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1. 发明授权

US5038377A ROM circuit for reducing sound data 失效
标题翻译： ROM电路，用于减少声音数据
公开(公告)号：US5038377A
公开(公告)日：1991-08-06
申请号：US438997
申请日：1989-11-22
申请人： Yoshiro Kihara , Sigeaki Masuzawa , Takao Maeda , Akitomo Kiriyama
发明人： Yoshiro Kihara , Sigeaki Masuzawa , Takao Maeda , Akitomo Kiriyama
IPC分类号： G10L19/00 , G10L13/02 , G10L13/04
CPC分类号： G10L13/02
摘要： A voice synthesis system includes the use of a group of representative sound data for synthesizing voice data. A ROM circuit in the system includes a multilevel address system that stores starting addresses of the representative sound data. The memory capacity required for storing the representative voice data synthesized is reduced by accessing nondistinguishable data through a multilevel address system.
摘要翻译：语音合成系统包括使用一组代表性的声音数据来合成语音数据。系统中的ROM电路包括存储代表声音数据的起始地址的多电平地址系统。通过多级地址系统访问不可区分的数据，可减少存储合成的代表性语音数据所需的存储器容量。

2. 发明授权

US08138060B2 Wafer 有权
标题翻译：晶圆
公开(公告)号：US08138060B2
公开(公告)日：2012-03-20
申请号：US12258850
申请日：2008-10-27
申请人： Toshihiko Tsukatani , Takao Maeda , Junichi Nakayama , Hirofumi Kawazoe , Masaru Konya , Noriaki Hamaya , Hajime Nakano
发明人： Toshihiko Tsukatani , Takao Maeda , Junichi Nakayama , Hirofumi Kawazoe , Masaru Konya , Noriaki Hamaya , Hajime Nakano
IPC分类号： B32B27/32 , B32B9/04 , B32B13/04 , B32B9/00 , B32B19/00
CPC分类号： C23C4/18 , C23C4/02 , C23C4/11 , C23C18/1216 , C23C24/04
摘要： A wafer has a rare earth oxide layer disposed, typically sprayed, on a substrate. It is useful as a dummy wafer in a plasma etching or deposition system.
摘要翻译：晶片具有通常喷涂在基板上的稀土氧化物层。作为等离子体蚀刻或沉积系统中的虚设晶片是有用的。

3. 发明授权

US07968205B2 Corrosion resistant multilayer member 有权
标题翻译：耐腐蚀多层构件
公开(公告)号：US07968205B2
公开(公告)日：2011-06-28
申请号：US11550929
申请日：2006-10-19
申请人： Hajime Nakano , Toshihiko Tsukatani , Takao Maeda
发明人： Hajime Nakano , Toshihiko Tsukatani , Takao Maeda
IPC分类号： B32B9/00
CPC分类号： C23C4/18 , C23C4/02 , C23C4/11 , C23C4/134 , C23C24/04 , H01J37/32477 , H01J37/32559
摘要： A corrosion resistant member to be exposed to a halogen-containing gas atmosphere or a halogen-containing gas plasma atmosphere, comprising a substrate and a plurality of layers deposited thereon including a layer of rare earth fluoride providing the outermost surface and a layer of rare earth oxide having a porosity of less than 5% underlying the rare earth fluoride layer.
摘要翻译：暴露于含卤素气体气氛或含卤素的气体等离子体气氛中的耐腐蚀构件，包括基材和沉积在其上的多层，其中包括提供最外表面的稀土氟化物层和稀土层具有低于稀土氟化物层下面5％孔隙率的氧化物。

