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1. 发明申请

US20150136593A1 PRODUCTION METHOD OF ELECTROCONDUCTIVE MAYENITE COMPOUND HAVING HIGH ELECTRON DENSITY, AND TARGET 有权
标题翻译：具有高电子密度的电极性MAYENITE化合物的生产方法和目标
公开(公告)号：US20150136593A1
公开(公告)日：2015-05-21
申请号：US14567478
申请日：2014-12-11
申请人： ASAHI GLASS COMPANY, LIMITED
发明人： Kazuhiro ITO , Satoru WATANABE , Toshinari WATANABE , Naomichi MIYAKAWA
IPC分类号： H01J37/34
CPC分类号： H01J37/3426 , C01F7/164 , C01P2006/40 , C01P2006/80 , C04B35/44 , C04B35/6261 , C04B35/6455 , C04B37/021 , C04B2235/3208 , C04B2235/3217 , C04B2235/442 , C04B2235/444 , C04B2235/445 , C04B2235/5436 , C04B2235/6562 , C04B2235/6565 , C04B2235/6567 , C04B2235/6581 , C04B2235/6587 , C04B2235/664 , C04B2235/77 , C04B2237/343 , C04B2237/402 , C04B2237/50 , C23C14/3414 , H01B1/08
摘要： A production method of an electroconductive mayenite compound having an electron density greater than or equal to 5×1020 cm−3 includes preparing an object of processing containing a mayenite compound or a precursor of a mayenite compound, placing aluminum foil on at least part of a surface of the object of processing, and retaining the object of processing at temperatures falling within the range of 1080° C. to 1450° C. in a low oxygen partial pressure atmosphere.
摘要翻译：具有大于或等于5×1020cm -3的电子密度的导电钙铝石化合物的制造方法包括制备包含钙铝石化合物或钙铝石化合物的前体的加工对象，将铝箔放置在至少一部分处理对象的表面，并且在低氧分压气氛中将处理对象保持在1080℃至1450℃的范围内的温度。

2. 发明申请

US20150000201A1 METHOD FOR ATTACHING A PRE-SINTERED BODY OF POLYCRYSTALLINE DIAMOND MATERIAL TO A SUBSTRATE 审中-公开
标题翻译：将多晶金刚石材料的预烧结体接合到基板的方法
公开(公告)号：US20150000201A1
公开(公告)日：2015-01-01
申请号：US14367148
申请日：2012-12-13
申请人： Element Six Abrasives, S.A.
发明人： Kaveshini Naidoo
IPC分类号： C04B37/02
CPC分类号： C04B37/026 , B22F7/064 , C04B37/023 , C04B2237/02 , C04B2237/12 , C04B2237/122 , C04B2237/124 , C04B2237/16 , C04B2237/363 , C04B2237/401 , C04B2237/50 , C04B2237/52 , C04B2237/592 , C04B2237/60 , C04B2237/61 , C04B2237/706 , C04B2237/708 , C22C1/0433 , C22C19/07
摘要： A method of attaching a pre-sintered body of polycrystalline diamond material to a substrate along an interface therebetween, the substrate being formed of cemented carbide and a metal binder phase dispersed therein, comprises placing a layer comprising one or more elements or alloys thereof on the interface on one or other of the body of polycrystalline diamond material or substrate; the one or more elements being selected to form a eutectic mixture with the metal in the binder phase, the eutectic mixture having a lower melting point than the melting point of the metal in the binder phase of the substrate. The other of the body of polycrystalline diamond material or the substrate is then placed on the layer and the body of polycrystalline material, the layer and the substrate are then subjected to a predetermined temperature at least equal to or greater than the melting point of the eutectic mixture at substantially ambient pressure or a vacuum to melt the metal in the binder phase at the interface with the substrate so that the metal from the binder phase infiltrates into the adjacent body of polycrystalline diamond material to form a bond between the body of polycrystalline diamond material and the substrate.
摘要翻译：一种将多晶金刚石材料的预烧结体沿着它们之间的界面附着到衬底上的方法，所述衬底由硬质合金和分散在其中的金属粘合剂相形成，包括将包含一种或多种元素或其合金的层放置在在多晶金刚石材料或衬底的一个或多个体上的界面; 所选择的一种或多种元素与粘合剂相中的金属形成共晶混合物，共晶混合物的熔点低于基底粘结相中金属的熔点。然后将多晶金刚石材料或基底中的另一个放置在多晶材料的层和主体上，然后将该层和基底经受至少等于或大于共晶体的熔点的预定温度混合物在基本环境压力或真空下在与基材的界面处熔融粘合剂相中的金属，使得来自粘合剂相的金属渗透到相邻的多晶金刚石材料体中以在多晶金刚石材料体之间形成结合和基板。

