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11. 发明申请

WO1996019032A1 RECTIFIER ASSEMBLY FOR AUTOMOTIVE ALTERNATOR 审中-公开
标题翻译：汽车零部件整流器总成
公开(公告)号：WO1996019032A1
公开(公告)日：1996-06-20
申请号：PCT/US1995016340
申请日：1995-12-14
申请人： DEPETRIS, Peter, S.
IPC分类号： H02K11/00
CPC分类号： H01L25/112 , H01L2924/0002 , H01L2924/09701 , H02K11/02 , H02K11/046 , H02M7/003 , H01L2924/00
摘要： A poly-phase rectifier assembly (100) for an alternating current generator includes five heat sinks, three of which are compression spring-loaded (130) to form series electrical circuits to the poly-phase stator windings. The other two heat sinks (101, 102) are separated by a crush-proof, phenolic type, insulating gasket (103), and carry a plurality of semiconductor button-type diodes. The stator sinks are cupped (121) to position compression springs, and are slotted (170) for heat transfer. The stator sinks extend above the slotted positive heat sink into the cooling air flow area. A second embodiment utilizes back-to-back diodes, compression spring-loaded into a positive heat sink and a negative heat sink. A cupped stator heat sink forms a nest and provides series connection for the stator poly-phase windings. A plastic assembly supports a capacitor.
摘要翻译：用于交流发电机的多相整流器组件（100）包括五个散热器，其中三个是压缩弹簧加载（130），以形成到多相定子绕组的串联电路。另外两个散热器（101,102）由防破坏的酚醛型绝缘垫片（103）隔开，并且携带多个半导体按钮型二极管。定子槽被杯形（121）以定位压缩弹簧，并且开槽（170）用于热传递。定子槽在开槽的正散热器上方延伸到冷却空气流动区域中。第二实施例利用背对背二极管，将弹簧加载到正散热器和负散热器中。杯形定子散热器形成一个嵌套并为定子多相绕组提供串联连接。塑料组件支持电容器。

12. 发明申请

WO1990001798A1 HERMETICALLY SEALED COMPRESSION BONDED CIRCUIT ASSEMBLY 审中-公开
标题翻译：密封式密封电路组装
公开(公告)号：WO1990001798A1
公开(公告)日：1990-02-22
申请号：PCT/US1989003165
申请日：1989-07-21
申请人： SUNDSTRAND CORPORATION
发明人： SUNDSTRAND CORPORATION , CROWE, Lawrence, E. , SUTRINA, Thomas, A.
IPC分类号： H01L23/16
CPC分类号： H01L25/112 , H01L2924/0002 , Y10S257/909 , H01L2924/00
摘要： A method of manufacturing hermetically sealed circuit assemblies (10) having circuit elements (74, 76, 78 and 80) to be compression bonded, a hermetically sealed circuit assembly having circuit elements to be compression bonded and a stack containing at least one hermetically sealed circuit assembly having circuit elements which are compression bonded is disclosed. Uniform thickness of individual hermetically sealed circuit assemblies measured across columns (22-30) is insured by positioning deformable spacers (124-132) in the columns containing the circuit elements to be compression bonded, and deforming the deformable spacers. Thereafter a compressive force is applied to a stack of one or more circuits through the columns which contain the circuit elements to be compression bonded. The individual hermetically sealed circuit assemblies have circular corrugations (32-40) in a flat surface (14) and circular corrugations (114-122) in a lid (20) which are disposed within the columns containing the individual circuit elements to be compression bonded.
摘要翻译：一种制造具有被压接的电路元件（74,76,78和80）的气密密封电路组件（10）的方法，具有要被压接的电路元件的气密密封电路组件和包含至少一个气密密封电路公开了具有被压接的电路元件的组件。通过在包含要压缩的电路元件的列中定位可变形间隔物（124-132）并使可变形间隔物变形来确保跨柱（22-30）测量的各个气密密封电路组件的均匀厚度。此后，通过包含待压接的电路元件的列将压力施加到一个或多个电路的堆叠。单独的密封电路组件在平坦表面（14）中具有圆形波纹（32-40）和在盖（20）中的圆形波纹（114-122），其设置在包含要压缩的各个电路元件的列内。