4. 发明授权

US6144269A Noise-cut LC filter for power converter with overlapping aligned coil patterns 有权
标题翻译：用于功率转换器的噪声切割LC滤波器，具有重叠对齐的线圈图案
公开(公告)号：US6144269A
公开(公告)日：2000-11-07
申请号：US143215
申请日：1998-08-28
申请人： Kenji Okamoto , Shinji Uchida , Takao Maeda , Takashi Aihara , Yoshihiro Matsumoto , Naoto Fukasawa
发明人： Kenji Okamoto , Shinji Uchida , Takao Maeda , Takashi Aihara , Yoshihiro Matsumoto , Naoto Fukasawa
IPC分类号： H02M1/12 , H02M1/14 , H02M7/00 , H03H7/01
CPC分类号： H02M7/003 , H02M1/12 , H02M1/14 , H03H7/0115 , H03H2001/0085 , Y10T29/4902 , Y10T29/49073 , Y10T29/49078 , Y10T29/49165 , Y10T29/49169 , Y10T29/49171
摘要： A noise-cut filter having distributed inductances and distributed capacitances is provided wherein conductive spiral coil patterns are formed on the opposite surfaces of a dielectric sheet, such that the spiral coil patterns are aligned with each other in a direction perpendicular to the plane of the dielectric sheet, and a main circuit pattern is constructed by bonding a main circuit conductor to the spiral coil pattern formed on one of the opposite surfaces of the dielectric sheet. The main circuit conductor is formed by stamping with a punch press so that the conductor has a cross sectional area large enough to allow the passage of current of a main circuit, and has substantially the same shape as the spiral coil pattern. Further, a grounding wire is bonded to the spiral coil pattern formed on the other surface of the dielectric sheet, so that the grounding wire leads the current involving noises which flows from the main circuit pattern into the spiral coil pattern via the dielectric sheet, to a ground terminal.
摘要翻译：提供具有分布电感和分布电容的噪声截止滤波器，其中导电螺旋线圈图案形成在电介质片的相对表面上，使得螺旋线圈图案在垂直于电介质平面的方向上彼此对准并且通过将主电路导体接合到形成在电介质片的相对表面之一上的螺旋线圈图案来构成主电路图案。主电路导体通过冲压机冲压而形成，使得导体的横截面面积足够大以允许主电路的电流通过，并且具有与螺旋线圈图案基本相同的形状。此外，将接地线接合到形成在电介质片的另一表面上的螺旋线圈图案，使得接地线将导致从主电路图案流入螺旋线圈图案的噪声经由电介质片导向的电流引到一个地面终端。

5. 发明授权

US5455453A Plastic package type semiconductor device having a rolled metal substrate 失效
标题翻译：具有轧制金属基板的塑料封装型半导体器件
公开(公告)号：US5455453A
公开(公告)日：1995-10-03
申请号：US907229
申请日：1992-07-01
申请人： Keizo Harada , Takao Maeda , Takatoshi Takikawa , Shunsuke Ban , Shosaku Yamanaka
发明人： Keizo Harada , Takao Maeda , Takatoshi Takikawa , Shunsuke Ban , Shosaku Yamanaka
IPC分类号： H01L23/12 , H01L21/48 , H01L23/14 , H01L23/495 , H05K1/05 , H01L23/48 , H01L29/44 , H01L29/52 , H01L29/60
CPC分类号： H01L24/49 , H01L21/4835 , H01L23/142 , H01L23/49531 , H01L23/49558 , H01L23/49586 , H01L23/49589 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/4903 , H01L2224/49051 , H01L2224/4911 , H01L2224/49113 , H01L2224/49433 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H01L2924/351 , Y10S438/938
摘要： A plastic package type semiconductor device is composed of a rolled metal substrate made of copper or copper alloy and an insulating film formed on the surface of the substrate. The film may be a single-layer film made of silicon oxynitride or a composite film formed by laminating a silicon oxide layer and a silicon oxynitride layer (or a silicon nitride layer). A semiconductor element is mounted on the film or on the exposed surface of the substrate. Other passive elements are provided on the film. After connecting these elements with bonding wires, the entire device is sealed in a resin molding. This device is thus free of cracks due to difference in thermal expansion between the film and the substrate, or peeling due to moisture absorption.
摘要翻译：塑料封装型半导体器件由铜或铜合金制成的轧制金属衬底和形成在衬底表面上的绝缘膜组成。该膜可以是由氮氧化硅制成的单层膜或通过层叠氧化硅层和氮氧化硅层（或氮化硅层）而形成的复合膜。半导体元件安装在薄膜上或基板的暴露表面上。其他无源元件设置在胶片上。在将这些元件与接合线连接之后，整个器件被密封在树脂模塑中。因此，由于膜和基板之间的热膨胀差异，或者由于吸湿而剥离，因此该装置无裂纹。

