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1. 发明申请

WO1990008400A1 ENHANCED AIR FIN COOLING ARRANGEMENT FOR A HERMETICALLY SEALED MODULAR ELECTRONIC COLD PLATE UTILIZING REFLUX COOLING 审中-公开
标题翻译：强化空气冷却装置，用于密封模块化电子冷板使用REFRUX冷却
公开(公告)号：WO1990008400A1
公开(公告)日：1990-07-26
申请号：PCT/US1989005636
申请日：1989-12-08
申请人： SUNDSTRAND CORPORATION
发明人： SUNDSTRAND CORPORATION , CROWE, Lawrence, E.
IPC分类号： H01L23/427
CPC分类号： F28F3/025 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A modular reflux cooling plate (10) having a condenser region (11) above the boiling channels (12) or above and below (11, 24) the region (11), boiling channels (12) and downcomers (16) which effect reflux cooling of electrical power modules used in aircraft and the like. Air flow fins (18) are arranged adjacent the condenser (11) or condensers (11, 24) and the boiling channels (12) to effect cooling of a coolant vapor which has entered the condenser (11) after being boiled from a liquid state in the boiling channels (12) as a result of the heat generated by one or more power modules affixed to an end plate (14) by any suitable means and to provide a parallel heat transfer path which shares the heat transfer task with the reflux cooling during normal system operation and which provides emergency heat transfer when reflux cooling is not available.

2. 发明申请

WO1990001800A1 HERMETICALLY SEALED COMPRESSION BONDED CIRCUIT ASSEMBLY 审中-公开
标题翻译：密封式密封电路组装
公开(公告)号：WO1990001800A1
公开(公告)日：1990-02-22
申请号：PCT/US1989003168
申请日：1989-07-21
申请人： SUNDSTRAND CORPORATION
发明人： SUNDSTRAND CORPORATION , CROWE, Lawrence, E. , SUTRINA, Thomas, A.
IPC分类号： H01L23/32
CPC分类号： H01L25/112 , H01L2924/0002 , Y10S257/909 , H01L2924/00
摘要： A method of manufacturing hermetically sealed circuit assemblies (10) having circuit elements (74, 76, 78 and 80) to be compression bonded, a hermetically sealed circuit assembly having circuit elements to be compresssion bonded and a stack containing at least one hermetically sealed circuit assembly having circuit elements which are compression bonded is disclosed. Uniform thickness of individual hermetically sealed circuit assemblies measured across columns (22-30) is insured by positioning deformable spacers (124-132) in the columns containing the circuit elements to be compression bonded, and deforming the deformable spacers. Thereafter a compressive force is applied to a stack of one or more circuits through the columns which contain the circuit elements to be compression bonded. The individual hermetically sealed circuit assemblies have circular corrugations (32-40) in a flat surface (14) and circular corrugations (114-122) in a lid (20) which are disposed within the columns containing the individual circuit elements to be compression bonded.

3. 发明申请

WO1994019849A1 ELECTRIC POWER DISTRIBUTION MODULE FOR AN ELECTRIC POWER GENERATION AND DISTRIBUTION SYSTEM 审中-公开
标题翻译：用于发电和配电系统的电力分配模块
公开(公告)号：WO1994019849A1
公开(公告)日：1994-09-01
申请号：PCT/US1994001794
申请日：1994-02-17
申请人： SUNDSTRAND CORPORATION
发明人： SUNDSTRAND CORPORATION , SUTRINA, Thomas , CROWE, Lawrence, E. , SMITH, Edward, W. , PETERSON, Ronald, F. , HOPPE, Richard, J.
IPC分类号： H02B01/04
CPC分类号： H02B1/056 , H02B1/04 , H02B1/20 , Y10T307/461
摘要： This invention relates to an electric power generation and distribution system, and more particularly to an electric power distribution module for use in such systems, having an insulative support structure (22') which includes integral therewith electrically conductive buses (72a, b, c) and straps (74) which define a circuit for distributing electric power received from one or more power sources (200, 202 or 204) to one or more loads, the insulative support structure (22') also including integral therewith current sensors (88) for sensing a flow of electrical current in the electrically conductive buses (72a, b, c) and straps (74).
摘要翻译：本发明涉及一种发电和配电系统，更具体地说，涉及一种用于这种系统的配电模块，具有一个绝缘支撑结构（22'），该绝缘支撑结构包括与导电总线（72a，b，c）以及限定用于将从一个或多个电源（200,202或204）接收的电力分配给一个或多个负载的电路的带（74），所述绝缘支撑结构（22'）还包括与其一体的电流传感器（88）用于感测导电总线（72a，b，c）和带（74）中的电流。

