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1. 发明申请

US20050206012A1 Stress and force management techniques for a semiconductor die 审中-公开
标题翻译：半导体芯片的应力和力量管理技术
公开(公告)号：US20050206012A1
公开(公告)日：2005-09-22
申请号：US10801205
申请日：2004-03-16
申请人： Warren Farnworth , William Hiatt , Tim Murphy , John Caldwell , Michael Slaughter , David Hembree , Jamie Wanke
发明人： Warren Farnworth , William Hiatt , Tim Murphy , John Caldwell , Michael Slaughter , David Hembree , Jamie Wanke
IPC分类号： H01L21/56 , H01L23/48 , H01L23/485
CPC分类号： H01L24/06 , H01L21/563 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/13099 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/73203 , H01L2224/73257 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01028 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2224/45099
摘要： Stress and force management techniques for a semiconductor die to help compensate for stress within the semiconductor die and to help compensate for forces applied to the semiconductor die to minimize damage thereto.
摘要翻译：用于半导体管芯的应力和力管理技术来帮助补偿半导体管芯内的应力，并帮助补偿施加到半导体管芯上的力以最小化对其的损害。

2. 发明申请

US20070018336A1 Stress and force management techniques for a semiconductor die 审中-公开
标题翻译：半导体芯片的应力和力量管理技术
公开(公告)号：US20070018336A1
公开(公告)日：2007-01-25
申请号：US11516097
申请日：2006-09-05
申请人： Warren Farnworth , William Hiatt , Tim Murphy , John Caldwell , Michael Slaughter , David Hembree , Jamie Wanke
发明人： Warren Farnworth , William Hiatt , Tim Murphy , John Caldwell , Michael Slaughter , David Hembree , Jamie Wanke
IPC分类号： H01L23/48
CPC分类号： H01L24/06 , H01L21/563 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/13099 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/73203 , H01L2224/73257 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01028 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2224/45099
摘要： Stress and force management techniques for a semiconductor die to help compensate for stress within the semiconductor die and to help compensate for forces applied to the semiconductor die to minimize damage thereto.
摘要翻译：用于半导体管芯的应力和力管理技术来帮助补偿半导体管芯内的应力，并帮助补偿施加到半导体管芯上的力以最小化对其的损害。

3. 发明申请

US20060197544A1 Test sockets, test systems, and methods for testing microfeature devices 审中-公开
公开(公告)号：US20060197544A1
公开(公告)日：2006-09-07
申请号：US11414987
申请日：2006-05-01
申请人： John Caldwell , Mark Tverdy , Michael Slaughter
发明人： John Caldwell , Mark Tverdy , Michael Slaughter
IPC分类号： G01R31/02
CPC分类号： G01R1/0483 , G01R31/2893
摘要： Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.

4. 发明申请

US20050206401A1 Test sockets, test systems, and methods for testing microfeature devices 失效
标题翻译：测试插座，测试系统和测试微功能设备的方法
公开(公告)号：US20050206401A1
公开(公告)日：2005-09-22
申请号：US10805872
申请日：2004-03-22
申请人： John Caldwell , Mark Tverdy , Michael Slaughter
发明人： John Caldwell , Mark Tverdy , Michael Slaughter
IPC分类号： G01R1/04 , G01R31/02 , G01R31/28
CPC分类号： G01R1/0483 , G01R31/2893
摘要： Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.
摘要翻译：测试插座，测试系统和用于利用衬底和从衬底突出的多个导电互连元件来测试微特征器件的方法。在一个实施例中，测试插座包括支撑表面和支撑表面中对应于微特征装置的至少一些互连元件的多个孔。单独的孔延伸穿过测试插座，并且其尺寸被设计成接收互连元件中的一个的一部分，使得当微特征装置被接收在测试插座中时，基板与支撑表面间隔开。在该实施例的一个方面，单个孔具有小于互连元件的横截面尺寸的横截面尺寸，使得孔仅接收相应互连元件的一部分。

5. 发明申请

US20060197545A1 Test sockets, test systems, and methods for testing microfeature devices 审中-公开
标题翻译：测试插座，测试系统和测试微功能设备的方法
公开(公告)号：US20060197545A1
公开(公告)日：2006-09-07
申请号：US11415335
申请日：2006-05-01
申请人： John Caldwell , Mark Tverdy , Michael Slaughter
发明人： John Caldwell , Mark Tverdy , Michael Slaughter
IPC分类号： G01R31/02
CPC分类号： G01R1/0483 , G01R31/2893
摘要： Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.
摘要翻译：测试插座，测试系统和用于利用衬底和从衬底突出的多个导电互连元件来测试微特征器件的方法。在一个实施例中，测试插座包括支撑表面和支撑表面中对应于微特征装置的至少一些互连元件的多个孔。单独的孔延伸穿过测试插座，并且其尺寸被设计成接收互连元件中的一个的一部分，使得当微特征装置被接收在测试插座中时，基板与支撑表面间隔开。在该实施例的一个方面，单个孔具有小于互连元件的横截面尺寸的横截面尺寸，使得孔仅接收相应互连元件的一部分。