13. 发明申请

WO2018050713A1 PRESS-PACK POWER MODULE 审中-公开
标题翻译：压包功率模块
公开(公告)号：WO2018050713A1
公开(公告)日：2018-03-22
申请号：PCT/EP2017/073051
申请日：2017-09-13
申请人： RISE ACREO AB
发明人： NEE, Hans-Peter , HAMMAM, Tag , KOSTOV, Konstantin
IPC分类号： H01L25/07 , H01L23/00 , H01L23/40 , H01L25/11 , H01L23/46
CPC分类号： H01L25/074 , H01L23/4012 , H01L24/72 , H01L25/112 , H01L25/115 , H01L25/117
摘要： A semiconductor power module (1) and a method for assembling a semiconductor power module are disclosed. The semiconductor power module comprising at least one semiconductor chip (5) sandwiched between a first busbar and a second busbar thereby forming a module substructure. Further, the semiconductor power module includes a first clamping structure arranged to clamp the module substructure along a first axis (101) in order to form a press-pack module (11), and a second clamping structure comprising two heat-sinks and which is arranged to clamp the press-pack module between the two heat-sinks along a second axis (102) being perpendicular to the first axis. Hereby, a robust and reliable power module having low thermal resistance between the heat sinks and the press-pack module is presented. (For publication: Fig. 1)
摘要翻译：公开了半导体功率模块（1）和用于组装半导体功率模块的方法。该半导体功率模块包括夹在第一母线和第二母线之间的至少一个半导体芯片（5），从而形成模块子结构。此外，半导体功率模块包括第一夹紧结构和第二夹紧结构，第一夹紧结构布置成沿着第一轴线（101）夹紧模块子结构以形成压装模块（11），第二夹紧结构包括两个散热器并且布置成沿着垂直于第一轴线的第二轴线（102）在两个散热器之间夹紧压缩包模块。因此，介绍了散热器与压装模块之间具有低热阻的坚固可靠的功率模块。（出版物：图1）

14. 发明申请

WO2016154494A4 VERTICAL SHIELDING AND INTERCONNECT FOR SIP MODULES 审中-公开
标题翻译： SIP模块的垂直屏蔽和互连
公开(公告)号：WO2016154494A4
公开(公告)日：2017-01-05
申请号：PCT/US2016024110
申请日：2016-03-24
申请人： APPLE INC
发明人： HOANG LAN H , KATAHIRA TAKAYOSHI , LIU CHANG
IPC分类号： H01L23/00 , H01L23/498 , H01L23/552 , H01L25/065 , H01L25/11 , H01L25/16
CPC分类号： H05K1/144 , H01L21/481 , H01L21/4817 , H01L21/4867 , H01L21/565 , H01L23/295 , H01L23/49811 , H01L23/5386 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/32 , H01L25/0652 , H01L25/105 , H01L25/112 , H01L25/16 , H01L25/162 , H01L25/165 , H01L2224/131 , H01L2224/16105 , H01L2224/16106 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/8184 , H01L2225/1023 , H01L2225/1047 , H01L2225/1058 , H01L2924/15151 , H01L2924/15311 , H01L2924/15322 , H01L2924/16251 , H01L2924/1815 , H01L2924/18161 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19106 , H05K1/0216 , H05K1/182 , H05K3/284 , H05K2201/041 , H01L2924/014 , H01L2924/00014
摘要： Vertical shielding and interconnect structures for system-in-a-package modules, where the vertical shielding and interconnect structures are readily manufactured and are space efficient.
摘要翻译：用于系统级封装模块的垂直屏蔽和互连结构，垂直屏蔽和互连结构容易制造并具有空间效率。

15. 发明申请

WO2016154494A2 VERTICAL SHIELDING AND INTERCONNECT FOR SIP MODULES 审中-公开
标题翻译： SIP模块的垂直屏蔽和互连
公开(公告)号：WO2016154494A2
公开(公告)日：2016-09-29
申请号：PCT/US2016/024110
申请日：2016-03-24
申请人： APPLE INC.
发明人： HOANG, Lan H. , KATAHIRA, Takayoshi , LIU, Chang
IPC分类号： H01L23/00 , H01L23/498 , H01L23/552 , H01L25/16
CPC分类号： H05K1/144 , H01L21/481 , H01L21/4817 , H01L21/4867 , H01L21/565 , H01L23/295 , H01L23/49811 , H01L23/5386 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/32 , H01L25/0652 , H01L25/105 , H01L25/112 , H01L25/16 , H01L25/162 , H01L25/165 , H01L2224/131 , H01L2224/16105 , H01L2224/16106 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/8184 , H01L2225/1023 , H01L2225/1047 , H01L2225/1058 , H01L2924/15151 , H01L2924/15311 , H01L2924/15322 , H01L2924/16251 , H01L2924/1815 , H01L2924/18161 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19106 , H05K1/0216 , H05K1/182 , H05K3/284 , H05K2201/041 , H01L2924/014 , H01L2924/00014
摘要： Vertical shielding and interconnect structures for system-in-a-package modules, where the vertical shielding and interconnect structures are readily manufactured and are space efficient.
摘要翻译：垂直屏蔽和互连结构易于制造且节省空间的系统级封装模块的垂直屏蔽和互连结构。

