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1. 发明授权

US5643834A Process for manufacturing a semiconductor substrate comprising laminated copper, silicon oxide and silicon nitride layers 失效
标题翻译：包括层叠铜，氧化硅和氮化硅层的半导体衬底的制造方法
公开(公告)号：US5643834A
公开(公告)日：1997-07-01
申请号：US450406
申请日：1995-05-25
申请人： Keizo Harada , Takao Maeda , Takatoshi Takikawa , Shunsuke Ban , Shosaku Yamanaka
发明人： Keizo Harada , Takao Maeda , Takatoshi Takikawa , Shunsuke Ban , Shosaku Yamanaka
IPC分类号： H01L23/12 , H01L21/48 , H01L23/14 , H01L23/495 , H05K1/05 , H01L21/56 , H01L21/58 , H01L21/60
CPC分类号： H01L24/49 , H01L21/4835 , H01L23/142 , H01L23/49531 , H01L23/49558 , H01L23/49586 , H01L23/49589 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/4903 , H01L2224/49051 , H01L2224/4911 , H01L2224/49113 , H01L2224/49433 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H01L2924/351 , Y10S438/938
摘要： A process for manufacturing a plastic package type semiconductor device composed of a rolled metal substrate made of copper or copper alloy and an insulating film formed on the surface of the substrate. The film may be a single-layer film made of silicon oxynitride or a composite film formed by laminating a silicon oxide layer and a silicon oxynitride layer (or a silicon nitride layer). A semiconductor element is mounted on the film or on the exposed surface of the substrate. Other passive elements are provided on the film. After connecting these elements with bonding wires, the entire device is sealed in a resin molding. This device is thus free of cracks due to difference in thermal expansion between the film and the substrate, or peeling due to moisture absorption.
摘要翻译：一种由铜或铜合金制成的轧制金属基板和形成在基板表面上的绝缘膜构成的塑料封装型半导体器件的制造方法。该膜可以是由氮氧化硅制成的单层膜或通过层叠氧化硅层和氮氧化硅层（或氮化硅层）而形成的复合膜。半导体元件安装在薄膜上或基板的暴露表面上。其他无源元件设置在胶片上。在将这些元件与接合线连接之后，整个器件被密封在树脂模塑中。因此，由于膜和基板之间的热膨胀差异，或者由于吸湿而剥离，因此该装置无裂纹。

2. 发明授权

US5455453A Plastic package type semiconductor device having a rolled metal substrate 失效
标题翻译：具有轧制金属基板的塑料封装型半导体器件
公开(公告)号：US5455453A
公开(公告)日：1995-10-03
申请号：US907229
申请日：1992-07-01
申请人： Keizo Harada , Takao Maeda , Takatoshi Takikawa , Shunsuke Ban , Shosaku Yamanaka
发明人： Keizo Harada , Takao Maeda , Takatoshi Takikawa , Shunsuke Ban , Shosaku Yamanaka
IPC分类号： H01L23/12 , H01L21/48 , H01L23/14 , H01L23/495 , H05K1/05 , H01L23/48 , H01L29/44 , H01L29/52 , H01L29/60
CPC分类号： H01L24/49 , H01L21/4835 , H01L23/142 , H01L23/49531 , H01L23/49558 , H01L23/49586 , H01L23/49589 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/4903 , H01L2224/49051 , H01L2224/4911 , H01L2224/49113 , H01L2224/49433 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H01L2924/351 , Y10S438/938
摘要： A plastic package type semiconductor device is composed of a rolled metal substrate made of copper or copper alloy and an insulating film formed on the surface of the substrate. The film may be a single-layer film made of silicon oxynitride or a composite film formed by laminating a silicon oxide layer and a silicon oxynitride layer (or a silicon nitride layer). A semiconductor element is mounted on the film or on the exposed surface of the substrate. Other passive elements are provided on the film. After connecting these elements with bonding wires, the entire device is sealed in a resin molding. This device is thus free of cracks due to difference in thermal expansion between the film and the substrate, or peeling due to moisture absorption.
摘要翻译：塑料封装型半导体器件由铜或铜合金制成的轧制金属衬底和形成在衬底表面上的绝缘膜组成。该膜可以是由氮氧化硅制成的单层膜或通过层叠氧化硅层和氮氧化硅层（或氮化硅层）而形成的复合膜。半导体元件安装在薄膜上或基板的暴露表面上。其他无源元件设置在胶片上。在将这些元件与接合线连接之后，整个器件被密封在树脂模塑中。因此，由于膜和基板之间的热膨胀差异，或者由于吸湿而剥离，因此该装置无裂纹。