6. 发明授权

US5369220A Wiring board having laminated wiring patterns 失效
标题翻译：具有叠层布线图案的布线板
公开(公告)号：US5369220A
公开(公告)日：1994-11-29
申请号：US949474
申请日：1992-10-23
申请人： Keizo Harada , Takatoshi Takikawa , Takao Maeda , Shunsuke Ban , Shosaku Yamanaka
发明人： Keizo Harada , Takatoshi Takikawa , Takao Maeda , Shunsuke Ban , Shosaku Yamanaka
IPC分类号： H01L23/14 , H01L23/495 , H01L23/498 , H05K1/05 , H01L39/02 , H01L23/48 , H01L29/46 , H01L29/62
CPC分类号： H05K1/053 , H01L23/142 , H01L23/49517 , H01L23/49531 , H01L23/49866 , H01L24/49 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4903 , H01L2224/49051 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01327 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H05K2201/0179 , H05K2201/0317
摘要： A wiring board has a wiring circuit which is reliable and which can be easily miniaturized, and used for the production of a highly integrated, lighter, thinner, shorter, smaller and low-cost semiconductor device. This wiring board can be sealed in a plastic package. The wiring board has a metal plate and a thin-film dielectric layer formed on the surface of the metal plate. A semiconductor device is mounted on the surface of the dielectric layer or the exposed surface of the metal plate. Film wirings are formed on the dielectric layer. Each film wiring is in the form of a laminate formed by laminating, by vapor phase deposition or by plating, a an aluminum conductive layer, an adhesive layer of chromium, titanium or a laminate thereof, a diffusion barrier layer of nickel, copper or a laminate thereof, and a corrosion-preventive and wire bonding layer of gold. Such wirings may alternatively be in the form of a laminate formed by laminating an adhesive layer of chromium, aluminum, titanium or a laminate comprising at least two of such materials, a copper conductive layer, and a gold layer, or in the form of a laminate formed by laminating an aluminum conductive layer, a barrier layer of nickel, and a gold layer. Since the film wirings can be miniaturized easily, the density of the wirings can be increased. Also, since the wirings are made of aluminum or copper, they are inexpensive.
摘要翻译： PCT No.PCT / JP92 / 00198 Sec。 371日期：1992年10月23日 102（e）日期1992年10月23日PCT提交1992年2月24日PCT公布。公开号WO92 / 15117 日期：1992年9月3日。线路板具有可靠的并且可以容易地小型化的布线电路，并且用于生产高度集成，更轻，更薄，更短，更小和更低成本的半导体器件。该接线板可以用塑料封装密封。布线板具有形成在金属板表面上的金属板和薄膜电介质层。半导体器件安装在电介质层的表面或金属板的暴露表面上。在电介质层上形成膜布线。每个薄膜布线是通过气相沉积或电镀层压铝，导电层，铬，钛或其层压体的粘合剂层，镍，铜或铜的扩散阻挡层而形成的层压体层压板，以及金的防腐蚀和引线接合层。这种布线也可以是通过层压铬，铝，钛或包含这些材料中的至少两种的层压体，铜导电层和金层，或者以通过层叠铝导电层，镍的阻挡层和金层形成的层压体。由于薄膜布线可以容易地小型化，所以可以提高布线的密度。此外，由于布线由铝或铜制成，所以价格便宜。

