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    • 17. 发明申请
    • ADHESION PROMOTER
    • 粘合促进剂
    • WO2006121517A1
    • 2006-11-16
    • PCT/US2006/011521
    • 2006-03-29
    • VALSPAR SOURCING, INC.BAHLS, Harry, J.
    • BAHLS, Harry, J.
    • C03C17/38C03C17/40
    • C03C17/38C03C17/3663C03C17/40G02B5/0808
    • The present invention refers to a method of making an copper-free article having a metal coating deposited on a substrate comprising: providing a substrate; contacting a surface of said substrate with a solution comprising: at least one metal ion selected from the group consisting of Ce, Pr, Nd, Eu, Er, Ga, W, Al, Mn, Mo, Sb, Te, La, Sm or their mixtures; and applying a metal coating on said surface of said substrate. In another embodiment the present invention refers to a method of making a metal coated article: providing a substrate; contacting a surface of said substrate with a solution comprising a mixture of more than one metal ion selected from the same group as listed above; or contacting said surface of said substrate with more than one solution comprising in each solution at least one metal ion selected from the same group; and applying a metal coating on said surface of said substrate. Moreover, the present invention refers to a method of making a metal coated article comprising: providing a substrate; contacting a surface of said substrate with a solution comprising a Bi metal ion, and applying a metal coating on said activated surface of said substrate. Furthermore an article obtainable by any of said methods, is claimed.
    • 本发明涉及一种制备无铜制品的方法,该制品具有沉积在基材上的金属涂层,该方法包括:提供基材; 使所述衬底的表面与包含以下的溶液接触:包含选自Ce,Pr,Nd,Eu,Er,Ga,W,Al,Mn,Mo,Sb,Te,La,Sm中的至少一种金属离子或 他们的混合物 以及在所述基底的所述表面上施加金属涂层。 在另一个实施方案中,本发明涉及一种制备金属涂层制品的方法:提供基材; 使所述衬底的表面与包含选自上述相同组的多于一种金属离子的混合物的溶液接触; 或使所述衬底的所述表面与多于一种溶液接触,所述溶液在每种溶液中包含至少一种选自相同组的金属离子; 以及在所述基底的所述表面上施加金属涂层。 此外,本发明涉及一种制造金属涂层制品的方法,包括:提供基底; 使所述衬底的表面与包含Bi金属离子的溶液接触,并在所述衬底的所述活化表面上施加金属涂层。 此外,要求保护通过任何所述方法可获得的制品。