3. 发明授权

US5369220A Wiring board having laminated wiring patterns 失效
标题翻译：具有叠层布线图案的布线板
公开(公告)号：US5369220A
公开(公告)日：1994-11-29
申请号：US949474
申请日：1992-10-23
申请人： Keizo Harada , Takatoshi Takikawa , Takao Maeda , Shunsuke Ban , Shosaku Yamanaka
发明人： Keizo Harada , Takatoshi Takikawa , Takao Maeda , Shunsuke Ban , Shosaku Yamanaka
IPC分类号： H01L23/14 , H01L23/495 , H01L23/498 , H05K1/05 , H01L39/02 , H01L23/48 , H01L29/46 , H01L29/62
CPC分类号： H05K1/053 , H01L23/142 , H01L23/49517 , H01L23/49531 , H01L23/49866 , H01L24/49 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4903 , H01L2224/49051 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01327 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H05K2201/0179 , H05K2201/0317
摘要： A wiring board has a wiring circuit which is reliable and which can be easily miniaturized, and used for the production of a highly integrated, lighter, thinner, shorter, smaller and low-cost semiconductor device. This wiring board can be sealed in a plastic package. The wiring board has a metal plate and a thin-film dielectric layer formed on the surface of the metal plate. A semiconductor device is mounted on the surface of the dielectric layer or the exposed surface of the metal plate. Film wirings are formed on the dielectric layer. Each film wiring is in the form of a laminate formed by laminating, by vapor phase deposition or by plating, a an aluminum conductive layer, an adhesive layer of chromium, titanium or a laminate thereof, a diffusion barrier layer of nickel, copper or a laminate thereof, and a corrosion-preventive and wire bonding layer of gold. Such wirings may alternatively be in the form of a laminate formed by laminating an adhesive layer of chromium, aluminum, titanium or a laminate comprising at least two of such materials, a copper conductive layer, and a gold layer, or in the form of a laminate formed by laminating an aluminum conductive layer, a barrier layer of nickel, and a gold layer. Since the film wirings can be miniaturized easily, the density of the wirings can be increased. Also, since the wirings are made of aluminum or copper, they are inexpensive.
摘要翻译： PCT No.PCT / JP92 / 00198 Sec。 371日期：1992年10月23日 102（e）日期1992年10月23日PCT提交1992年2月24日PCT公布。公开号WO92 / 15117 日期：1992年9月3日。线路板具有可靠的并且可以容易地小型化的布线电路，并且用于生产高度集成，更轻，更薄，更短，更小和更低成本的半导体器件。该接线板可以用塑料封装密封。布线板具有形成在金属板表面上的金属板和薄膜电介质层。半导体器件安装在电介质层的表面或金属板的暴露表面上。在电介质层上形成膜布线。每个薄膜布线是通过气相沉积或电镀层压铝，导电层，铬，钛或其层压体的粘合剂层，镍，铜或铜的扩散阻挡层而形成的层压体层压板，以及金的防腐蚀和引线接合层。这种布线也可以是通过层压铬，铝，钛或包含这些材料中的至少两种的层压体，铜导电层和金层，或者以通过层叠铝导电层，镍的阻挡层和金层形成的层压体。由于薄膜布线可以容易地小型化，所以可以提高布线的密度。此外，由于布线由铝或铜制成，所以价格便宜。