4. 发明申请

WO1990005380A1 HERMETICALLY SEALED MODULAR ELECTRONIC COLD PLATE UTILIZING REFLUX COOLING 审中-公开
标题翻译：密封模块化电子冷板利用REFLUX冷却
公开(公告)号：WO1990005380A1
公开(公告)日：1990-05-17
申请号：PCT/US1989004313
申请日：1989-09-29
申请人： SUNDSTRAND CORPORATION
发明人： SUNDSTRAND CORPORATION , CROWE, Lawrence, E.
IPC分类号： H01L23/46
CPC分类号： H01L23/427 , F28D15/0233 , F28F3/027 , H01L2924/0002 , H01L2924/00
摘要： A modular reflux cooling plate (10) having a condensing region (11), boiling channels (12) and downcomers (16) which effect reflux cooling of electrical power modules used in aircraft and the like. The condenser (11) and boiling channels (12) can be constituted by longitudinally disposed lanced offset fins (11, 12). Air flow fins (18) are arranged adjacent the condenser (11) to effect cooling of a coolant vapor which has entered the condenser (11) after being boiled from a liquid state in the boiling channels (12) as a result of the heat generated by one or more power modules affixed to an end plate (14) by any suitable means. Temporary thermal storage can be provided in the form of either a thickened end plate (14) or a chamber having lanced offset fins (25) and a normally solid or semi-solid material such as wax or solder.

5. 发明申请

WO1990001799A1 HERMETICALLY SEALED COMPRESSION BONDED CIRCUIT ASSEMBLY 审中-公开
标题翻译：密封式密封电路组装
公开(公告)号：WO1990001799A1
公开(公告)日：1990-02-22
申请号：PCT/US1989003167
申请日：1989-07-21
申请人： SUNDSTRAND CORPORATION
发明人： SUNDSTRAND CORPORATION , CROWE, Lawrence, E. , SUTRINA, Thomas, A.
IPC分类号： H01L23/32
CPC分类号： H01L25/112 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing hermetically sealed circuit assemblies (10) having circuit elements (74, 76, 78 and 80) to be compression bonded, a hermetically sealed circuit assembly having circuit elements to be compression bonded and a stack containing at least one hermetically sealed circuit assembly having circuit elements which are compression bonded is disclosed. Uniform thickness of individual hermetically sealed circuit assemblies measured across columns (22-30) is insured by positioning deformable spacers (124-132) in the columns containing the circuit elements to be compression bonded, and deforming the deformable spacers. Therafter a compressive force is applied to a stack of one or more circuits through the columns which contain the circuit elements to be compression bonded. The individual hermetically sealed circuit assemblies have circular corrugations (32-40) in a flat surface (14) and circular corrugations (114-122) in a lid (20) which are disposed within the columns containing the individually circuit elements to be compression bonded.
摘要翻译：一种制造具有被压接的电路元件（74,76,78和80）的气密密封电路组件（10）的方法，具有要被压接的电路元件的气密密封电路组件和包含至少一个气密密封电路公开了具有被压接的电路元件的组件。通过在包含要压缩的电路元件的列中定位可变形间隔物（124-132）并使可变形间隔物变形来确保跨柱（22-30）测量的各个气密密封电路组件的均匀厚度。压缩力通过包含待压接的电路元件的列施加到一个或多个电路的堆叠。单独的密封电路组件在平坦表面（14）中具有圆形波纹（32-40）和盖（20）中的圆形波纹（114-122），其设置在包含要压缩粘合的单独电路元件的列内。

6. 发明申请

WO1992022957A1 RECTIFIER AND INVERTER MODULE 审中-公开
标题翻译：整流器和逆变器模块
公开(公告)号：WO1992022957A1
公开(公告)日：1992-12-23
申请号：PCT/US1992005007
申请日：1992-06-11
申请人： SUNDSTRAND CORPORATION
发明人： SUNDSTRAND CORPORATION , CROWE, Lawrence, E. , METZLER, Mark, W.
IPC分类号： H02M05/458
CPC分类号： H02M7/5387 , H02M5/458 , H02M7/003
摘要： The inverter module according to the present invention includes a component support for supporting components attached thereto, an AC/DC converter (40) attached to the support for converting input AC into DC, inverter switches (41) attached to the support for inverting the DC into single-phase output AC, a switch controller (55) attached to the support for controlling the inverter switches (41), and connectors for interconnecting the AC/DC converter (40), the inverter switches (41), and the switch controller (55) so that input AC is converted to a single phase (45) of output AC.