16. 发明申请

WO2010147199A1 配線基板および電力変換装置审中-公开
标题翻译：接线板和电源转换器件
公开(公告)号：WO2010147199A1
公开(公告)日：2010-12-23
申请号：PCT/JP2010/060332
申请日：2010-06-18
申请人：株式会社安川電機 , 樋口雅人 , 川波靖彦 , 寺園勝志 , 東川康児 , 佐々木亮 , 森原貴征 , 青木隆 , 伊藤徹也 , 中林幸久 , 磯部祐 , 小熊清典
发明人：樋口　雅人 , 川波　靖彦 , 寺園　勝志 , 東川　康児 , 佐々木　亮 , 森原　貴征 , 青木　隆 , 伊藤　徹也 , 中林　幸久 , 磯部　祐 , 小熊　清典
IPC分类号： H01L25/07 , H01L23/36 , H01L23/473 , H01L25/18 , H05K1/02
CPC分类号： H01L23/473 , H01L25/112 , H01L2224/16225 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/3011 , H02M7/003 , H01L2924/00
摘要：　この配線基板は、電力変換用半導体素子（１１、３１１、３１２）に接続される電極部（２１ａ、２２ａ、１３９ｂ、１３９ｃ、１３９ｄ）と、配線部（２１ｂ、２２ｂ、１３１ｂ、１３２ｂ、１３９ａ）とを含む導体板（２１、２２、１２１、１２２、１３１、１３２、１４１、１４２、１５１、１５２、１６１、１６２、１７１、１７２、１８１、１８２、１９１、１９２、２０１、２０２、２１１、２１２、２２１、２２２、２３１、２３２）と、導体板の近傍に設置され、内部に冷却用の液体（３３）が供給される液冷管（３１、３２）と、少なくとも導体板と液冷管との間に配置された絶縁性の樹脂材（５１）とを備える。
摘要翻译：公开了一种布线板，其包括：导电板（21,22,21,122,131,132,141,142,151,152,161,162,171,172,181,182,191,172,181,182,191,192,201,202 ，211,212,221,222,231,232），包括连接到用于功率转换的半导体元件（11,311,312）的电极部分（21a，22a，139b，139c，139d）和布线部分（21b， 22b，131b，132b，139a）; 液体冷却管（31,32），其设置在导电板的区域中并被供应有用于内部冷却的液体（33）; 以及至少设置在导电板和液体冷却管之间的绝缘树脂材料（51）。

17. 发明申请

WO2010096213A3 INTEGRATED CIRCUIT MICRO-MODULE 审中-公开
标题翻译：集成电路微型模块
公开(公告)号：WO2010096213A3
公开(公告)日：2010-10-21
申请号：PCT/US2010020555
申请日：2010-01-08
申请人： NAT SEMICONDUCTOR CORP , SMEYS PETER , JOHNSON PETER , DEANE PETER , RAZOUK REDA R
发明人： SMEYS PETER , JOHNSON PETER , DEANE PETER , RAZOUK REDA R
IPC分类号： H01L23/48
CPC分类号： H01L21/4853 , H01L21/486 , H01L21/6835 , H01L23/367 , H01L23/427 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/50 , H01L23/552 , H01L23/642 , H01L23/645 , H01L24/24 , H01L24/82 , H01L24/97 , H01L25/0652 , H01L25/112 , H01L25/16 , H01L2221/68377 , H01L2223/6677 , H01L2224/04105 , H01L2224/24137 , H01L2224/24145 , H01L2224/24226 , H01L2224/24227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H01L2224/82 , H01L2924/00
摘要： In one aspect, an integrated circuit package composed of a plurality of immediately adjacent stacked layers of cured, planarizing, photo-imageable dielectric is described. At least one interconnect layer is provided between a pair of adjacent dielectric layers. An integrated circuit is positioned within one or more of the dielectric layers such that at least one of the dielectric layers extends over the active surface of the integrated circuit. The integrated circuit is electrically coupled with I/O pads on a surface of the package at least in part through the interconnect layer. In particular embodiments, the package can include thermal pipes, a heat sink, multiple integrated circuits, one or more dielectric layers, sensors, optical elements, passive devices and/or a substrate with embedded components. Various methods for forming the aforementioned packages are also described.
摘要翻译：在一个方面，描述了由固化的，平坦化的，可光成像的电介质的多个直接相邻堆叠层组成的集成电路封装。在一对相邻的介电层之间提供至少一个互连层。集成电路定位在一个或多个电介质层内，使得至少一个电介质层在集成电路的有源表面上延伸。集成电路至少部分地通过互连层与封装表面上的I / O焊盘电耦合。在特定实施例中，封装可以包括热导管，散热器，多个集成电路，一个或多个电介质层，传感器，光学元件，无源器件和/或具有嵌入组件的衬底。还描述了用于形成上述包装的各种方法。