4. 发明授权

US5556807A Advance multilayer molded plastic package using mesic technology 失效
标题翻译：使用mesic技术推进多层成型塑料包装
公开(公告)号：US5556807A
公开(公告)日：1996-09-17
申请号：US140070
申请日：1994-06-14
申请人： Bidyut K. Bhattacharyya , Debendra Mallik , Syunsuke Ban , Takatoshi Takikawa , Shosaku Yamanaka
发明人： Bidyut K. Bhattacharyya , Debendra Mallik , Syunsuke Ban , Takatoshi Takikawa , Shosaku Yamanaka
IPC分类号： C23C14/06 , C23C14/14 , H01L23/485 , H01L23/495 , H01L23/50 , H01L23/64 , H01L21/60
CPC分类号： H01L23/495 , H01L23/49527 , H01L23/49534 , H01L23/49537 , H01L23/49589 , H01L23/642 , H01L23/647 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/49109 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01082 , H01L2924/04953 , H01L2924/10253 , H01L2924/12033 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10S257/904
摘要： A method and resulting structure for constructing an IC package utilizing thin film technology. The package has a bottom conductive plate that has a layer of ceramic vapor deposited onto the plate in a predetermined pattern. Adjacent to the insulative layer of ceramic is a layer of conductive metal vapor deposited onto the ceramic. The layer of metal can be laid down onto the ceramic in a predetermined pattern to create a power plane, a plurality of signal lines, or a combination of power planes and signal lines. On top of the layer of conductive material is a lead frame separated by a layer of insulative polyimide material. The polyimide material has a plurality of holes filled with a conductive material, which electrically couple the layer of conductive material with the leads of the lead frame. The power and ground pads of the integrated circuit are connected to the layer of vapor deposited conductive material and conductive plate, which are also coupled to the corresponding leads of the lead frame, thereby connecting the IC to the leads of the lead frame. The signal pads of the IC are connected to the lead frame and/or signal lines formed within the layer of vapor deposited conductive material. The IC and attached circuit package can then be encapsulated in a plastic shell.
摘要翻译： PCT No.PCT / US93 / 01481 Sec。 371日期：1994年6月14日 102（e）日期1994年6月14日PCT提交1993年2月18日PCT公布。 WO93 / 16492 PCT出版物日期1993年9月19日利用薄膜技术构建IC封装的方法和结果。封装具有底部导电板，其具有以预定图案沉积在板上的陶瓷气相层。与陶瓷绝缘层相邻的是沉积在陶瓷上的导电金属蒸气层。可以以预定图案将金属层放置在陶瓷上以产生电力平面，多条信号线或电力平面和信号线的组合。在导电材料层的顶部是由绝缘聚酰亚胺材料层隔开的引线框架。聚酰亚胺材料具有填充有导电材料的多个孔，其将导电材料层与引线框架的引线电耦合。集成电路的电源和接地焊盘连接到蒸镀导电材料层和导电板，该层还与引线框架的相应引线耦合，从而将IC连接到引线框的引线。 IC的信号焊盘连接到形成在蒸镀导电材料层内的引线框和/或信号线。然后将IC和附接电路封装封装在塑料外壳中。

5. 发明授权

US5965298A Electrode plate for battery and process for producing the same 失效
标题翻译：电池用电极板及其制造方法
公开(公告)号：US5965298A
公开(公告)日：1999-10-12
申请号：US991787
申请日：1997-12-12
申请人： Keizo Harada , Masayuki Ishii , Kenichi Watanabe , Shosaku Yamanaka
发明人： Keizo Harada , Masayuki Ishii , Kenichi Watanabe , Shosaku Yamanaka
IPC分类号： B22F3/11 , B22F7/00 , H01M2/26 , H01M4/52 , H01M4/66 , H01M4/80 , H01M4/82 , H01M10/30 , H01M10/34 , H01M4/70
CPC分类号： H01M4/667 , B22F3/1109 , B22F3/1121 , B22F3/1137 , B22F7/002 , H01M2/26 , H01M4/661 , H01M4/80 , H01M4/82 , B22F2998/10 , B22F2999/00 , H01M10/30 , H01M10/345 , H01M2300/0014 , H01M2300/0025 , H01M4/52 , H01M4/668 , H01M4/808
摘要： An electrode plate for a battery is constructed from a porous metal body having at least one low-porosity part selectively arranged therein. A porous resin core is coated with a paste having a metal component, passed through rolls provided with at least one recess to thereby form at least one low-porosity part and sintered. The resultant electrode plate for battery is not only ensured with respect to strength and capable of improving battery performance but also advantageous in that it is available at lowered cost and free from apprehension of supply of raw materials.
摘要翻译：用于电池的电极板由多孔金属体构成，该多孔金属体具有选择性地布置在其中的至少一个低孔隙率部分。多孔树脂芯被涂有具有金属成分的糊料，通过设置有至少一个凹部的辊，从而形成至少一个低孔隙率部件并烧结。所得到的电池用电极板不仅能够确保强度，而且能够提高电池性能，而且还可以降低成本且不受原料供应的担心。

