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1. 发明申请

US20100325913A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基板加工方法和基板加工装置
公开(公告)号：US20100325913A1
公开(公告)日：2010-12-30
申请号：US12821456
申请日：2010-06-23
申请人： Xinming WANG , Kazuo Yamauchi , Akira Kodera , Tsukuru Suzuki , Yasushi Toma , Takayuki Saito , Hirokuni Hiyama
发明人： Xinming WANG , Kazuo Yamauchi , Akira Kodera , Tsukuru Suzuki , Yasushi Toma , Takayuki Saito , Hirokuni Hiyama
IPC分类号： F26B7/00
CPC分类号： F26B5/12 , F26B21/004 , H01L21/67028
摘要： A substrate processing method dose not use or only use the least possible amount of an organic solvent, and can quickly and completely remove a liquid from a wet substrate surface without allowing the liquid to remain on the substrate surface. The substrate processing method for drying a substrate surface which is wet with a liquid, includes: removing the liquid from the substrate surface and sucking the liquid together with its surrounding gas into a gas/liquid suction nozzle, disposed opposite the substrate surface, while relatively moving the gas/liquid suction nozzle and the substrate parallel to each other; and blowing a dry gas from a dry gas supply nozzle, disposed opposite the substrate surface, toward that area of the substrate surface from which the liquid has been removed while relatively moving the dry gas supply nozzle and the substrate parallel to each other.
摘要翻译：不使用或仅使用尽可能少量有机溶剂的底物处理方法，并且可以快速且完全地从湿底物表面除去液体，而不会使液体残留在基材表面上。用于干燥被液体湿润的基板表面的基板处理方法包括：从基板表面去除液体并将其周围的气体与其一起吸入与基板表面相对设置的气/液吸嘴中，同时相对使气体/液体吸嘴和基板彼此平行移动; 并且将相对于基板表面设置的干燥气体供给喷嘴的干燥气体吹向基板表面的已被除去液体的区域，同时使干燥气体供给喷嘴和基板彼此平行地相对移动。

2. 发明授权

US07527723B2 Electrolytic processing apparatus and electrolytic processing method 失效
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US07527723B2
公开(公告)日：2009-05-05
申请号：US11035373
申请日：2005-01-14
申请人： Itsuki Kobata , Yutaka Wada , Hirokuni Hiyama , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Akira Kodera
发明人： Itsuki Kobata , Yutaka Wada , Hirokuni Hiyama , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Akira Kodera
IPC分类号： B23H7/36 , B23H1/10 , B23H3/10
CPC分类号： H01L21/32115 , B23H5/08 , B24B37/042 , B24B37/046 , C25F1/00 , C25F3/00 , H01L21/7684
摘要： An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation of a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with but close to the processing electrode at a distance of not more than 10 μm.
摘要翻译：电解处理装置可以提高水的解离反应的效率，并且有效地进行电解处理，并且可以消除对离子交换剂的变化操作的需要。电解处理装置包括：处理电极和馈电电极; 液体供应部分，用于在工件和处理电极和馈电电极中的至少一个之间提供含有离子交换材料的液体; 用于在处理电极和馈电电极之间施加电压的电源; 以及用于相对于彼此移动所述工件和所述处理电极和所述馈送电极中的至少一个的驱动部分; 其中，对工件的电解处理在不超过10um的距离保持工件不与处理电极接触而靠近处理电极的同时进行。

3. 发明申请

US20090078583A1 Electrochemical mechanical polishing method and electrochemical mechanical polishing apparatus 审中-公开
标题翻译：电化学机械抛光方法和电化学机械抛光装置
公开(公告)号：US20090078583A1
公开(公告)日：2009-03-26
申请号：US12007956
申请日：2008-01-17
申请人： Itsuki Kobata , Akira Kodera , Yasushi Toma , Tsukuru Suzuki , Takayuki Saito , Yuji Makita , Hirokuni Hiyama
发明人： Itsuki Kobata , Akira Kodera , Yasushi Toma , Tsukuru Suzuki , Takayuki Saito , Yuji Makita , Hirokuni Hiyama
IPC分类号： B23H5/06 , B23H11/00 , C25F3/16 , C25F7/00
CPC分类号： C25F3/00 , B23H5/08 , B24B37/013 , B24B49/105 , H01L21/32125
摘要： A composite electrolytic processing method makes it possible to remove a conductive film without leaving it in an electrically-insulated state on an underlying barrier film, thereby exposing the barrier film. The electrochemical mechanical polishing method includes: applying a voltage between a first electrode connected to one pole of a power source and a second electrode, connected to the other pole of the power source, for feeding electricity to a conductive film of a polishing object; filling an electrolytic liquid into a space between the first electrode and the conductive film of the polishing object; and pressing and rubbing the conductive film against a polishing surface of a polishing pad to polish the conductive film in such a manner that a barrier film underlying the conductive film becomes gradually exposed from the center toward the periphery of the polishing object.
摘要翻译：复合电解处理方法使得可以在导电膜上去除导电膜而不会使其在下面的阻挡膜上处于电绝缘状态，从而暴露阻挡膜。电化学机械抛光方法包括：在连接到电源的一个极的第一电极和连接到电源的另一个极的第二电极之间施加电压，用于向抛光对象的导电膜供电; 将电解液体填充到研磨对象物的第一电极和导电膜之间的空间内; 并且将导电膜按压并摩擦抛光垫的抛光表面以使导电膜抛光，使得导电膜下面的阻挡膜从研磨对象的中心逐渐露出。

