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    • 7. 发明授权
    • Glass substrate film sputtering target and preparing method thereof
    • 玻璃基片薄膜溅射靶及其制备方法
    • US09162286B2
    • 2015-10-20
    • US13380861
    • 2011-12-12
    • Hao Kou
    • Hao Kou
    • B22F3/14C23C14/34C22C30/02B22F1/00C04B35/457B82Y30/00
    • B22F3/14B22F1/0018B22F2999/00B82Y30/00C04B35/457C04B2235/3286C04B2235/6567C04B2235/77C22C30/02C23C14/3414B22F2202/13
    • A preparing method of a glass substrate film sputtering target is disclosed, which comprises the following steps of: weighing an alloy material for forming the glass substrate film sputtering target; adding the alloy material weighed into a plasma pressure compaction sintering cavity and sintering the alloy material to obtain a sintered target, wherein the sintering temperature is 500° C.˜1600° C. and the sintering time is 5˜20 minutes; and post-processing the sintered target. A glass substrate film sputtering target prepared by the preparing method is further disclosed. Because the plasma pressure compaction for quick sintering is adopted for the glass substrate film sputtering target and the preparing method thereof of the present disclosure, quality of the target can be improved and the time necessary for preparing the target can be shortened.
    • 公开了一种玻璃基板薄膜溅射靶的制备方法,包括以下步骤:称量用于形成玻璃基片薄膜溅射靶的合金材料; 将称重的合金材料加入到等离子体压制烧结腔中,烧结合金材料,得到烧结靶,烧结温度为500℃〜1600℃,烧结时间为5〜20分钟; 并对烧结靶进行后处理。 进一步公开了通过该制备方法制备的玻璃基底膜溅射靶。 由于玻璃基板膜溅射靶的采用等离子体压力快速烧结及其本公开的制备方法,因此能够提高靶的质量,缩短制备靶材所需的时间。