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    • 2. 发明申请
    • Semiconductor memory device
    • 半导体存储器件
    • US20060267064A1
    • 2006-11-30
    • US11139977
    • 2005-05-31
    • Wolfgang RosnerFranz HofmannMichael SpechtMartin Stadele
    • Wolfgang RosnerFranz HofmannMichael SpechtMartin Stadele
    • H01L29/94
    • H01L27/10873H01L21/7624H01L27/10802H01L27/1087H01L29/66181H01L29/7841H01L29/945
    • The semiconductor memory device comprises a plurality of memory cells. Each memory cell comprises a respective transistor and a respective capacitor unit. The transistor comprises a transistor body of a first conductivity type, a drain area and a source area each having a second conductivity type, the drain area and source area are embedded in the transistor body on a first surface of the transistor body, and a gate structure having a gate dielectric layer and a gate electrode, the gate structure is arranged between the drain area and the source area. An isolation trench is arranged adjacent to said transistor body, having a dielectric layer and a conductive material, wherein the isolation trench is at least partially filled with the conductive material. The conductive material is isolated by said dielectric layer from the transistor body. The capacitor unit is formed by the transistor body representing a first electrode and the conductive material representing the second electrode.
    • 半导体存储器件包括多个存储单元。 每个存储单元包括相应的晶体管和相应的电容器单元。 晶体管包括第一导电类型的晶体管体,漏极区域和源极区域,每个具有第二导电类型,漏极区域和源极区域嵌入在晶体管本体的第一表面上,并且栅极 具有栅极介电层和栅电极的结构,栅极结构布置在漏极区域和源极区域之间。 绝缘沟槽被布置成与所述晶体管本体相邻,具有电介质层和导电材料,其中隔离沟槽至少部分地被导电材料填充。 导电材料通过所述介电层与晶体管本体隔离。 电容器单元由表示第一电极的晶体管体和表示第二电极的导电材料形成。