4. 发明申请

US20050155868A1 Electrolytic processing apparatus and electrolytic processing method 失效
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20050155868A1
公开(公告)日：2005-07-21
申请号：US11035373
申请日：2005-01-14
申请人： Itsuki Kobata , Yutaka Wada , Hirokuni Hiyama , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Akira Kodera
发明人： Itsuki Kobata , Yutaka Wada , Hirokuni Hiyama , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Akira Kodera
IPC分类号： B23H5/08 , B24B37/04 , C25F1/00 , C25F3/00 , H01L21/321 , H01L21/768 , B23H3/00
CPC分类号： H01L21/32115 , B23H5/08 , B24B37/042 , B24B37/046 , C25F1/00 , C25F3/00 , H01L21/7684
摘要： An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation for a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with and close to the processing electrode at a distance of not more than 10 μm.
摘要翻译：电解处理装置可以提高水的解离反应的效率，并且有效地进行电解处理，并且可以消除对于改变离子交换剂的操作的需要。电解处理装置包括：处理电极和馈电电极; 液体供应部分，用于在工件和处理电极和馈电电极中的至少一个之间提供含有离子交换材料的液体; 用于在处理电极和馈电电极之间施加电压的电源; 以及用于相对于彼此移动所述工件和所述处理电极和所述馈送电极中的至少一个的驱动部分; 其中进行工件的电解处理，同时保持工件不超过10um的距离与处理电极接触并靠近处理电极。

5. 发明申请

US20080171440A1 Pre-polishing treatment solution for interconnect substrate, polishing method, and method and apparatus for manufacturing interconnect substrate 审中-公开
标题翻译：用于互连基板的预抛光处理溶液，抛光方法以及用于制造互连基板的方法和装置
公开(公告)号：US20080171440A1
公开(公告)日：2008-07-17
申请号：US12007786
申请日：2008-01-15
申请人： Akira Kodera , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Itsuki Kobata
发明人： Akira Kodera , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Itsuki Kobata
IPC分类号： H01L21/304 , C23F11/14 , B23H3/00
CPC分类号： H01L21/3212 , C09G1/04
摘要： A pre-polishing treatment solution has a prominent corrosion inhibiting effect, and can be used in pre-polishing treatments for interconnect substrates. The pre-polishing treatment solution comprises a corrosion inhibitor dissolved in an organic solvent.
摘要翻译：预抛光处理溶液具有显着的腐蚀抑制作用，可用于互连基板的预抛光处理。预抛光处理溶液包含溶解在有机溶剂中的腐蚀抑制剂。