7. 发明申请

WO1991009450A1 POWER CONVERTER CIRCUIT BOARD 审中-公开
标题翻译：电源转换器电路板
公开(公告)号：WO1991009450A1
公开(公告)日：1991-06-27
申请号：PCT/US1990006564
申请日：1990-11-08
申请人： SUNDSTRAND CORPORATION
发明人： SUNDSTRAND CORPORATION , HUSS, John , HOPPE, Richard, J. , CROWE, Lawrence, E. , SUTRINA, Thomas , LAKIN, Eric, D.
IPC分类号： H02M01/00
CPC分类号： H05K1/0265 , H05K1/0203 , H05K1/16 , H05K1/167 , H05K3/0061 , H05K2201/10166 , H05K2201/10174
摘要： Prior power converters have utilized discrete components mounted on circuit boards of different design. Failure of one or more of the components requires the components to be separately tested to determine which is faulty. The faulty component or the board containing same must then be replaced. This results in significant down time for the inverter and can require stocking of a large number of specialized boards. In order to overcome these problems, an inverter (22) is assembled using a series of circuit boards (80, 82, 84) of standardized type. Each circuit board includes separate layers (101, 102-136, RS1+, 280, 290, 292) which interconnect components mounted thereon together with a heat exchanger (102) which cools high power components. When a malfunction of a component occurs, the entire board may be replaced so that inverter down time is minimized. Also, the use of standardized boards reduces stocking requirements and inventory costs.

8. 发明申请

WO1990004914A1 PLATE FIN/CHIC HEAT EXCHANGER 审中-公开
标题翻译： PLATE FIN / CHIC热交换器
公开(公告)号：WO1990004914A1
公开(公告)日：1990-05-03
申请号：PCT/US1989004280
申请日：1989-09-29
申请人： SUNDSTRAND CORPORATION
发明人： SUNDSTRAND CORPORATION , CROWE, Lawrence, E.
IPC分类号： H05K07/20
CPC分类号： H01L23/473 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： Electrical devices (10, 11, 12) which generate different amounts of heat are selectively cooled with a heat exchanger (1) having a first portion formed of a fin-type heat exchanger (4) and a second portion formed of a compact high intensity cooler (2, 3) wherein a jet impingement cooling mechanism is employed. Cooling fluid is circulated through the respective cooling mechanisms which can be arranged in series or parallel for differentially cooling respective electrical devices placed in contact with respective portions of an outer surface of the heat exchanger.

9. 发明申请

WO1991009460A1 LOW INDUCTANCE CONVERTER PHASE ASSEMBLY 审中-公开
标题翻译：低电感转换器相组件
公开(公告)号：WO1991009460A1
公开(公告)日：1991-06-27
申请号：PCT/US1990006560
申请日：1990-11-08
申请人： SUNDSTRAND CORPORATION
发明人： SUNDSTRAND CORPORATION , SUTRINA, Thomas , CROWE, Lawrence, E. , METZLER, Mark, W.
IPC分类号： H02M07/5387
CPC分类号： H02M7/003
摘要： Previous electronic circuit assemblies have exhibited unnecessarily high parasitic inductance. In order to overcome this problem, an apparatus in accordance with this invention is provided with a transistor (24) having power terminals, and first and second diodes (28, 29). The apparatus comprises a first bus (20a) connected to the first diode (28) and one of the power terminals, and a second bus (16a) connected to the second diode (29), the first and second buses (20a, 16a) comprising parallel plates having substantially the same configuration.
摘要翻译：以前的电子电路组件已经表现出不必要的高寄生电感。为了克服这个问题，根据本发明的装置设置有具有电源端子的晶体管（24）和第一和第二二极管（28,29）。该装置包括连接到第一二极管（28）和一个电源端子的第一总线（20a）和连接到第二二极管（29）的第二总线（16a），第一和第二总线（20a，16a）包括具有基本相同构造的平行板。

10. 发明申请

WO1991001565A1 HIGH CURRENT FEED-THROUGH CAPACITOR 审中-公开
标题翻译：高电流馈电电容
公开(公告)号：WO1991001565A1
公开(公告)日：1991-02-07
申请号：PCT/US1990003292
申请日：1990-06-08
申请人： SUNDSTRAND CORPORATION
发明人： SUNDSTRAND CORPORATION , CARLSON, William, E. , METZLER, Mark, W. , CROWE, Lawrence, E.
IPC分类号： H01G04/42
CPC分类号： H01G4/35 , H03H1/0007
摘要： A feed-through capacitor for variable speed constant frequency aircraft power systems to provide filtering for unwanted higher harmonics and electromagnetic interference which includes a hollow conductive housing (30), a conductive feed-through stud (20) within the housing, an annular capacitive element (50) and an electrical coupling, comprising a first conductor (40) composed between an outer surface of the stud and an inner surface of the capacitive element and a second conductor (60) disposed radially between an outer surface of the capacitive element and an inner surface of the housing. The first and second conductors bear resiliently against electrode coatings (51, 52) on the capacitive element to suspend the capacitive element between the feed-through stud and the housing, thereby allowing the housing, the capacitive element, and the stud to shift relative to one another as a temperature of the feed-through capacitor changes, whereby mechanical stress is dissipated.

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