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11. 发明申请

WO2007024807A9 APPARATUS AND METHODS FOR SPECTRUM BASED MONITORING OF CHEMICAL MECHANICAL POLISHING 审中-公开
公开(公告)号：WO2007024807A9
公开(公告)日：2007-03-01
申请号：PCT/US2006/032659
申请日：2006-08-21
申请人： APPLIED MATERIALS, INC. , BENVEGNU, Dominic, J. , DAVID, Jeffrey, Drue , SWEDEK, Bogdan , LEE, Harry, Q. , KARUPPIAH, Lakshmanan
发明人： BENVEGNU, Dominic, J. , DAVID, Jeffrey, Drue , SWEDEK, Bogdan , LEE, Harry, Q. , KARUPPIAH, Lakshmanan
IPC分类号： B24B37/04 , B24B49/12
摘要： Apparatus and methods for spectrum based monitoring of chemical mechanical polishing, including spectrum based endpointing, spectrum based polishing rate adjustment, flushing a top surface of an optical head (53), or a pad (30) with a window. The spectrum-based endpointing uses a reference spectrum which is empirically selected for particular spectrum based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum based endpoint logic. The polishing endpoint can be determined using a difference trace or a sequence of index values. The flushing system creates a laminar gas flow across the top surface of the optical head (53). The vacuum nozzle (308) and vacuum sources (312) are configured so that the flow of gas is laminar. The window includes a soft plastic portion and a crystalline or glass like portion. The spectrum based polishing rate adjustment includes obtaining spectra for different zones on a substrate.

12. 发明申请

WO2013112196A1 CLEANING MODULE AND PROCESS FOR PARTICLE REDUCTION 审中-公开
标题翻译：清洁模块和减少颗粒过程
公开(公告)号：WO2013112196A1
公开(公告)日：2013-08-01
申请号：PCT/US2012/048199
申请日：2012-07-25
申请人： APPLIED MATERIALS, INC. , KO, Sen-Hou , KARUPPIAH, Lakshmanan
发明人： KO, Sen-Hou , KARUPPIAH, Lakshmanan
IPC分类号： H01L21/304
CPC分类号： B08B1/006 , B08B1/04 , H01L21/67046 , H01L21/67051
摘要： A method and apparatus for cleaning a substrate are provided. In one embodiment, a particle cleaning module is provided that includes a substrate holder and a pad holder disposed in a housing, and an actuator operable to move the pad holder relative to the substrate holder. The substrate holder is configured to retain and rotate a substrate in a substantially vertical orientation. The pad holder has a pad retaining surface that faces the substrate holder in a parallel and spaced apart relation. The pad holder is rotatable on an axis parallel to an axis on which the substrate holder rotates. The actuator is operable to move the pad holder relative to the substrate holder as to change a distance defined between the first axis and the second axis.
摘要翻译：提供了一种用于清洁基板的方法和装置。在一个实施例中，提供了一种颗粒清洁模块，其包括衬底保持器和设置在壳体中的衬垫保持器，以及可操作以相对于衬底保持器移动衬垫保持器的致动器。衬底保持器被构造成以基本垂直的方向保持和旋转衬底。焊盘保持器具有以平行和间隔的关系面对衬底保持器的焊盘保持表面。衬垫支架可以在平行于衬底支架旋转的轴线的轴线上旋转。致动器可操作以相对于基板保持器移动焊盘保持器，以改变限定在第一轴线和第二轴线之间的距离。