3. 发明申请

US20130216842A1 METHOD OF BONDING CERAMIC AND METAL AND BONDED STRUCTURE OF CERAMIC AND METAL 审中-公开
标题翻译：陶瓷和金属的结合方法和陶瓷和金属的结合结构
公开(公告)号：US20130216842A1
公开(公告)日：2013-08-22
申请号：US13767297
申请日：2013-02-14
申请人： DENSO CORPORATION
发明人： Yasunori KAWAMOTO , Yasuyuki OOKOUCHI
IPC分类号： B23K31/02
CPC分类号： B23K31/02 , B23K20/02 , B23K20/22 , C04B37/021 , C04B2237/365 , C04B2237/403 , C04B2237/50
摘要： The present invention provides a method of bonding ceramic and metal comprising the steps of bonding metal foils to a bonding surface of a ceramic matrix and a bonding surface of a metal matrix to be bonded and then heating so as to leave metal layers at the surfaces of the metal foils while forming diffusion layers with inclined linear expansion coefficients with materials of the metal foils diffused in them between the ceramic matrix and metal layer and between the metal matrix and metal layer, and making the respective metal layers which remain at the surfaces of the metal foils bond so as to bond the ceramic matrix and the metal matrix.
摘要翻译：本发明提供一种接合陶瓷和金属的方法，包括以下步骤：将金属箔接合到陶瓷基体的接合表面和待结合的金属基体的接合表面上，然后加热，以使金属层在金属箔同时形成具有倾斜线性膨胀系数的扩散层，其中金属箔的材料在陶瓷基体和金属层之间以及在金属基体和金属层之间扩散，并且使保留在金属箔表面的各个金属层金属箔键合以便结合陶瓷基体和金属基体。

4. 发明授权

US08361634B2 Composite articles made by process for joining bronze part and silicon carbide ceramic part 有权
标题翻译：用青铜部件和碳化硅陶瓷部件接合的复合制品
公开(公告)号：US08361634B2
公开(公告)日：2013-01-29
申请号：US13172274
申请日：2011-06-29
申请人： Hsin-Pei Chang , Wen-Rong Chen , Huann-Wu Chiang , Cheng-Shi Chen , Wen-Feng Hu
发明人： Hsin-Pei Chang , Wen-Rong Chen , Huann-Wu Chiang , Cheng-Shi Chen , Wen-Feng Hu
IPC分类号： B32B15/04 , B32B15/20 , B32B18/00
CPC分类号： C04B37/026 , B32B9/005 , B32B15/04 , B32B15/20 , C04B2237/121 , C04B2237/123 , C04B2237/365 , C04B2237/407 , C04B2237/50 , C04B2237/60 , Y10T428/12576 , Y10T428/1275 , Y10T428/1291 , Y10T428/12944
摘要： A process for joining a bronze part and a silicon carbide ceramic part comprising: providing a bronze part, a SiC ceramic part, a Al foil and a Ni foil; placing the SiC ceramic part, the Al foil, the Ni foil, and the bronze part into a mold, the Al foil and the Ni foil located between the SiC ceramic part and the bronze part, the Al foil abutting against the SiC ceramic part, the Ni foil abutting against the bronze part and the Al foil; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the bronze part, the SiC ceramic part, the Al foil, and the Ni foil at least until the bronze part, the SiC ceramic part, the Al foil and the Ni foil form a integral composite article.
摘要翻译：一种用于接合青铜部件和碳化硅陶瓷部件的方法，包括：提供青铜部件，SiC陶瓷部件，Al箔和Ni箔; 将SiC陶瓷部件，Al箔，Ni箔和青铜部件放置在模具中，位于SiC陶瓷部件和青铜部件之间的Al箔和Ni箔，Al箔与SiC陶瓷部件抵接， Ni箔抵靠青铜部分和铝箔; 将模具放入热压烧结装置的腔室中，加热室并压制青铜部分，SiC陶瓷部分，Al箔和Ni箔，至少直到青铜部分，SiC陶瓷部分，Al箔 Ni箔形成整体复合制品。

