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1. 发明申请

US20090078583A1 Electrochemical mechanical polishing method and electrochemical mechanical polishing apparatus 审中-公开
标题翻译：电化学机械抛光方法和电化学机械抛光装置
公开(公告)号：US20090078583A1
公开(公告)日：2009-03-26
申请号：US12007956
申请日：2008-01-17
申请人： Itsuki Kobata , Akira Kodera , Yasushi Toma , Tsukuru Suzuki , Takayuki Saito , Yuji Makita , Hirokuni Hiyama
发明人： Itsuki Kobata , Akira Kodera , Yasushi Toma , Tsukuru Suzuki , Takayuki Saito , Yuji Makita , Hirokuni Hiyama
IPC分类号： B23H5/06 , B23H11/00 , C25F3/16 , C25F7/00
CPC分类号： C25F3/00 , B23H5/08 , B24B37/013 , B24B49/105 , H01L21/32125
摘要： A composite electrolytic processing method makes it possible to remove a conductive film without leaving it in an electrically-insulated state on an underlying barrier film, thereby exposing the barrier film. The electrochemical mechanical polishing method includes: applying a voltage between a first electrode connected to one pole of a power source and a second electrode, connected to the other pole of the power source, for feeding electricity to a conductive film of a polishing object; filling an electrolytic liquid into a space between the first electrode and the conductive film of the polishing object; and pressing and rubbing the conductive film against a polishing surface of a polishing pad to polish the conductive film in such a manner that a barrier film underlying the conductive film becomes gradually exposed from the center toward the periphery of the polishing object.
摘要翻译：复合电解处理方法使得可以在导电膜上去除导电膜而不会使其在下面的阻挡膜上处于电绝缘状态，从而暴露阻挡膜。电化学机械抛光方法包括：在连接到电源的一个极的第一电极和连接到电源的另一个极的第二电极之间施加电压，用于向抛光对象的导电膜供电; 将电解液体填充到研磨对象物的第一电极和导电膜之间的空间内; 并且将导电膜按压并摩擦抛光垫的抛光表面以使导电膜抛光，使得导电膜下面的阻挡膜从研磨对象的中心逐渐露出。

2. 发明申请

US20080188162A1 Electrochemical mechanical polishing apparatus conditioning method, and conditioning solution 审中-公开
标题翻译：电化学机械抛光装置调理方法，调理溶液
公开(公告)号：US20080188162A1
公开(公告)日：2008-08-07
申请号：US12068300
申请日：2008-02-05
申请人： Itsuki Kobata , Yasushi Toma , Akira Kodera , Tsukuru Suzuki , Yuji Makita , Takayuki Saito
发明人： Itsuki Kobata , Yasushi Toma , Akira Kodera , Tsukuru Suzuki , Yuji Makita , Takayuki Saito
IPC分类号： B24B49/00
CPC分类号： B24B53/017 , B23H5/08 , B24B37/042 , B24B37/046 , B24B49/10 , H01L21/32125 , H01L21/7684
摘要： An electrochemical mechanical polishing apparatus is for use in polishing of a conductive material (e.g., metal) on a surface of a substrate by combination of electrochemical action and mechanical action. This apparatus includes a polishing table having divided electrodes and adapted to hold a polishing pad having a polishing surface, a polishing head adapted to hold a workpiece having a conductive film and to press the workpiece against the polishing surface, a second electrode for supplying an electric current to the conductive film, an electrolytic-solution supply section for supplying an electrolytic solution to the polishing surface, a detecting section adapted to detect a signal corresponding to a thickness of the conductive film, a variable resistance unit having the same number of variable resistors as the number of divided electrodes, a moving mechanism for providing relative movement between the workpiece and the polishing surface, and a control section adapted to control each of the variable resistors based on the signal from the detecting section.
摘要翻译：电化学机械抛光装置用于通过电化学作用和机械作用的组合在基底表面上抛光导电材料（例如金属）。该装置包括具有分割电极并且适于保持具有抛光表面的抛光垫的抛光台，用于保持具有导电膜的工件并将工件压靠抛光表面的抛光头，用于提供电电流至导电膜的电解液供应部分，用于向研磨表面供应电解液的电解溶液供应部分，用于检测对应于导电膜厚度的信号的检测部分，具有相同数目的可变电阻器的可变电阻单元作为分割电极的数量，用于在工件和抛光表面之间提供相对移动的移动机构，以及适于基于来自检测部分的信号来控制每个可变电阻器的控制部分。