6. 发明授权

US6103319A Battery electrode substrate and process for producing the same 有权
公开(公告)号：US6103319A
公开(公告)日：2000-08-15
申请号：US135953
申请日：1998-08-18
申请人： Keizo Harada , Kenichi Watanabe , Shosaku Yamanaka , Kiyoshi Hayashi , Nobuyasu Morishita , Hiroki Takeshima , Hideo Kaiya , Munehisa Ikoma
发明人： Keizo Harada , Kenichi Watanabe , Shosaku Yamanaka , Kiyoshi Hayashi , Nobuyasu Morishita , Hiroki Takeshima , Hideo Kaiya , Munehisa Ikoma
IPC分类号： B22F3/11 , H01M4/66 , H01M4/80 , H01M10/30 , B05D3/02 , B05D3/04
CPC分类号： H01M4/801 , B22F3/1137 , B22F3/1143 , H01M4/667 , H01M4/80 , H01M4/808 , B22F2998/00 , B22F2998/10 , B22F2999/00 , H01M10/30 , H01M2300/0014 , H01M4/661
摘要： A battery electrode substrate which is constituted of a porous metallic body structure having communicating pores at a porosity of at least 90% and an Fe/Ni multilayer structure wherein the skeletal portion of the porous metallic body is composed mainly of Fe and has an Ni covering layer on the surface thereof while pores communicating with the inside and outside of Fe skeletal portion exist in the Fe skeletal portion and the inside of the pores is covered with Ni. The electrode substrate is produced by applying an iron oxide powder of at most 20 .mu.m in an average particle size on a porous resin core body; heat treating the core to remove an organic resin component while simultaneously sintering Fe to obtain a porous Fe body; and then covering the Fe skeletal portion with Ni by electroplating. In this process, the iron oxide can be used in combination with carbon powder. Further, a nickel porous sintered body can also be produced using nickel oxide in place of iron oxide.

7. 发明授权

US6071650A Battery electrode substrate and process for producing the same 有权
标题翻译：电池电极基板及其制造方法
公开(公告)号：US6071650A
公开(公告)日：2000-06-06
申请号：US135956
申请日：1998-08-18
申请人： Keizo Harada , Kenichi Watanabe , Shosaku Yamanaka
发明人： Keizo Harada , Kenichi Watanabe , Shosaku Yamanaka
IPC分类号： B22F3/11 , H01M4/66 , H01M4/80 , H01M10/30
CPC分类号： H01M4/801 , B22F3/1137 , B22F3/1143 , H01M4/667 , H01M4/80 , H01M4/808 , B22F2998/00 , B22F2998/10 , B22F2999/00 , H01M10/30 , H01M2300/0014 , H01M4/661
摘要： A battery electrode substrate which is constituted of a porous metallic body structure having communicating pores at a porosity of at least 90% and an Fe/Ni multilayer structure wherein the skeletal portion of the porous metallic body is composed mainly of Fe and has an Ni covering layer on the surface thereof while pores communicating with the inside and outside of Fe skeletal portion exist in the Fe skeletal portion and the inside of the pores is covered with Ni. The electrode substrate is produced by applying an iron oxide powder of at most 20 .mu.m in an average particle size on a porous resin core body; heat treating the core to remove an organic resin component while simultaneously sintering Fe to obtain a porous Fe body; and then covering the Fe skeletal portion with Ni by electroplating. In this process, the iron oxide can be used in combination with carbon powder. Further, a nickel porous sintered body can also be produced using nickel oxide in place of iron oxide.
摘要翻译：一种电池用电极基板，其特征在于，具有孔隙率为90％以上的连通孔的多孔金属体结构体和Fe / Ni多层结构体，其中，所述多孔金属体的骨架部分主要由Fe构成，并具有Ni覆盖层在Fe骨架部分中存在与Fe骨架部分的内部和外部连通的孔，并且用Ni覆盖孔的内部。通过在多孔树脂芯体上涂布平均粒径为20μm以下的氧化铁粉末来制造电极基板，热处理芯以除去有机树脂组分，同时同时烧结Fe以获得多孔Fe体; 然后通过电镀用Ni覆盖Fe骨架部分。在该方法中，氧化铁可与碳粉末组合使用。此外，也可以使用氧化镍代替氧化铁来制造镍多孔烧结体。

8. 发明授权

US5672411A Insulating boards and method of manufacturing the same 失效
标题翻译：绝缘板及其制造方法
公开(公告)号：US5672411A
公开(公告)日：1997-09-30
申请号：US352905
申请日：1994-12-09
申请人： Keizo Harada , Kenichi Watanabe , Shosaku Yamanaka
发明人： Keizo Harada , Kenichi Watanabe , Shosaku Yamanaka
IPC分类号： C23C16/34 , C23C16/40 , C23C16/50 , H01L21/31 , H01L21/316 , H01L21/00
CPC分类号： C23C16/402 , C23C16/345 , Y10T428/24355 , Y10T428/24479 , Y10T428/24521
摘要： An insulating board having a substrate, and an insulating film of silicon oxide formed on the surface of the substrate by vapor phase deposition. In forming the film, the forming conditions are controlled so that the film is formed in an overhang or conformal shape at initial stage and then in a flow shape. Thereby, both good adhesion and excellent insulation properties are achieved.
摘要翻译：具有基板的绝缘板和通过气相沉积在基板的表面上形成的氧化硅绝缘膜。在形成薄膜时，控制成形条件，使得薄膜在初始阶段以流动形状形成为悬垂或共形形状。由此，实现了良好的附着力和优异的绝缘性。