5. 发明授权

US07547370B2 Method for manufacturing multilayer ceramic electronic element 有权
标题翻译：多层陶瓷电子元件的制造方法
公开(公告)号：US07547370B2
公开(公告)日：2009-06-16
申请号：US11611552
申请日：2006-12-15
申请人： Shingo Okuyama , Hiroyoshi Takashima , Akira Hashimoto , Shinichi Kokawa
发明人： Shingo Okuyama , Hiroyoshi Takashima , Akira Hashimoto , Shinichi Kokawa
IPC分类号： C03B29/02 , B32B38/14 , B32B37/15 , B32B37/02 , C09J5/04 , B41F9/06 , B28B5/02 , C03B29/06 , B32B37/26 , H01G7/04 , C04B33/34
CPC分类号： B32B18/00 , B32B38/145 , C04B35/468 , C04B2237/346 , C04B2237/50 , C04B2237/68 , C04B2237/704 , H01G4/12 , H01G4/30 , H01G4/308 , H01G4/33 , H05K1/0306 , H05K3/12 , H05K3/4611 , H05K3/4629 , H05K2201/09881 , H05K2203/0113 , Y10T29/435
摘要： A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.
摘要翻译：一种制造多层陶瓷电子元件的方法包括以下步骤：形成具有优异表面平滑度和高速度变化小的陶瓷生片，其中防止诸如针孔的缺陷发生，并且提供内部电极和阶梯平滑陶瓷贴纸陶瓷生坯片高精度。该方法包括以下步骤：通过模涂机将陶瓷浆料施加到基膜上，然后在用于形成陶瓷生片的干燥炉中进行干燥，并且通过使用陶瓷生片将导电浆料和陶瓷浆料进行凹版印刷第一和第二凹版印刷设备。因此，形成内部电极，并且在除了形成内部电极的区域之外的区域中设置阶梯平滑陶瓷膏。

6. 发明授权

US06984516B2 Multilayered microfluidic DNA analysis system and method 失效
公开(公告)号：US06984516B2
公开(公告)日：2006-01-10
申请号：US10340057
申请日：2003-01-10
申请人： Cynthia G. Briscoe , Huinan Yu , Piotr Grodzinski , Robert Marrero , Jeremy W. Burdon , Rong-Fong Huang
发明人： Cynthia G. Briscoe , Huinan Yu , Piotr Grodzinski , Robert Marrero , Jeremy W. Burdon , Rong-Fong Huang
IPC分类号： C12M1/34 , C12P19/34 , B01J19/08
CPC分类号： G01N30/6069 , B01J19/0093 , B01J2219/00317 , B01J2219/00351 , B01J2219/00495 , B01J2219/00783 , B01J2219/00835 , B01J2219/00873 , B01J2219/00966 , B01L3/502707 , B01L3/50273 , B01L3/502738 , B01L7/00 , B01L7/52 , B01L2200/0689 , B01L2200/12 , B01L2300/0627 , B01L2300/0645 , B01L2300/0874 , B01L2300/0883 , B01L2300/0887 , B01L2300/12 , B01L2300/18 , B01L2300/1822 , B01L2400/0415 , B01L2400/0439 , B32B18/00 , B32B2038/042 , B32B2311/06 , B32B2311/08 , B32B2315/02 , B81B2201/058 , B81C1/00119 , B81C2201/019 , C04B2235/6562 , C04B2237/341 , C04B2237/343 , C04B2237/348 , C04B2237/50 , C04B2237/62 , C04B2237/68 , C04B2237/704 , C40B60/14 , F04B19/006 , F28D9/00 , F28D2021/0029 , F28F13/00 , F28F2260/02 , G01N30/60 , G01N30/6004 , G01N30/6095 , G01N2030/025 , G01N2030/528 , G01N2035/00158 , G01N2035/00237 , H05K1/0272 , H05K1/0306 , H05K3/4611 , H05K3/4629
摘要： A multilayered microfluidic DNA analysis system includes a cell lysis chamber, a DNA separation chamber, a DNA amplification chamber, and a DNA detection system. The multilayered microfluidic DNA analysis system is provided as a substantially monolithic structure formed from a plurality of green-sheet layers sintered together. The substantially monolithic structure has defined therein a means for heating the DNA amplification chamber and a means for cooling the DNA amplification chamber. The means for heating and means for cooling operate to cycle the temperature of the DNA amplification chamber as required for performing a DNA amplification process, such as PCR.