18. 发明申请

WO2010096213A2 INTEGRATED CIRCUIT MICRO-MODULE 审中-公开
标题翻译：集成电路微型模块
公开(公告)号：WO2010096213A2
公开(公告)日：2010-08-26
申请号：PCT/US2010/020555
申请日：2010-01-08
申请人： NATIONAL SEMICONDUCTOR CORPORATION , SMEYS, Peter , JOHNSON, Peter , DEANE, Peter , RAZOUK, Reda R.
发明人： SMEYS, Peter , JOHNSON, Peter , DEANE, Peter , RAZOUK, Reda R.
IPC分类号： H01L23/48
CPC分类号： H01L21/4853 , H01L21/486 , H01L21/6835 , H01L23/367 , H01L23/427 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/50 , H01L23/552 , H01L23/642 , H01L23/645 , H01L24/24 , H01L24/82 , H01L24/97 , H01L25/0652 , H01L25/112 , H01L25/16 , H01L2221/68377 , H01L2223/6677 , H01L2224/04105 , H01L2224/24137 , H01L2224/24145 , H01L2224/24226 , H01L2224/24227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H01L2224/82 , H01L2924/00
摘要： In one aspect, an integrated circuit package composed of a plurality of immediately adjacent stacked layers of cured, planarizing, photo-imageable dielectric is described. At least one interconnect layer is provided between a pair of adjacent dielectric layers. An integrated circuit is positioned within one or more of the dielectric layers such that at least one of the dielectric layers extends over the active surface of the integrated circuit. The integrated circuit is electrically coupled with I/O pads on a surface of the package at least in part through the interconnect layer. In particular embodiments, the package can include thermal pipes, a heat sink, multiple integrated circuits, one or more dielectric layers, sensors, optical elements, passive devices and/or a substrate with embedded components. Various methods for forming the aforementioned packages are also described.
摘要翻译：在一个方面，描述了由固化的，平坦化的可光致成像电介质的多个紧邻的堆叠层组成的集成电路封装。在一对相邻的电介质层之间提供至少一个互连层。集成电路位于一个或多个介电层内，使得至少一个电介质层在集成电路的有源表面上延伸。集成电路至少部分地通过互连层与封装表面上的I / O焊盘电耦合。在特定实施例中，封装可以包括热管，散热器，多个集成电路，一个或多个电介质层，传感器，光学元件，无源器件和/或具有嵌入元件的衬底。还描述了用于形成上述包装的各种方法。