9. 发明授权

US5733684A Electrode substrate for battery and process for preparing the same 失效
标题翻译：电池用电极基板及其制备方法
公开(公告)号：US5733684A
公开(公告)日：1998-03-31
申请号：US652090
申请日：1996-05-23
申请人： Keizo Harada , Kenichi Watanabe , Shosaku Yamanaka
发明人： Keizo Harada , Kenichi Watanabe , Shosaku Yamanaka
IPC分类号： H01M4/66 , H01M4/80 , H01M4/32
CPC分类号： H01M4/80 , H01M4/808
摘要： An electrode substrate, for a battery, as a support for an active material used in a collector for a battery, comprising a metallic porous structure possessing interconnecting pores with a porosity of not less than 90% and a number of pores per cm of not less than 10 and having an Fe/Ni two-layer structure wherein Fe constitutes the interior of a skeleton of a porous body constituting the porous structure with the surface portion of the skeleton coated with Ni. Preferably, Fe constituting the interior of the skeleton has a purity of not less than 98% by weight, and the thickness of the nickel coating layer having an Fe content of not more than 10% by weight is 0.1 to 10 .mu.m. The ratio of thickness of the Fe-diffused layer to the thickness of the Ni coating layer is regulated to not more than 0.65 by forming a metallic porous body of Fe using a porous resin as a substrate, plating the metallic porous body with Ni, heat treating the plated body.
摘要翻译：一种电池用电极基板，作为用于电池用集电体的活性物质的支持体，其特征在于，具有金属多孔结构体，该金属多孔结构体具有孔隙率不小于90％的孔隙率和不小于几厘米的孔隙数并且具有Fe / Ni两层结构，其中Fe构成构成多孔结构的骨架的内部，其中骨架的表面部分涂覆有Ni。优选构成骨架内部的Fe的纯度为98重量％以上，Fe含量为10重量％以下的镍被膜的厚度为0.1〜10μm。通过使用多孔树脂作为基材形成Fe的金属多孔体，将Ni扩散层的厚度与Ni被覆层的厚度的比例调整为0.65以下，将金属多孔体镀Ni 处理电镀体。

10. 发明授权

US5597665A Porous metal body, process for producing the same and battery plate formed therefrom 失效
标题翻译：多孔金属体，其制造方法和由其形成的电池板
公开(公告)号：US5597665A
公开(公告)日：1997-01-28
申请号：US544098
申请日：1995-10-17
申请人： Keizo Harada , Masayuki Ishii , Shosaku Yamanaka
发明人： Keizo Harada , Masayuki Ishii , Shosaku Yamanaka
IPC分类号： B01D39/20 , B22F3/11 , B22F5/00 , C22C1/08 , C23C14/20 , H01M4/02 , H01M4/66 , H01M4/80 , H01M6/16
CPC分类号： B22F3/114 , B22F3/1103 , C23C14/20 , H01M4/02 , H01M4/80 , B22F2998/00 , B22F2998/10 , H01M4/661 , H01M6/16 , Y10T29/10 , Y10T428/12021
摘要： A porous metal body is produced by forming a coating film of one or more metal capable of forming a eutectic alloy at temperatures not higher than the melting point of Al on a foamed resin skeleton having a three-dimensional network structure according to the plating, vapor deposition, sputtering, CVD or other vapor phase process, impregnating the foamed resin having the coating film formed thereon with a paste comprising powdery Al, a binder and an organic solvent as principal components to thereby obtain a paste-coated composite and heating the composite at a temperature ranging from 550.degree. C. to 750.degree. C. in a nonoxidizing atmosphere. The resultant porous metal body has a large effective surface area and a high space utilization factor and exhibits excellent performance in uses in filters and battery plates.
摘要翻译：通过在具有三维网状结构的发泡树脂骨架上根据电镀，蒸气形成可以在不高于Al的熔点的温度下形成共晶合金的一种或多种能够形成共晶合金的涂层的多孔金属体沉积，溅射，CVD或其它气相工艺，将其上形成有涂膜的发泡树脂浸渍在包含粉末状Al，粘合剂和有机溶剂的浆料作为主要成分，从而获得糊涂复合材料，并将复合材料加热在非氧化气氛中的温度为550℃至750℃。所得的多孔金属体具有大的有效表面积和高的空间利用率，并且在过滤器和电池板中的用途中表现出优异的性能。

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