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    • 7. 发明授权
    • Process for making a contact betwen a capacitor electrode disposed in a
trench and an MOS transistor source/drain region disposed outside the
trench
    • 在设置在沟槽中的电容器电极和设置在沟槽外部的MOS晶体管源极/漏极区之间进行接触的工艺
    • US5432115A
    • 1995-07-11
    • US284502
    • 1994-08-04
    • Wolfgang RosnerFranz HofmannLothar Risch
    • Wolfgang RosnerFranz HofmannLothar Risch
    • H01L21/76H01L21/8242H01L27/10H01L27/108
    • H01L27/10861H01L27/10829
    • To make a contact between a capacitor electrode (13) disposed in a trench (11) and an MOS transistor source/drain region disposed outside the trench, a shallow etching is carried out in a self-aligned manner with respect to a field-oxide region insulating the MOS transistor by producing the trench (11) in a substrate (1). After forming an Si.sub.3 N.sub.4 spacer (10) at the edge (8), laid bare during the etching, of the substrate (1) the part laid bare of the field-oxide region (2) is first removed with the aid of a mask and the trench (11) is completed in a further etching. The contact is produced after the formation of an SiO.sub.2 layer (12) at the surface of the trench (11) after removing the Si.sub.3 N.sub.4 spacer (10) and producing the capacitor electrode (13) at the edge (8), laid bare by removing the Si.sub.3 N.sub.4 spacer (10), of the substrate (1).
    • PCT No.PCT / DE93 / 00078 Sec。 371日期:1994年8月4日 102(e)日期1994年8月4日PCT提交1993年2月1日PCT公布。 出版物WO93 / 16490 日期:1993年8月19日。为了在布置在沟槽(11)中的电容器电极(13)和设置在沟槽外部的MOS晶体管源/漏区之间进行接触,以自对准的方式进行浅蚀刻 相对于通过在衬底(1)中产生沟槽(11)来绝缘MOS晶体管的场氧化物区域。 在蚀刻过程中在边缘(8)处形成Si3N4间隔物(10)之后,在衬底(1)上放置裸露的场氧化物区域(2)的部分首先借助掩模去除, 在另外的蚀刻中完成沟槽(11)。 在除去Si 3 N 4间隔物(10)之后在沟槽(11)的表面形成SiO 2层(12)并在边缘(8)处产生电容器电极(13),在通过去除 (1)的Si 3 N 4间隔物(10)。