7. 发明授权

US06929874B2 Aluminum nitride sintered body, ceramic substrate, ceramic heater and electrostatic chuck 有权
标题翻译：氮化铝烧结体，陶瓷基板，陶瓷加热器和静电吸盘
公开(公告)号：US06929874B2
公开(公告)日：2005-08-16
申请号：US10442967
申请日：2003-05-22
申请人： Yasuji Hiramatsu , Yasutaka Ito
发明人： Yasuji Hiramatsu , Yasutaka Ito
IPC分类号： C04B35/08 , C04B35/10 , C04B35/14 , C04B35/565 , C04B35/575 , C04B35/581 , C04B35/583 , C04B35/584 , H01L21/00 , H01L21/68 , H01L21/683 , H05B3/14 , H05B3/74 , B32B9/04
CPC分类号： H05B3/746 , B32B18/00 , B32B38/145 , B32B2038/042 , B32B2311/08 , C04B35/08 , C04B35/10 , C04B35/14 , C04B35/5607 , C04B35/5611 , C04B35/5622 , C04B35/5626 , C04B35/565 , C04B35/575 , C04B35/58014 , C04B35/581 , C04B35/583 , C04B35/584 , C04B35/6264 , C04B35/6303 , C04B2235/3201 , C04B2235/3217 , C04B2235/3225 , C04B2235/3418 , C04B2235/3821 , C04B2235/386 , C04B2235/3865 , C04B2235/3873 , C04B2235/422 , C04B2235/446 , C04B2235/5436 , C04B2235/5445 , C04B2235/6025 , C04B2235/721 , C04B2235/723 , C04B2235/726 , C04B2235/728 , C04B2235/77 , C04B2235/786 , C04B2235/96 , C04B2235/9607 , C04B2237/408 , C04B2237/50 , C04B2237/62 , C04B2237/704 , H01L21/67103 , H01L21/67109 , H01L21/6833 , H01L21/6835 , H01L2924/19041 , H05B3/143 , H05B3/74 , Y10T428/25 , Y10T428/252 , Y10T428/26 , Y10T428/265
摘要： The object of the present invention is to provide an aluminum nitride sintered body which has excellent mechanical strength and in which ceramic particles is prevented from coming off from the surface and/or side thereof and generation of free particles is suppressed. The aluminum nitride sintered body of the present invention is wherein it contains sulfur.
摘要翻译：本发明的目的是提供一种具有优异的机械强度并且防止陶瓷颗粒从其表面和/或侧面脱落并且抑制游离颗粒的产生的氮化铝烧结体。本发明的氮化铝烧结体中含有硫。