6. 发明申请

US20080188162A1 Electrochemical mechanical polishing apparatus conditioning method, and conditioning solution 审中-公开
标题翻译：电化学机械抛光装置调理方法，调理溶液
公开(公告)号：US20080188162A1
公开(公告)日：2008-08-07
申请号：US12068300
申请日：2008-02-05
申请人： Itsuki Kobata , Yasushi Toma , Akira Kodera , Tsukuru Suzuki , Yuji Makita , Takayuki Saito
发明人： Itsuki Kobata , Yasushi Toma , Akira Kodera , Tsukuru Suzuki , Yuji Makita , Takayuki Saito
IPC分类号： B24B49/00
CPC分类号： B24B53/017 , B23H5/08 , B24B37/042 , B24B37/046 , B24B49/10 , H01L21/32125 , H01L21/7684
摘要： An electrochemical mechanical polishing apparatus is for use in polishing of a conductive material (e.g., metal) on a surface of a substrate by combination of electrochemical action and mechanical action. This apparatus includes a polishing table having divided electrodes and adapted to hold a polishing pad having a polishing surface, a polishing head adapted to hold a workpiece having a conductive film and to press the workpiece against the polishing surface, a second electrode for supplying an electric current to the conductive film, an electrolytic-solution supply section for supplying an electrolytic solution to the polishing surface, a detecting section adapted to detect a signal corresponding to a thickness of the conductive film, a variable resistance unit having the same number of variable resistors as the number of divided electrodes, a moving mechanism for providing relative movement between the workpiece and the polishing surface, and a control section adapted to control each of the variable resistors based on the signal from the detecting section.
摘要翻译：电化学机械抛光装置用于通过电化学作用和机械作用的组合在基底表面上抛光导电材料（例如金属）。该装置包括具有分割电极并且适于保持具有抛光表面的抛光垫的抛光台，用于保持具有导电膜的工件并将工件压靠抛光表面的抛光头，用于提供电电流至导电膜的电解液供应部分，用于向研磨表面供应电解液的电解溶液供应部分，用于检测对应于导电膜厚度的信号的检测部分，具有相同数目的可变电阻器的可变电阻单元作为分割电极的数量，用于在工件和抛光表面之间提供相对移动的移动机构，以及适于基于来自检测部分的信号来控制每个可变电阻器的控制部分。

7. 发明申请

US20070187257A1 Electrolytic processing apparatus and electrolytic processing method 审中-公开
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20070187257A1
公开(公告)日：2007-08-16
申请号：US10592673
申请日：2005-03-16
申请人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Itsuki Kobata , Kazuto Hirokawa , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Akira Kodera
发明人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Itsuki Kobata , Kazuto Hirokawa , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Akira Kodera
IPC分类号： B23H7/00
CPC分类号： B24B37/04 , B23H5/08 , B24B53/017 , C25F3/02 , C25F7/00 , H01L21/32125
摘要： An electrolytic processing apparatus can maintain a difference in electric resistance between a recessed portion and a raised portion in the surface of a workpiece, thereby providing a processed surface with improved flatness. The electrolytic processing apparatus including: a processing electrode capable of bringing into contact with or closing to a workpiece; a feeding electrode for feeding electricity to the workpiece; a contact member disposed between the workpiece and at least one of the processing electrode and the feeding electrode, the degree of deformation of said contact member by a contact load applied from the workpiece being smal
摘要翻译：电解处理装置可以保持工件表面中的凹部和凸起部之间的电阻差，从而提供具有改善的平坦度的加工表面。电解处理装置包括：能够与工件接触或闭合的处理电极; 用于向工件供电的供电电极; 设置在工件与处理电极和供电电极中的至少一个之间的接触构件，通过从工件施加的接触载荷为微小的所述接触构件的变形程度为小

8. 发明申请

US20080067077A1 Electrolytic liquid for electrolytic polishing and electrolytic polishing method 审中-公开
标题翻译：电解液用于电解抛光和电解抛光法
公开(公告)号：US20080067077A1
公开(公告)日：2008-03-20
申请号：US11896251
申请日：2007-08-30
申请人： Akira Kodera , Yasushi Toma , Tsukuru Suzuki , Takayuki Saito , Itsuki Kobata
发明人： Akira Kodera , Yasushi Toma , Tsukuru Suzuki , Takayuki Saito , Itsuki Kobata
IPC分类号： C25F3/16 , B23H3/00
CPC分类号： B23H5/08 , B23H5/12 , C25F3/16 , C25F3/22
摘要： An electrolytic liquid is used for electrolytic polishing which can provide a processed surface having high flattening characteristics with a low voltage applied while ensuring a higher processing rate for an conductive material, and can remove an unnecessary conductive material and expose a barrier film without causing dishing, erosion, or etching at the interface between the barrier film and a metal (conductive material). The electrolytic liquid for use in electrolytic polishing of a surface conductive material of a workpiece comprises an aqueous solution containing at least one organic acid or its salt, at least one strong acid having a sulfonic acid group, a corrosion inhibitor and a water-soluble polymeric compound.
摘要翻译：一种电解液用于电解抛光，其可以在确保更高的导电材料的加工速率的同时，提供具有高平坦化特性的加工表面，同时确保更高的导电材料的加工速率，并且可以去除不必要的导电材料并暴露阻挡膜而不引起凹陷，侵蚀或蚀刻在阻挡膜和金属（导电材料）之间的界面处。用于工件表面导电材料的电解抛光的电解液包括含有至少一种有机酸或其盐的水溶液，至少一种具有磺酸基的强酸，缓蚀剂和水溶性聚合物复合。