3. 发明申请

US20080067077A1 Electrolytic liquid for electrolytic polishing and electrolytic polishing method 审中-公开
标题翻译：电解液用于电解抛光和电解抛光法
公开(公告)号：US20080067077A1
公开(公告)日：2008-03-20
申请号：US11896251
申请日：2007-08-30
申请人： Akira Kodera , Yasushi Toma , Tsukuru Suzuki , Takayuki Saito , Itsuki Kobata
发明人： Akira Kodera , Yasushi Toma , Tsukuru Suzuki , Takayuki Saito , Itsuki Kobata
IPC分类号： C25F3/16 , B23H3/00
CPC分类号： B23H5/08 , B23H5/12 , C25F3/16 , C25F3/22
摘要： An electrolytic liquid is used for electrolytic polishing which can provide a processed surface having high flattening characteristics with a low voltage applied while ensuring a higher processing rate for an conductive material, and can remove an unnecessary conductive material and expose a barrier film without causing dishing, erosion, or etching at the interface between the barrier film and a metal (conductive material). The electrolytic liquid for use in electrolytic polishing of a surface conductive material of a workpiece comprises an aqueous solution containing at least one organic acid or its salt, at least one strong acid having a sulfonic acid group, a corrosion inhibitor and a water-soluble polymeric compound.
摘要翻译：一种电解液用于电解抛光，其可以在确保更高的导电材料的加工速率的同时，提供具有高平坦化特性的加工表面，同时确保更高的导电材料的加工速率，并且可以去除不必要的导电材料并暴露阻挡膜而不引起凹陷，侵蚀或蚀刻在阻挡膜和金属（导电材料）之间的界面处。用于工件表面导电材料的电解抛光的电解液包括含有至少一种有机酸或其盐的水溶液，至少一种具有磺酸基的强酸，缓蚀剂和水溶性聚合物复合。

4. 发明申请

US20050155868A1 Electrolytic processing apparatus and electrolytic processing method 失效
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20050155868A1
公开(公告)日：2005-07-21
申请号：US11035373
申请日：2005-01-14
申请人： Itsuki Kobata , Yutaka Wada , Hirokuni Hiyama , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Akira Kodera
发明人： Itsuki Kobata , Yutaka Wada , Hirokuni Hiyama , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Akira Kodera
IPC分类号： B23H5/08 , B24B37/04 , C25F1/00 , C25F3/00 , H01L21/321 , H01L21/768 , B23H3/00
CPC分类号： H01L21/32115 , B23H5/08 , B24B37/042 , B24B37/046 , C25F1/00 , C25F3/00 , H01L21/7684
摘要： An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation for a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with and close to the processing electrode at a distance of not more than 10 μm.
摘要翻译：电解处理装置可以提高水的解离反应的效率，并且有效地进行电解处理，并且可以消除对于改变离子交换剂的操作的需要。电解处理装置包括：处理电极和馈电电极; 液体供应部分，用于在工件和处理电极和馈电电极中的至少一个之间提供含有离子交换材料的液体; 用于在处理电极和馈电电极之间施加电压的电源; 以及用于相对于彼此移动所述工件和所述处理电极和所述馈送电极中的至少一个的驱动部分; 其中进行工件的电解处理，同时保持工件不超过10um的距离与处理电极接触并靠近处理电极。

5. 发明申请

US20070187257A1 Electrolytic processing apparatus and electrolytic processing method 审中-公开
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20070187257A1
公开(公告)日：2007-08-16
申请号：US10592673
申请日：2005-03-16
申请人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Itsuki Kobata , Kazuto Hirokawa , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Akira Kodera
发明人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Itsuki Kobata , Kazuto Hirokawa , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Akira Kodera
IPC分类号： B23H7/00
CPC分类号： B24B37/04 , B23H5/08 , B24B53/017 , C25F3/02 , C25F7/00 , H01L21/32125
摘要： An electrolytic processing apparatus can maintain a difference in electric resistance between a recessed portion and a raised portion in the surface of a workpiece, thereby providing a processed surface with improved flatness. The electrolytic processing apparatus including: a processing electrode capable of bringing into contact with or closing to a workpiece; a feeding electrode for feeding electricity to the workpiece; a contact member disposed between the workpiece and at least one of the processing electrode and the feeding electrode, the degree of deformation of said contact member by a contact load applied from the workpiece being smal
摘要翻译：电解处理装置可以保持工件表面中的凹部和凸起部之间的电阻差，从而提供具有改善的平坦度的加工表面。电解处理装置包括：能够与工件接触或闭合的处理电极; 用于向工件供电的供电电极; 设置在工件与处理电极和供电电极中的至少一个之间的接触构件，通过从工件施加的接触载荷为微小的所述接触构件的变形程度为小

6. 发明授权

US07527723B2 Electrolytic processing apparatus and electrolytic processing method 失效
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US07527723B2
公开(公告)日：2009-05-05
申请号：US11035373
申请日：2005-01-14
申请人： Itsuki Kobata , Yutaka Wada , Hirokuni Hiyama , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Akira Kodera
发明人： Itsuki Kobata , Yutaka Wada , Hirokuni Hiyama , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Akira Kodera
IPC分类号： B23H7/36 , B23H1/10 , B23H3/10
CPC分类号： H01L21/32115 , B23H5/08 , B24B37/042 , B24B37/046 , C25F1/00 , C25F3/00 , H01L21/7684
摘要： An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation of a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with but close to the processing electrode at a distance of not more than 10 μm.
摘要翻译：电解处理装置可以提高水的解离反应的效率，并且有效地进行电解处理，并且可以消除对离子交换剂的变化操作的需要。电解处理装置包括：处理电极和馈电电极; 液体供应部分，用于在工件和处理电极和馈电电极中的至少一个之间提供含有离子交换材料的液体; 用于在处理电极和馈电电极之间施加电压的电源; 以及用于相对于彼此移动所述工件和所述处理电极和所述馈送电极中的至少一个的驱动部分; 其中，对工件的电解处理在不超过10um的距离保持工件不与处理电极接触而靠近处理电极的同时进行。