19. 发明申请

WO2010069399A1 A VOLTAGE SOURCE CONVERTER 审中-公开
标题翻译：电压源转换器
公开(公告)号：WO2010069399A1
公开(公告)日：2010-06-24
申请号：PCT/EP2008/068048
申请日：2008-12-19
申请人： ABB Technology AG , ASPLUND, Gunnar , JACOBSON, Björn , HEDBLAD, Per-Olof , HARNEFORS, Lennart
发明人： ASPLUND, Gunnar , JACOBSON, Björn , HEDBLAD, Per-Olof , HARNEFORS, Lennart
IPC分类号： H02M7/797 , H01L25/07
CPC分类号： H02M7/797 , H01L25/112 , H01L2924/0002 , H02J3/1857 , H02J3/36 , H02M1/088 , H02M2001/325 , H02M2007/4835 , Y02E40/26 , Y02E60/60 , H01L2924/00
摘要： A Voltage Source Converter having at least one phase leg connected to opposite poles of a direct voltage side of the converter and comprises a series connection of switching cells (7a) including at least one energy storing capacitor (20) and configured to obtain two switching states, namely a first switching state and a second switching state, in which the voltage across said at least one energy storing capacitor and a zero voltage, respectively, is applied across the terminals of the switching cell, has said switching cells arranged in stacks comprising at least two semiconductor assemblies. The converter comprises an arrangement configured to apply a pressure to opposite ends of each stack.
摘要翻译：一种电压源转换器，具有连接到转换器的直流电压侧的相反极点的至少一个相位支路，并且包括包括至少一个储能电容器（20）的开关单元（7a）的串联连接，并被配置为获得两个开关状态即第一开关状态和第二开关状态，其中跨越所述至少一个储能电容器和零电压的电压分别施加在开关单元的端子上，所述开关单元布置成堆叠，所述堆叠包括：至少两个半导体组件。转换器包括被配置为向每个堆叠的相对端施加压力的装置。

20. 发明申请

WO2005011099A3 SWITCHING DEVICE, GENERATOR-MOTOR APPARATUS USING SWITCHING DEVICE, DRIVE SYSTEM INCLUDING GENERATOR-MOTOR APPARATUS, AND COMPUTER-READABLE RECORDING MEDIUM ON WHICH A PROGRAM FOR DIRECTING COMPUTER TO PERFORM CONTROL OF GENERATOR-MOTOR APPARATUS IS RECORDED 审中-公开
标题翻译：切换装置，使用切换装置的发电机 - 电动机装置，包括发电机 - 电动机装置的驱动系统和用于指导计算机执行发电机 - 电动机装置的控制的程序的计算机可读记录介质被记录
公开(公告)号：WO2005011099A3
公开(公告)日：2005-08-25
申请号：PCT/IB2004002211
申请日：2004-07-05
申请人： TOYOTA MOTOR CO LTD , YAGI KATSUNORI
发明人： YAGI KATSUNORI
IPC分类号： H02M7/537 , H01L23/04 , H01L23/043 , H01L23/047 , H01L23/051 , H01L23/10 , H01L23/495 , H01L25/11 , H02K11/04 , H02K19/36 , H02M7/00 , H02P7/00 , H02P9/04 , H02P9/30
CPC分类号： H02M7/003 , B60L11/14 , B60L2210/40 , H01L25/112 , H01L2924/0002 , H02K1/146 , H02K1/243 , H02K5/141 , H02K7/108 , H02K11/05 , H02K11/215 , Y02T10/641 , Y02T10/70 , Y02T10/7077 , Y02T10/7241 , H01L2924/00
摘要： A generator-motor apparatus (100) includes a control circuit (20), an alternator (50), electrode plates (83, 84), and switching devices (SW1 to SW6). The electrodes plates (83, 5 84) have a' substantial horseshoe shape, and are provided on an end surface of the alternator (50) so as to surround a rotating shaft (50A) of the alternator (50). Each of the switching devices (SW1 to SW6) is formed by sandwiching a MOS transistor between two electrodes, and has a can structure for sealing the internal space of the switching device using a resin. The switching devices (SW1, SW3, SW5) are directly attached to the electrode plate (83) by means of soldering, and the switching devices (SW2, SW4, SW6) are directly attached to the electrode plate (84) by means of soldering. The control circuit (2% controls the switching devices (SW1 to SW6). The switching devices (SW1 to SW6) drive the alternator (50) as an electric motor or an electric power generator.
摘要翻译：发电机 - 电动机装置（100）包括控制电路（20），交流发电机（50），电极板（83,84）和开关装置（SW1〜SW6）。电极板（83,584）具有“实质的马蹄形状”，并且设置在交流发电机（50）的端面上，以便围绕交流发电机（50）的旋转轴（50A）。开关装置（SW1〜SW6）中的每一个通过在两个电极之间夹入MOS晶体管而形成，并且具有用树脂密封开关装置的内部空间的罐结构。开关装置（SW1，SW3，SW5）通过焊接直接安装在电极板（83）上，开关装置（SW2，SW4，SW6）通过焊接直接安装在电极板（84）。控制电路（2％控制开关装置（SW1〜SW6），开关装置（SW1〜SW6）驱动交流发电机50作为电动机或发电机。

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