8. 发明授权

US06921881B2 Ceramic joint body 有权
标题翻译：陶瓷接头体
公开(公告)号：US06921881B2
公开(公告)日：2005-07-26
申请号：US10432639
申请日：2002-08-12
申请人： Yasutaka Ito , Kazuteru Ohkura
发明人： Yasutaka Ito , Kazuteru Ohkura
IPC分类号： C04B35/10 , C04B35/565 , C04B35/581 , C04B35/645 , C04B37/00 , H01L21/00 , H01L21/683 , H05B3/68
CPC分类号： B32B18/00 , B32B2038/042 , B32B2309/022 , B32B2311/02 , B32B2311/14 , B32B2311/22 , C04B35/10 , C04B35/5607 , C04B35/5626 , C04B35/565 , C04B35/581 , C04B35/6264 , C04B35/62655 , C04B35/63 , C04B35/6303 , C04B35/634 , C04B35/645 , C04B37/001 , C04B37/005 , C04B2235/3201 , C04B2235/3203 , C04B2235/3206 , C04B2235/3217 , C04B2235/3225 , C04B2235/3821 , C04B2235/3865 , C04B2235/422 , C04B2235/5436 , C04B2235/5445 , C04B2235/6025 , C04B2235/606 , C04B2235/658 , C04B2235/721 , C04B2235/77 , C04B2235/94 , C04B2235/96 , C04B2235/963 , C04B2235/9669 , C04B2237/066 , C04B2237/40 , C04B2237/403 , C04B2237/405 , C04B2237/408 , C04B2237/50 , C04B2237/62 , C04B2237/68 , C04B2237/704 , H01L21/67103 , H01L21/6831 , H01L21/6833 , Y10T428/24917 , Y10T428/24926
摘要： A ceramic joint body including a ceramic substrate and a ceramic body such as a cylindrical body firmly bonded to each other and excellent in corrosion resistance in the ceramic substrate for use for a semiconductor product producing/examining the step. The ceramic bonded body includes a ceramic substrate in which a conductor is provided, and a ceramic body bonded to a bottom face of the ceramic substrate. The ceramic bonded body has a region, where no conductor is formed, in at least a part of a region above a bonding interface between the ceramic substrate and the ceramic body.
摘要翻译：一种陶瓷接头体，其包括陶瓷基板和诸如筒状体的陶瓷体，其彼此牢固地接合并且在用于半导体产品的陶瓷基板中具有优异的耐腐蚀性，从而产生/检查该步骤。陶瓷接合体包括其中设置有导体的陶瓷基板和与陶瓷基板的底面接合的陶瓷体。陶瓷接合体在陶瓷基板和陶瓷体之间的接合界面的上方的区域的至少一部分中具有不形成导体的区域。