6. 发明申请

US20070216437A1 Pusher assemblies for use in microfeature device testing, systems with pusher assemblies, and methods for using such pusher assemblies 失效
标题翻译：用于微特征装置测试的推动器组件，具有推动器组件的系统以及使用这种推动器组件的方法
公开(公告)号：US20070216437A1
公开(公告)日：2007-09-20
申请号：US11374850
申请日：2006-03-14
申请人： Michael Slaughter , Christie Larson
发明人： Michael Slaughter , Christie Larson
IPC分类号： G01R31/26
CPC分类号： G01R31/2893 , G01R1/0441
摘要： Pusher assemblies for use in microelectronic device testing systems and methods for using such pusher assemblies are disclosed herein. One particular embodiment of such a pusher assembly comprises a plate having a first side and a second side opposite the first side. An engagement assembly is removably coupled to the second side of the plate and positioned to contact a microfeature device being tested. The pusher assembly can include an urging member proximate the first side of the plate and configured to move the engagement assembly toward the device being tested. The pusher assembly can also include a heat transfer unit carried by the first side of the plate. In several embodiments, the pusher assembly can further include a plurality of pins carried by the engagement assembly such that the pins extend through the plate and engage the urging member to restrict axial movement of the urging member toward the device being tested.
摘要翻译：用于微电子器件测试系统的推动器组件和用于使用这种推动器组件的方法在此公开。这种推动器组件的一个具体实施例包括具有与第一侧相对的第一侧和第二侧的板。接合组件可移除地联接到板的第二侧并且定位成接触被测试的微型特征装置。推动器组件可以包括邻近板的第一侧的推动构件，并且构造成使接合组件朝向被测试的装置移动。推动器组件还可以包括由板的第一侧承载的传热单元。在几个实施例中，推动器组件还可以包括由接合组件承载的多个销，使得销延伸穿过板并接合推动构件以限制推动构件朝着被测试装置的轴向运动。

7. 发明申请

US20100097090A1 PUSHER ASSEMBLIES FOR USE IN MICROFEATURE DEVICE TESTING, SYSTEMS WITH PUSHER ASSEMBLIES, AND METHODS FOR USING SUCH PUSHER ASSEMBLIES 失效
标题翻译：用于微型设备测试的推动组件，带有组件的系统以及使用这种推动组件的方法
公开(公告)号：US20100097090A1
公开(公告)日：2010-04-22
申请号：US12644185
申请日：2009-12-22
申请人： Michael Slaughter , Christie Dyan Larson
发明人： Michael Slaughter , Christie Dyan Larson
IPC分类号： G01R31/26
CPC分类号： G01R31/2893 , G01R1/0441
摘要： Pusher assemblies for use in microelectronic device testing systems and methods for using such pusher assemblies are disclosed herein. One particular embodiment of such a pusher assembly comprises a plate having a first side and a second side opposite the first side. An engagement assembly is removably coupled to the second side of the plate and positioned to contact a microfeature device being tested. The pusher assembly can include an urging member proximate the first side of the plate and configured to move the engagement assembly toward the device being tested. The pusher assembly can also include a heat transfer unit carried by the first side of the plate. In several embodiments, the pusher assembly can further include a plurality of pins carried by the engagement assembly such that the pins extend through the plate and engage the urging member to restrict axial movement of the urging member toward the device being tested.
摘要翻译：用于微电子器件测试系统的推动器组件和用于使用这种推动器组件的方法在此公开。这种推动器组件的一个具体实施例包括具有与第一侧相对的第一侧和第二侧的板。接合组件可移除地联接到板的第二侧并且定位成接触被测试的微型特征装置。推动器组件可以包括邻近板的第一侧的推动构件，并且构造成使接合组件朝向被测试的装置移动。推动器组件还可以包括由板的第一侧承载的传热单元。在几个实施例中，推动器组件还可以包括由接合组件承载的多个销，使得销延伸穿过板并接合推动构件以限制推动构件朝着被测试装置的轴向运动。