13. 发明申请

WO2011152966A2 CHEMICAL PLANARIZATION OF COPPER WAFER POLISHING 审中-公开
标题翻译：铜波抛光的化学平面化
公开(公告)号：WO2011152966A2
公开(公告)日：2011-12-08
申请号：PCT/US2011/036019
申请日：2011-05-11
申请人： APPLIED MATERIALS, INC. , WANG, You , TU, Wen-Chiang , LIU, Feng Q. , WANG, Yuchun , KARUPPIAH, Lakshmanan , MC CLINTOCK, William H. , CHIN, Barry L.
发明人： WANG, You , TU, Wen-Chiang , LIU, Feng Q. , WANG, Yuchun , KARUPPIAH, Lakshmanan , MC CLINTOCK, William H. , CHIN, Barry L.
IPC分类号： H01L21/304
CPC分类号： H01L21/3212 , B24B37/044 , C09G1/04 , H01L21/7684
摘要： Embodiments described herein relate to removing material from a substrate. More particularly, the embodiments described herein relate to polishing or planarzing a substrate by a chemical mechanical polishing process. In one embodiment, a method of chemical mechanical polishing (CMP) of a substrate is provided. The method comprises exposing a substrate having a conductive material layer formed thereon to a polishing solution comprising phosphoric acid, one or more chelating agents, one or more corrosion inhibitors, and one or more oxidizers, forming a passivation layer on the conductive material layer, providing relative motion between the substrate and a polishing pad and removing at least a portion of the passivation layer to expose a portion of the underlying conductive material layer, and removing a portion of the exposed conductive material layer.
摘要翻译：本文所述的实施例涉及从衬底去除材料。更具体地，本文所述的实施例涉及通过化学机械抛光工艺抛光或平面化衬底。在一个实施例中，提供了基板的化学机械抛光（CMP）的方法。该方法包括将其上形成有导电材料层的基板暴露于包含磷酸，一种或多种螯合剂，一种或多种腐蚀抑制剂和一种或多种氧化剂的抛光溶液，在导电材料层上形成钝化层，提供衬底和抛光垫之间的相对运动，并移除钝化层的至少一部分以暴露下面的导电材料层的一部分，以及去除暴露的导电材料层的一部分。

14. 发明申请

WO2007027486A2 METHOD FOR CONDITIONING A POLISHING PAD 审中-公开
标题翻译：用于调节抛光垫的方法
公开(公告)号：WO2007027486A2
公开(公告)日：2007-03-08
申请号：PCT/US2006/032927
申请日：2006-08-23
申请人： APPLIED MATERIALS, INC. , JIA, Renhe , DIAO, Jie , WANG, You , TSAI, Stan D. , ATKINSON, Jim K. , KARUPPIAH, Lakshmanan , CHEN, Liang-Yuh
发明人： JIA, Renhe , DIAO, Jie , WANG, You , TSAI, Stan D. , ATKINSON, Jim K. , KARUPPIAH, Lakshmanan , CHEN, Liang-Yuh
IPC分类号： B24B1/00
CPC分类号： B24B37/042 , B24B53/017
摘要： A method of conditioning processing pads increases the removal rate of conductive material from a substrate surface during polishing. In this method, the direction of rotation of the processing pad relative to the conditioning disc during conditioning is opposite the direction of rotation of the processing pad relative to the substrate during polishing.
摘要翻译：调整处理垫的方法在抛光期间增加导电材料从衬底表面的去除速率。在这种方法中，处理衬垫相对于调理盘在调节期间的旋转方向与抛光期间相对于衬底相对于处理垫的旋转方向。

15. 发明申请

WO2004090948A1 METHODS AND APPARATUS FOR VERTICAL TRANSFER OF SEMICONDUCTOR SUBSTRATES BETWEEN CLEANING MODULES 审中-公开
标题翻译：清洁模块之间半导体基板垂直传输的方法和装置
公开(公告)号：WO2004090948A1
公开(公告)日：2004-10-21
申请号：PCT/US2004/009937
申请日：2004-03-31
申请人： APPLIED MATERIALS INC. , ACHKIRE, Younes , MAROHL, Dan , KARUPPIAH, Lakshmanan
发明人： ACHKIRE, Younes , MAROHL, Dan , KARUPPIAH, Lakshmanan
IPC分类号： H01L21/00
CPC分类号： H01L21/68707 , H01L21/6704 , H01L21/67155 , H01L21/67742
摘要： A substrate handler is provided comprising a carriage positionable along a first axis of motion, a first substrate gripper coupled to the carriage and positionable relative to the carriage along a second axis of motion oriented substantially perpendicular to the first axis of motion, and a second substrate gripper coupled to the carriage and positionable relative to the second axis of motion, wherein the second gripper is independently movable relative to the first gripper.
摘要翻译：提供了一种基板处理器，其包括可沿着第一运动轴定位的托架，第一基板夹持器，其联接到托架并且沿着基本上垂直于第一运动轴线定向的第二运动轴线相对于托架定位;以及第二基板夹持器联接到滑架并相对于第二运动轴线定位，其中第二夹持器可独立地相对于第一夹持器移动。