7. 发明申请

US20080171440A1 Pre-polishing treatment solution for interconnect substrate, polishing method, and method and apparatus for manufacturing interconnect substrate 审中-公开
标题翻译：用于互连基板的预抛光处理溶液，抛光方法以及用于制造互连基板的方法和装置
公开(公告)号：US20080171440A1
公开(公告)日：2008-07-17
申请号：US12007786
申请日：2008-01-15
申请人： Akira Kodera , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Itsuki Kobata
发明人： Akira Kodera , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Itsuki Kobata
IPC分类号： H01L21/304 , C23F11/14 , B23H3/00
CPC分类号： H01L21/3212 , C09G1/04
摘要： A pre-polishing treatment solution has a prominent corrosion inhibiting effect, and can be used in pre-polishing treatments for interconnect substrates. The pre-polishing treatment solution comprises a corrosion inhibitor dissolved in an organic solvent.
摘要翻译：预抛光处理溶液具有显着的腐蚀抑制作用，可用于互连基板的预抛光处理。预抛光处理溶液包含溶解在有机溶剂中的腐蚀抑制剂。

8. 发明授权

US07638030B2 Electrolytic processing apparatus and electrolytic processing method 有权
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US07638030B2
公开(公告)日：2009-12-29
申请号：US10669468
申请日：2003-09-25
申请人： Osamu Nabeya , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Takeshi Iizumi , Nobuyuki Takada , Koichi Fukaya , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita
发明人： Osamu Nabeya , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Takeshi Iizumi , Nobuyuki Takada , Koichi Fukaya , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita
IPC分类号： C25F7/00 , B23H5/06
CPC分类号： C25F7/00
摘要： An electrolytic processing apparatus which, while eliminating a CMP processing entirely or reducing a load on a CMP processing to the least possible extent, can process and flatten a conductive material formed in the surface of a substrate, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The present invention includes an electrode section including a plurality of electrode members disposed in parallel, each electrode member including an electrode and an ion exchanger covering the surface of the electrode, a holder for holding a workpiece, which is capable of bringing the workpiece close to or into contact with the ion exchanger of the electrode member, and a power source to be connected to the electrode of each electrode member of the electrode section. The ion exchanger of the electrode member includes an ion exchanger having an excellent surface smoothness and an ion exchanger having a large ion exchange capacity.
摘要翻译：一种在完全消除CMP处理或者尽可能减少CMP处理负荷的电解处理装置可以处理和平坦化形成在基板表面上的导电材料，或者可以除去（清洁）附着的附着物到工件（例如基板）的表面。本发明包括一个电极部分，它包括平行设置的多个电极部件，每个电极部件包括一个电极和一个覆盖电极表面的离子交换器，一个用于保持工件的保持器，它能使工件靠近或与电极部件的离子交换器接触，以及要连接到电极部分的每个电极部件的电极的电源。电极构件的离子交换器包括具有优异表面平滑度的离子交换器和离子交换容量大的离子交换器。

9. 发明授权

US08133380B2 Method for regenerating ion exchanger 有权
标题翻译：离子交换器再生方法
公开(公告)号：US08133380B2
公开(公告)日：2012-03-13
申请号：US12222733
申请日：2008-08-14
申请人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata
发明人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata
IPC分类号： B23H3/10
CPC分类号： C25F3/00 , B01J49/30 , C25F7/00
摘要： A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.
摘要翻译：用于再生离子交换剂的方法和装置可以容易且快速地再生离子交换器，并且可以在再生离子交换器的清洁和废液的处理时最小化负载。再生污染离子交换器的方法包括：提供一对再生电极和对置电极，设置在电极之间的隔板和设置在对电极与隔板之间的再生用离子交换器; 并在再生电极和对电极之间施加电压，同时在隔板和再生电极之间提供液体，并且还在分隔件和对电极之间供应液体。

10. 发明授权

US07208076B2 Substrate processing apparatus and method 失效
公开(公告)号：US07208076B2
公开(公告)日：2007-04-24
申请号：US10485177
申请日：2002-09-11
申请人： Itsuki Kobata , Mitsuhiko Shirakashi , Masayuki Kumekawa , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita , Hozumi Yasuda
发明人： Itsuki Kobata , Mitsuhiko Shirakashi , Masayuki Kumekawa , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita , Hozumi Yasuda
IPC分类号： C25F7/00 , C25F5/00 , C25F3/14
CPC分类号： H01L21/6708 , C25F3/00 , C25F7/00
摘要： A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.

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