9. 发明申请

US20090095637A1 Electrochemical polishing method and polishing method 审中-公开
标题翻译：电化学抛光方法和抛光方法
公开(公告)号：US20090095637A1
公开(公告)日：2009-04-16
申请号：US12285549
申请日：2008-10-08
申请人： Yasushi Toma , Akira Kodera , Hirokuni Hiyama
发明人： Yasushi Toma , Akira Kodera , Hirokuni Hiyama
IPC分类号： C25F3/00
CPC分类号： B23H5/08 , H01L21/32125
摘要： The present invention provides an electrochemical polishing method capable of increasing a polishing speed while preventing excessive polishing, such as dishing or erosion. In the electrochemical polishing method, when a voltage applied to a conductive film formed on the surface of a substrate is increased at a contact surface pressure of 0 between the surface of the substrate and a polishing pad, a voltage at a first change point C that allows a current density to start to decrease after an increase is referred to as a minimum voltage. In addition, when the voltage is increased at a contact surface pressure having a finite value, a voltage at a second change point B that allows the current density to be maintained constant after the decrease is referred to as a maximum voltage. In this case, the surface of the conductive film is polished while maintaining the voltage to be not lower than the minimum voltage and not higher than the maximum voltage. Further, the present invention provides an electrochemical polishing method capable of rapidly removing a conductive film in regions other than a contact plug or wiring line forming region while preventing excessive polishing, such as dishing or erosion. In the electrochemical polishing method, in a step of increasing a voltage, when the voltage is increased at a contact surface pressure of 0, a voltage at a first change point C that allows a current density to start to decrease after an increase is referred to as a threshold voltage, and the voltage is increased such that a voltage in a region in which a barrier film is exposed is higher than the threshold voltage.
摘要翻译：本发明提供一种能够提高抛光速度同时防止过度抛光（如凹陷或侵蚀）的电化学抛光方法。在电化学抛光方法中，当在基板表面上形成的导电膜上施加的电压在基板的表面与抛光垫之间的接触面压力为0时增加时，在第一变化点C处的电压为允许电流密度在增加被称为最小电压之后开始降低。此外，当电压在具有有限值的接触表面压力下增加时，允许电流密度在减小之后保持恒定的第二变化点B处的电压被称为最大电压。在这种情况下，导电膜的表面被抛光，同时保持电压不低于最小电压并且不高于最大电压。此外，本发明提供一种电化学抛光方法，其能够在防止诸如凹陷或侵蚀之类的过度抛光的同时，在接触插塞或布线形成区域以外的区域中快速除去导电膜。在电化学抛光方法中，在增加电压的步骤中，当接触面压力为0时电压升高时，参照电流密度在增加后开始下降的第一变化点C处的电压作为阈值电压，并且增加电压，使得暴露阻挡膜的区域中的电压高于阈值电压。

10. 发明申请

US20090107851A1 Electrolytic polishing method of substrate 审中-公开
标题翻译：基底电解抛光方法
公开(公告)号：US20090107851A1
公开(公告)日：2009-04-30
申请号：US12285615
申请日：2008-10-09
申请人： Akira Kodera , Xinming Wang , Itsuki Kobata , Yasushi Toma
发明人： Akira Kodera , Xinming Wang , Itsuki Kobata , Yasushi Toma
IPC分类号： H01L21/3063 , H01L21/67
CPC分类号： H01L21/32125 , B23H5/08 , C25F3/30
摘要： An electrolytic polishing method of a substrate having a barrier film and an interconnect metal layer on a surface to be processed under the presence of an electrolytic solution, including a barrier film electrolytic polishing process which removes the barrier film by applying a voltage between a cathode and an anode, with the surface to be processed serving as the cathode, and causing relative motion between the surface to be processed and a polishing pad which faces and makes contact with the surface to be processed.
摘要翻译：一种在电解液存在下在待加工表面上具有阻挡膜和互连金属层的基板的电解抛光方法，该方法包括：通过在阴极与阴极之间施加电压来除去阻挡膜的阻挡膜电解抛光工艺; 阳极，待处理的表面用作阴极，并且引起待处理表面与抛光垫之间的相对运动，所述抛光垫面向并与待处理表面接触。

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