7. 发明授权

US5306679A Heat conductive colored aluminum nitride sintered body 失效
标题翻译：导热色氮化铝烧结体
公开(公告)号：US5306679A
公开(公告)日：1994-04-26
申请号：US24820
申请日：1993-03-01
申请人： Kouhei Shimoda , Takao Maeda , Kouichi Sogabe , Masaya Miyake
发明人： Kouhei Shimoda , Takao Maeda , Kouichi Sogabe , Masaya Miyake
IPC分类号： C04B35/581 , H01L21/48 , C04B35/58
CPC分类号： C04B35/581 , H01L21/4807
摘要： A heat conductive aluminum nitride sintered body contains 100 parts by weight of aluminum nitride, at least 0.005 parts by weight and not more than 0.5 parts by weight of carbon, at least 0.01 parts by weight and not more than 15 parts by weight of a rare earth aluminum oxide in terms of the simple substance of a rare earth element, and at least 0.01 parts by weight and not more than 15 parts by weight of at least one element selected from a group of compounds containing elements belonging to the groups IVB, VB and VIB of the periodic table in terms of the simple substance of the element. Such a sintered body has a heat conductivity of at least 100 W/m.multidot.K. and not more than 270 W/m.multidot.K. at room temperature.
摘要翻译：导热氮化铝烧结体含有100重量份的氮化铝，至少0.005重量份，不超过0.5重量份的碳，至少0.01重量份，不超过15重量份的稀有金属以稀土元素的单质为基准的至少0.01重量份至少15重量份的选自包含属于IVB族，VB族的元素的化合物的族中的至少一种元素和元素周期表的VIB。这种烧结体的导热率至少为100W / m×K。不超过270 W / m * K。在室温下。

8. 发明授权

US5294388A Heat conductive colored aluminum nitride sintered body and method of preparing the same 失效
标题翻译：导热色氮化铝烧结体及其制备方法
公开(公告)号：US5294388A
公开(公告)日：1994-03-15
申请号：US922682
申请日：1992-07-29
申请人： Kouhei Shimoda , Takao Maeda , Kouichi Sogahe , Masaya Miyake
发明人： Kouhei Shimoda , Takao Maeda , Kouichi Sogahe , Masaya Miyake
IPC分类号： C04B35/581 , H01L21/48 , F27B9/04 , C04B35/58
CPC分类号： C04B35/581 , H01L21/4807
摘要： A heat conductive aluminum nitride sintered body contains 100 parts by weight of aluminum nitride, at least 0.005 parts by weight and not more than 0.5 parts by weight of carbon, at least 0.01 parts by weight and not more than 15 parts by weight of a rare earth aluminum oxide in terms of the simple substance of a rare earth element, and at least 0.01 parts by weight and not more than 15 parts by weight of at least one element selected from a group of compounds containing elements belonging to the groups IVB, VB and VIB of the periodic table in terms of the simple substance of the element. Heat conductivity of the aluminum nitride sintered body is at least 100 W/m.multidot.K and not more than 270 W/m.multidot.K at the ordinary temperature. According to a method of preparing such an aluminum nitride sintered body, at least 0.01 parts by weight and not more than 5 parts by weight of carbon, at least 0.01 parts by weight and not more than 15 parts by weight of an oxide of a rare earth element, and at least 0.01 parts by weight and not more than 15 parts by weight of an oxide, a carbide or a nitride of an element belonging to the group IVB, VB or VIB of the periodic table are added to 100 parts by weight of aluminum nitride. A compact of this mixture is fired in a nonoxidizing atmosphere under a temperature of at least 1500.degree. C. and not more than 2100.degree. C.
摘要翻译：导热氮化铝烧结体含有100重量份的氮化铝，至少0.005重量份，不超过0.5重量份的碳，至少0.01重量份，不超过15重量份的稀有金属以稀土元素的单质为基准的至少0.01重量份至少15重量份的选自包含属于IVB族，VB族的元素的化合物的族中的至少一种元素和元素周期表的VIB。氮化铝烧结体的导热率在常温下为至少100W / m×K且不大于270W / m×K。根据制备这种氮化铝烧结体的方法，至少0.01重量份且不超过5重量份的碳，至少0.01重量份且不超过15重量份的稀有氧化物并且将至少0.01重量份且不超过15重量份的元素周期表中IVB族，VB族或VIB族元素的氧化物，碳化物或氮化物加入到100重量份的氮化铝。将该混合物的压块在至少1500℃且不超过2100℃的温度下在非氧化气氛中焙烧。