16. 发明申请

WO2013070289A1 BRUSH BOX MODULE FOR CHEMICAL MECHANICAL POLISHING CLEANER 审中-公开
标题翻译：用于化学机械抛光清洁剂的刷盒
公开(公告)号：WO2013070289A1
公开(公告)日：2013-05-16
申请号：PCT/US2012/048193
申请日：2012-07-25
申请人： APPLIED MATERIALS, INC. , CHEN, Hui , D'AMBRA, Allen L. , KARUPPIAH, Lakshmanan , OSTERHELD, Thomas H.
发明人： CHEN, Hui , D'AMBRA, Allen L. , KARUPPIAH, Lakshmanan , OSTERHELD, Thomas H.
IPC分类号： H01L21/302 , H01L21/304
CPC分类号： H01L21/67046
摘要： Embodiments of the invention generally relate to a method and apparatus for cleaning a substrate. Particularly, embodiments of the invention relate to an apparatus and method for cleaning a substrate using a scrub brush. One embodiment provides a brush box assembly for cleaning a substrate. The assembly comprises a chamber body having a cleaning chamber disposed therein, a rotatable chuck disposed in the cleaning chamber, and an edge cleaner module positioned adjacent the chuck.
摘要翻译：本发明的实施例一般涉及用于清洁基底的方法和装置。特别地，本发明的实施例涉及一种使用擦洗刷清洁衬底的装置和方法。一个实施例提供了一种用于清洁基底的刷盒组件。该组件包括一个室主体，其具有设置在其中的清洁室，设置在清洁室中的可旋转卡盘以及邻近卡盘定位的边缘清洁器模块。

17. 发明申请

WO2011094706A3 FEEDBACK CONTROL OF POLISHING USING OPTICAL DETECTION OF CLEARANCE 审中-公开
标题翻译：使用光学检测器清除反射的抛光控制
公开(公告)号：WO2011094706A3
公开(公告)日：2011-08-04
申请号：PCT/US2011/023215
申请日：2011-01-31
申请人： APPLIED MATERIALS, INC. , XU, Kun , CARLSSON, Ingemar , LIU, Feng , GAGE, David Maxwell , WANG, You , BENVEGNU, Dominic J. , SWEDEK, Boguslaw A. , WANG, Yuchun , FONTARENSKY, Pierre , TU, Wen-Chiang , KARUPPIAH, Lakshmanan
发明人： XU, Kun , CARLSSON, Ingemar , LIU, Feng , GAGE, David Maxwell , WANG, You , BENVEGNU, Dominic J. , SWEDEK, Boguslaw A. , WANG, Yuchun , FONTARENSKY, Pierre , TU, Wen-Chiang , KARUPPIAH, Lakshmanan
IPC分类号： H01L21/304 , H01L21/66
摘要： A method of controlling polishing includes polishing a first substrate having an overlying layer on an underlying layer or layer structure. During polishing, the substrate is monitored with an in-situ monitoring system to generate a sequence of measurements. The measurements are sorted into groups, each group associated with a different zone of a plurality of zones on the substrate. For each zone, a time at which the overlying layer is cleared is determined based on the measurements from the associated group. At least one second adjusted polishing pressure for at least zone is calculated based on a pressure applied in the at least one zone during polishing the substrate, the time for the at least one zone, and the time for another zone. A second substrate is polished using the at least one adjusted polishing pressure.
摘要翻译：控制抛光的方法包括抛光在下层或层结构上具有覆盖层的第一基板。在抛光过程中，基板采用现场监控系统进行监控，以生成一系列测量结果。测量值被分类成组，每组与基底上多个区域的不同区域相关联。对于每个区域，基于来自关联组的测量来确定覆盖层被清除的时间。基于在抛光衬底期间施加在至少一个区域中的压力，至少一个区域的时间和另一个区域的时间，计算至少一个区域的至少一个第二调整后的抛光压力。使用至少一个调整后的抛光压力抛光第二衬底。