9. 发明授权

US06908872B2 Transparent ceramic and method for production thereof, and optical element 失效
标题翻译：透明陶瓷及其制造方法以及光学元件
公开(公告)号：US06908872B2
公开(公告)日：2005-06-21
申请号：US10204642
申请日：2001-12-18
申请人： Nobuhiko Tanaka , Yukio Higuchi , Masayoshi Katsube , Mitsuru Sube
发明人： Nobuhiko Tanaka , Yukio Higuchi , Masayoshi Katsube , Mitsuru Sube
IPC分类号： B32B18/00 , B32B38/00 , C04B35/00 , C04B35/457 , C04B35/46 , C04B35/468 , C04B35/48 , C04B35/495 , C04B35/636 , C04B35/64 , C04B35/84 , G02B1/02 , G02B3/00 , G02B6/12 , G02B6/132 , G02F1/00 , G02F1/055 , H01Q15/02
CPC分类号： C04B35/457 , B32B18/00 , B32B38/0004 , B32B38/145 , B32B2311/06 , C04B35/46 , C04B35/468 , C04B35/48 , C04B35/495 , C04B35/6262 , C04B35/62695 , C04B35/6365 , C04B2235/3205 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3232 , C04B2235/3244 , C04B2235/3251 , C04B2235/3258 , C04B2235/3272 , C04B2235/3275 , C04B2235/3279 , C04B2235/3284 , C04B2235/3293 , C04B2235/3294 , C04B2235/6025 , C04B2235/604 , C04B2235/6583 , C04B2235/6585 , C04B2235/6587 , C04B2235/72 , C04B2235/768 , C04B2235/77 , C04B2235/9646 , C04B2235/9653 , C04B2237/408 , C04B2237/50 , C04B2237/704 , G02B1/02 , G02B3/0087 , G02B6/12002 , G02B6/132 , G02B2006/121 , G02F1/0018 , G02F1/055 , H01Q15/02 , Y10S264/91
摘要： A ceramic material powder for a translucent ceramic is molded with a binder, and the resulting green compact is embedded in a ceramic powder having the same composition with the ceramic material powder. After removing the binder, the green compact embedded in the ceramic powder is fired in an atmosphere having an oxygen concentration higher than that in the removal procedure of the binder and thereby yields a translucent ceramic represented by Formula I: Ba{(SnuZr1-u)xMgyTaz}vOw, Formula II: Ba(ZrxMgyTaz)vOw or Formula III: Ba{(SnuZr1-u)xZntMg1-t)yNbz}vOw. The translucent ceramic has a refractive index of 1.9 or more and is paraelectric.
摘要翻译：用粘合剂将用于半透明陶瓷的陶瓷材料粉末模制，并将所得的生坯压坯与陶瓷材料粉末嵌入具有相同组成的陶瓷粉末中。在除去粘合剂之后，将包埋在陶瓷粉末中的生坯在氧浓度高于粘合剂的除去程度的气氛中焙烧，从而得到由式I表示的半透明陶瓷：Ba {（Sn u 1 1 1 x 式II：Ba（Zr x Si y Ta z z）z H z，或者式III：Ba（{（Sn≡Z1）≡Z> w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w w 。半透明陶瓷的折射率为1.9以上，为顺电性。

10. 发明授权

US06762496B2 Substrate and production method therefor 失效
标题翻译：基材及其制备方法
公开(公告)号：US06762496B2
公开(公告)日：2004-07-13
申请号：US10182366
申请日：2002-07-26
申请人： Reo Yamamoto , Yoshihide Kamiyama , Yuichiro Minabe
发明人： Reo Yamamoto , Yoshihide Kamiyama , Yuichiro Minabe
IPC分类号： H01L2312
CPC分类号： H01L23/49894 , B32B18/00 , B32B2038/042 , B32B2311/04 , C04B35/581 , C04B35/62625 , C04B35/6264 , C04B35/63 , C04B35/632 , C04B35/634 , C04B35/63424 , C04B2235/3225 , C04B2235/3865 , C04B2235/449 , C04B2235/668 , C04B2235/72 , C04B2235/721 , C04B2235/9607 , C04B2235/963 , C04B2237/40 , C04B2237/403 , C04B2237/408 , C04B2237/50 , C04B2237/62 , C04B2237/704 , C04B2237/706 , H01L23/15 , H01L2924/0002 , Y10T428/24917 , Y10T428/24926 , H01L2924/00
摘要： A sintered aluminum nitride substrate which has a via hole and an internal electrically conductive layer, having high thermal conductivity and high adhesion strength between the sintered aluminum nitride substrate and the internal electrically conductive layer or the via hole and having other excellent properties. The substrate comprising an internal electrically conductive layer, at least one electrically conductive via hole formed between the internal electrically conductive layer and at least one surface of the substrate, wherein the thermal conductivity of the aluminum nitride sintering product at 25° C. is 190 W/mK or more, and the adhesion strength between the aluminum nitride sintering product and the internal electrically conductive layer is 5.0 kg/mm2 or more.
摘要翻译：一种烧结氮化铝衬底，其具有通孔和内部导电层，其在氮化铝烧结氮化物衬底和内部导电层或通孔之间具有高导热性和高粘合强度，并且具有其它优异的性能。所述衬底包括内部导电层，形成在所述内部导电层和所述衬底的至少一个表面之间的至少一个导电通孔，其中所述氮化铝烧结产品在25℃下的导热率为190W / mK以上，氮化铝烧结体和内部导电层之间的粘合强度为5.0kg / mm 2以上。

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