element and a method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than the spring constant of the first structure alone. In one embodiment, the interconnection element is adapted to be coupled to an electronic component tracked as a conductive path from the electronic component. In one embodiment, the method includes forming a first (interconnection) structure coupled to a substrate to define a shape suitable as an interconnection in an integrated circuit environment and then coupling, such as by coating, a second (interconnection) structure to the first (interconnection) structure to form an interconnection element. Collectively, the first (interconnection) structure and the second (interconnection) structure have a spring constant greater than a spring constant of the first (interconnection) structure.
摘要翻译：一种互连元件和形成互连元件的方法。在一个实施例中，互连元件包括耦合到第一结构的第一结构和第二结构。与第一材料耦合的第二结构具有大于单独的第一结构的弹簧常数的弹簧常数。在一个实施例中，互连元件适于耦合到从电子部件跟踪为导电路径的电子部件。在一个实施例中，该方法包括形成耦合到衬底的第一（互连）结构，以限定适合于集成电路环境中的互连的形状，然后例如通过将第二（互连）结构涂覆到第一（互连）互连）结构以形成互连元件。总的来说，第一（互连）结构和第二（互连）结构具有大于第一（互连）结构的弹簧常数的弹簧常数。

26. 发明申请

WO2004048982A2 PROBE ARRAY AND METHOD OF ITS MANUFACTURE 审中-公开
标题翻译：探索阵列及其制造方法
公开(公告)号：WO2004048982A2
公开(公告)日：2004-06-10
申请号：PCT/US0337611
申请日：2003-11-24
申请人： FORMFACTOR INC
发明人： MATHIEU GAETAN L , ELDRIDGE BENJAMIN N , GRUBE GARY W
IPC分类号： B23H9/00 , G01R1/073 , B23H1/04
CPC分类号： B23H9/00 , G01R1/07314
摘要： A method of forming a probe array includes forming a layer of tip material over a block of probe material. A first electron discharge machine (EDM) electrode is positioned over the layer of tip material, the EDM electrode having a plurality of openings corresponding to a plurality of probes to be formed. Excess material from the layer of tip material and the block of probe material is removed to form the plurality of probes. A substrate having a plurality of through holes corresponding to the plurality of probes is positioned so that the probes penetrate the plurality of through holes. The substrate is bonded to the plurality of probes. Excess probe material is removed so as to planarize the substrate.
摘要翻译：形成探针阵列的方法包括在探针材料块上形成尖端材料层。第一电子放电机（EDM）电极位于尖端材料层上方，EDM电极具有与要形成的多个探针对应的多个开口。去除从尖端材料层和探针材料块的多余材料以形成多个探针。具有对应于多个探针的多个通孔的基板被定位成使得探针穿透多个通孔。衬底被结合到多个探针。去除过量的探针材料以使基底平坦化。

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