8. 发明授权

US07652495B2 Pusher assemblies for use in microfeature device testing, systems with pusher assemblies, and methods for using such pusher assemblies 失效
标题翻译：用于微特征装置测试的推动器组件，具有推动器组件的系统以及使用这种推动器组件的方法
公开(公告)号：US07652495B2
公开(公告)日：2010-01-26
申请号：US11374850
申请日：2006-03-14
申请人： Michael Slaughter , Christie Dyan Larson
发明人： Michael Slaughter , Christie Dyan Larson
IPC分类号： G01R31/26 , G01R31/02 , G01R31/28
CPC分类号： G01R31/2893 , G01R1/0441
摘要： Pusher assemblies for use in microelectronic device testing systems and methods for using such pusher assemblies are disclosed herein. One particular embodiment of such a pusher assembly comprises a plate having a first side and a second side opposite the first side. An engagement assembly is removably coupled to the second side of the plate and positioned to contact a microfeature device being tested. The pusher assembly can include an urging member proximate the first side of the plate and configured to move the engagement assembly toward the device being tested. The pusher assembly can also include a heat transfer unit carried by the first side of the plate. In several embodiments, the pusher assembly can further include a plurality of pins carried by the engagement assembly such that the pins extend through the plate and engage the urging member to restrict axial movement of the urging member toward the device being tested.
摘要翻译：用于微电子器件测试系统的推动器组件和用于使用这种推动器组件的方法在此公开。这种推动器组件的一个具体实施例包括具有与第一侧相对的第一侧和第二侧的板。接合组件可移除地联接到板的第二侧并且定位成接触被测试的微型特征装置。推动器组件可以包括邻近板的第一侧的推动构件，并且构造成使接合组件朝向被测试的装置移动。推动器组件还可以包括由板的第一侧承载的传热单元。在几个实施例中，推动器组件还可以包括由接合组件承载的多个销，使得销延伸穿过板并接合推动构件以限制推动构件朝着被测试装置的轴向运动。

9. 发明授权

US06858453B1 Integrated circuit package alignment feature 失效
标题翻译：集成电路封装对准功能
公开(公告)号：US06858453B1
公开(公告)日：2005-02-22
申请号：US09416368
申请日：1999-10-12
申请人： David J. Corisis , Tracy Reynolds , Michael Slaughter , Daniel Cram , Leland R. Nevill
发明人： David J. Corisis , Tracy Reynolds , Michael Slaughter , Daniel Cram , Leland R. Nevill
IPC分类号： G01R1/04 , G01R31/28 , H01L23/495 , H01L23/544 , H05K3/30 , G01R31/26 , H01L21/00 , H01L21/44 , H01L21/48 , H01L21/66
CPC分类号： G01R31/2851 , G01R1/0408 , G01R31/2884 , H01L23/4951 , H01L23/544 , H01L24/48 , H01L24/49 , H01L2223/54473 , H01L2223/54486 , H01L2224/05554 , H01L2224/05599 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/85399 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H05K3/303 , H05K2201/10568 , H05K2201/10689 , H05K2201/10696 , H05K2203/167 , Y02P70/613 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2924/00012
摘要： An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semicircle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.
摘要翻译：提供了具有与引线框一体的对准特征的集成电路。集成电路包括与半导体管芯耦合的引线框架，并部分封装在绝缘材料中。引线框架具有其中的对准特征。对准特征包括在引线框架上切割出半圆形，突起，孔或槽的形式。或者，对准特征包括可移除地耦合的突片。集成电路测试完成后，对准标签从集成电路中取出。对准特征也可以设置在附着于引线框架封装的一侧或内部的散热器上。

10. 发明授权

US07863924B2 Pusher assemblies for use in microfeature device testing, systems with pusher assemblies, and methods for using such pusher assemblies 失效
标题翻译：用于微特征装置测试的推动器组件，具有推动器组件的系统以及使用这种推动器组件的方法
公开(公告)号：US07863924B2
公开(公告)日：2011-01-04
申请号：US12644185
申请日：2009-12-22
申请人： Michael Slaughter , Christie Dyan Larson
发明人： Michael Slaughter , Christie Dyan Larson
IPC分类号： G01R31/26 , G01R31/28 , G01R31/02
CPC分类号： G01R31/2893 , G01R1/0441
摘要： Pusher assemblies for use in microelectronic device testing systems and methods for using such pusher assemblies are disclosed herein. One particular embodiment of such a pusher assembly comprises a plate having a first side and a second side opposite the first side. An engagement assembly is removably coupled to the second side of the plate and positioned to contact a microfeature device being tested. The pusher assembly can include an urging member proximate the first side of the plate and configured to move the engagement assembly toward the device being tested. The pusher assembly can also include a heat transfer unit carried by the first side of the plate. In several embodiments, the pusher assembly can further include a plurality of pins carried by the engagement assembly such that the pins extend through the plate and engage the urging member to restrict axial movement of the urging member toward the device being tested.
摘要翻译：用于微电子器件测试系统的推动器组件和用于使用这种推动器组件的方法在此公开。这种推动器组件的一个具体实施例包括具有与第一侧相对的第一侧和第二侧的板。接合组件可移除地联接到板的第二侧并且定位成接触被测试的微型特征装置。推动器组件可以包括邻近板的第一侧的推动构件，并且构造成使接合组件朝向被测试的装置移动。推动器组件还可以包括由板的第一侧承载的传热单元。在几个实施例中，推动器组件还可以包括由接合组件承载的多个销，使得销延伸穿过板并接合推动构件以限制推动构件朝着被测试装置的轴向运动。

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