18. 发明申请

WO2010053924A2 IN-LINE WAFER THICKNESS SENSING 审中-公开
标题翻译：在线式湿度传感
公开(公告)号：WO2010053924A2
公开(公告)日：2010-05-14
申请号：PCT/US2009/063161
申请日：2009-11-03
申请人： APPLIED MATERIALS, INC. , SIN, Garrett H. , JAIN, Sanjeev , SWEDEK, Boguslaw A. , KARUPPIAH, Lakshmanan
发明人： SIN, Garrett H. , JAIN, Sanjeev , SWEDEK, Boguslaw A. , KARUPPIAH, Lakshmanan
IPC分类号： H01L21/66 , H01L21/304
CPC分类号： B24B37/013 , B24B49/02 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method of forming bare silicon substrates is described. A bare silicon substrate is measured, wherein measuring is performed by a non-contact capacitance measurement device to obtain a signal at a point on the substrate. The signal or a thickness indicated by the signal is communicated to a controller. An adjusted polishing parameter according to the signal or thickness indicated by the signal is determined. After determining an adjusted polishing parameter, the bare silicon substrate is polished on a polisher using the adjusted polishing parameter.
摘要翻译：描述形成裸硅衬底的方法。测量裸硅衬底，其中通过非接触电容测量装置进行测量以获得衬底上的点处的信号。由信号指示的信号或厚度被传送到控制器。确定根据由信号指示的信号或厚度的调整的抛光参数。在确定调整的抛光参数之后，使用调整的抛光参数在抛光机上抛光裸硅衬底。

19. 发明申请

WO2008076601A1 DETERMINING PHYSICAL PROPERTY OF SUBSTRATE 审中-公开
标题翻译：确定基材的物理性质
公开(公告)号：WO2008076601A1
公开(公告)日：2008-06-26
申请号：PCT/US2007/085810
申请日：2007-11-28
申请人： APPLIED MATERIALS, INC. , RAVID, Abraham , SWEDEK, Boguslaw A. , DAVID, Jeffrey Drue , QIAN, Jun , CARLSSON, Ingemar , BENVEGNU, Dominic J. , LEE, Harry Q. , KARUPPIAH, Lakshmanan
发明人： RAVID, Abraham , SWEDEK, Boguslaw A. , DAVID, Jeffrey Drue , QIAN, Jun , CARLSSON, Ingemar , BENVEGNU, Dominic J. , LEE, Harry Q. , KARUPPIAH, Lakshmanan
IPC分类号： G01B11/06
CPC分类号： G01B11/0683 , G01B11/0625 , Y10S707/99936
摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
摘要翻译：确定衬底的物理性质的方法包括记录从衬底获得的第一光谱，第一光谱是在改变衬底的物理性能的抛光工艺期间获得的。该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。数据库中的每个光谱具有与之相关联的物理属性值。该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中识别的先前记录的频谱相关联的物理属性值来确定。用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

20. 发明申请

WO2013074707A1 SYSTEMS AND METHODS FOR SUBSTRATE POLISHING DETECTION USING IMPROVED FRICTION MEASUREMENT 审中-公开
标题翻译：使用改进的摩擦测量进行基板抛光检测的系统和方法
公开(公告)号：WO2013074707A1
公开(公告)日：2013-05-23
申请号：PCT/US2012/065128
申请日：2012-11-14
申请人： APPLIED MATERIALS, INC
发明人： CHANG, Shou-Sung , CHEN, Hung Chih , KARUPPIAH, Lakshmanan , BUTTERFIELD, Paul D. , ROHDUM, Erik S.
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： B24B37/013 , B24B49/16
摘要： Methods, apparatus, and systems for polishing a substrate are disclosed. The apparatus includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the apparatus includes a first carriage; a side force or displacement measurement instrument coupled to the first carriage; and a second carriage coupled to the side force or displacement measurement instrument, and wherein one of the first and second carriages is adapted to support a polishing head. Numerous additional aspects are disclosed.
摘要翻译：公开了抛光衬底的方法，装置和系统。该装置包括上压板; 耦合到上压板的扭矩/应变测量仪器; 以及联接到扭矩/应变测量仪器的下压板，并且适于驱动上压板旋转通过扭矩/应变测量仪器。在其他实施例中，该装置包括第一托架; 耦合到第一托架的侧向力或位移测量仪器; 以及耦合到所述侧向力或位移测量仪器的第二托架，并且其中所述第一和第二托架中的一个适于支撑抛光头。公开了许多附加方面。

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