9. 发明授权

US08914965B2 Processing method for brake rotor-equiped wheel bearing devices 有权
标题翻译：制动转子配套车轮轴承装置的加工方法
公开(公告)号：US08914965B2
公开(公告)日：2014-12-23
申请号：US13030711
申请日：2011-02-18
申请人： Kiyotake Shibata , Kazunari Yamamoto , Kazuhisa Shigeoka , Taku Nishiki , Kazuo Komori , Takao Maeda
发明人： Kiyotake Shibata , Kazunari Yamamoto , Kazuhisa Shigeoka , Taku Nishiki , Kazuo Komori , Takao Maeda
IPC分类号： B23B3/22 , B23B5/04 , B23B29/00 , B21K1/40 , B23P13/00 , B23B5/02 , B60B27/00
CPC分类号： B23B5/02 , B23P15/003 , B60B27/0005 , B60B27/0026 , B60B27/0094 , Y10T29/49535 , Y10T29/49536 , Y10T29/49696 , Y10T29/4984 , Y10T29/49995 , Y10T29/53648 , Y10T82/10 , Y10T82/21 , Y10T82/2585 , Y10T409/303808 , Y10T409/304424
摘要： An outer member and an inner member constituting a wheel bearing device are assembled and the brake rotor is fixed to the hub ring of the inner member. In this state, the pad slide surfaces of the brake rotor are lathed with the reference provided by a wheel pilot end surface. Alternatively, the wheel pilot end surface of the hub ring by chucking the knuckle pilot of the outer member with the wheel bearing device put in its assembled state, and the pad slide surfaces of the brake rotor are lathed with the reference provided by the wheel pilot end surface.
摘要翻译：构成车轮轴承装置的外部构件和内部构件组装，制动转子固定在内侧构件的轮毂环上。在这种状态下，制动转子的焊盘滑动面由车轮导向端面提供的基准车床。或者，通过将车轮轴承装置的外部构件的转向节导向器夹紧在其组装状态，轮毂环的轮子前端面，并且制动转子的垫滑动面以车轮导向器端面。

10. 发明申请

US20110146465A1 PROCESSING METHOD FOR BRAKE ROTOR-EQUIPED WHEEL BEARING DEVICES 有权
标题翻译：制动转子轮轴承装置的加工方法
公开(公告)号：US20110146465A1
公开(公告)日：2011-06-23
申请号：US13030711
申请日：2011-02-18
申请人： Kiyotake SHIBATA , Kazunari Yamamoto , Kazuhisa Shigeoka , Taku Nishiki , Kazuo Komori , Takao Maeda
发明人： Kiyotake SHIBATA , Kazunari Yamamoto , Kazuhisa Shigeoka , Taku Nishiki , Kazuo Komori , Takao Maeda
IPC分类号： B23B3/00
CPC分类号： B23B5/02 , B23P15/003 , B60B27/0005 , B60B27/0026 , B60B27/0094 , Y10T29/49535 , Y10T29/49536 , Y10T29/49696 , Y10T29/4984 , Y10T29/49995 , Y10T29/53648 , Y10T82/10 , Y10T82/21 , Y10T82/2585 , Y10T409/303808 , Y10T409/304424
摘要： An outer member and an inner member constituting a wheel bearing device are assembled and the brake rotor is fixed to the hub ring of the inner member. In this state, the pad slide surfaces of the brake rotor are lathed with the reference provided by a wheel pilot end surface. Alternatively, the wheel pilot end surface of the hub ring by chucking the knuckle pilot of the outer member with the wheel bearing device put in its assembled state, and the pad slide surfaces of the brake rotor are lathed with the reference provided by the wheel pilot end surface.
摘要翻译：构成车轮轴承装置的外部构件和内部构件组装，制动转子固定在内侧构件的轮毂环上。在这种状态下，制动转子的焊盘滑动面由车轮导向端面提供的基准车床。或者，通过将车轮轴承装置的外部构件的转向节导向器夹紧在其组装状态，轮毂环的轮子前端面，并且制动转子的衬垫滑动面以车轮导向器端面。

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