专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06836003B2 Integrated circuit package alignment feature 失效
标题翻译：集成电路封装对准功能
公开(公告)号：US06836003B2
公开(公告)日：2004-12-28
申请号：US09819874
申请日：2001-03-28
申请人： David J. Corisis , Tracy Reynolds , Michael Slaughter , Daniel Cram , Leland R. Nevill , Jerrold L. King
发明人： David J. Corisis , Tracy Reynolds , Michael Slaughter , Daniel Cram , Leland R. Nevill , Jerrold L. King
IPC分类号： H01L23495
CPC分类号： G01R31/2851 , G01R1/0408 , G01R31/2884 , H01L23/4951 , H01L23/544 , H01L24/48 , H01L24/49 , H01L2223/54473 , H01L2223/54486 , H01L2224/05554 , H01L2224/05599 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/85399 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H05K3/303 , H05K2201/10568 , H05K2201/10689 , H05K2201/10696 , H05K2203/167 , Y02P70/613 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2924/00012
摘要： An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semicircle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.
摘要翻译：提供了具有与引线框一体的对准特征的集成电路。集成电路包括与半导体管芯耦合的引线框架，并部分封装在绝缘材料中。引线框架具有其中的对准特征。对准特征包括在引线框架上切割出半圆形，突起，孔或槽的形式。或者，对准特征包括可移除地耦合的突片。集成电路测试完成后，对准标签从集成电路中取出。对准特征也可以设置在附着于引线框架封装的一侧或内部的散热器上。

2. 发明授权

US06246108B1 Integrated circuit package including lead frame with electrically isolated alignment feature 有权
标题翻译：集成电路封装，包括带电隔离对准功能的引线框架
公开(公告)号：US06246108B1
公开(公告)日：2001-06-12
申请号：US09374176
申请日：1999-08-12
申请人： David J. Corisis , Tracy Reynolds , Michael Slaughter , Daniel Cram , Leland R. Nevill , Jerrold L. King
发明人： David J. Corisis , Tracy Reynolds , Michael Slaughter , Daniel Cram , Leland R. Nevill , Jerrold L. King
IPC分类号： H01L2348
CPC分类号： G01R31/2851 , G01R1/0408 , G01R31/2884 , H01L23/4951 , H01L23/544 , H01L24/48 , H01L24/49 , H01L2223/54473 , H01L2223/54486 , H01L2224/05554 , H01L2224/05599 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/85399 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H05K3/303 , H05K2201/10568 , H05K2201/10689 , H05K2201/10696 , H05K2203/167 , Y02P70/613 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2924/00012
摘要： An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semi-circle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.
摘要翻译：提供了具有与引线框一体的对准特征的集成电路。集成电路包括与半导体管芯耦合的引线框架，并部分封装在绝缘材料中。引线框架具有其中的对准特征。对准特征包括在引线框架上切割成半圆形，突起，孔或槽的形式。或者，对准特征包括可移除地耦合的突片。集成电路测试完成后，对准标签从集成电路中取出。对准特征也可以设置在附着于引线框架封装的一侧或内部的散热器上。

3. 发明授权

US6048744A Integrated circuit package alignment feature 失效
标题翻译：集成电路封装对准功能
公开(公告)号：US6048744A
公开(公告)日：2000-04-11
申请号：US929843
申请日：1997-09-15
申请人： David J. Corisis , Tracy Reynolds , Michael Slaughter , Daniel Cram , Leland R. Nevill , Jerrold L. King
发明人： David J. Corisis , Tracy Reynolds , Michael Slaughter , Daniel Cram , Leland R. Nevill , Jerrold L. King
IPC分类号： G01R1/04 , G01R31/28 , H01L23/495 , H01L23/544 , H05K3/30 , G01R31/26 , H01L21/44 , H01L21/48 , H01L21/50 , H01L21/66
CPC分类号： G01R31/2851 , H01L23/4951 , H01L23/544 , H05K3/303 , G01R1/0408 , G01R31/2884 , H01L2223/54473 , H01L2223/54486 , H01L2224/05554 , H01L2224/05599 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/85399 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H05K2201/10568 , H05K2201/10689 , H05K2201/10696 , H05K2203/167 , Y02P70/613
摘要： An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semi-circle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.
摘要翻译：提供了具有与引线框一体的对准特征的集成电路。集成电路包括与半导体管芯耦合的引线框架，并部分封装在绝缘材料中。引线框架具有其中的对准特征。对准特征包括在引线框架上切割成半圆形，突起，孔或槽的形式。或者，对准特征包括可移除地耦合的突片。集成电路测试完成后，对准标签从集成电路中取出。对准特征也可以设置在附着于引线框架封装的一侧或内部的散热器上。

4. 发明授权

US06858453B1 Integrated circuit package alignment feature 失效
标题翻译：集成电路封装对准功能
公开(公告)号：US06858453B1
公开(公告)日：2005-02-22
申请号：US09416368
申请日：1999-10-12
申请人： David J. Corisis , Tracy Reynolds , Michael Slaughter , Daniel Cram , Leland R. Nevill
发明人： David J. Corisis , Tracy Reynolds , Michael Slaughter , Daniel Cram , Leland R. Nevill
IPC分类号： G01R1/04 , G01R31/28 , H01L23/495 , H01L23/544 , H05K3/30 , G01R31/26 , H01L21/00 , H01L21/44 , H01L21/48 , H01L21/66
CPC分类号： G01R31/2851 , G01R1/0408 , G01R31/2884 , H01L23/4951 , H01L23/544 , H01L24/48 , H01L24/49 , H01L2223/54473 , H01L2223/54486 , H01L2224/05554 , H01L2224/05599 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/85399 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H05K3/303 , H05K2201/10568 , H05K2201/10689 , H05K2201/10696 , H05K2203/167 , Y02P70/613 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2924/00012
摘要： An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semicircle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.
摘要翻译：提供了具有与引线框一体的对准特征的集成电路。集成电路包括与半导体管芯耦合的引线框架，并部分封装在绝缘材料中。引线框架具有其中的对准特征。对准特征包括在引线框架上切割出半圆形，突起，孔或槽的形式。或者，对准特征包括可移除地耦合的突片。集成电路测试完成后，对准标签从集成电路中取出。对准特征也可以设置在附着于引线框架封装的一侧或内部的散热器上。

5. 发明申请

US20060166404A1 Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices 有权
标题翻译：用于设计用于层叠半导体器件组件和用于组装半导体器件的接合焊盘重新路由元件的方法
公开(公告)号：US20060166404A1
公开(公告)日：2006-07-27
申请号：US11352685
申请日：2006-02-13
申请人： David Corisis , Jerry Brooks , Matt Schwab , Tracy Reynolds
发明人： David Corisis , Jerry Brooks , Matt Schwab , Tracy Reynolds
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L25/0657 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06562 , H01L2225/06572 , H01L2225/06586 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/3011 , H01L2924/30111 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A rerouting element for a semiconductor device includes a substantially planar member that carries at least one contact location, at least one conductive, at least one rerouted bond pad. The contact location is positioned adjacent to a first periphered edge of the substantially planar member and at a location that corresponds to the location of a bond pad of a semiconductor device with which the rerouting element is to be used. The at least one conductive element, which communicates with the at least one contact location, reroutes the bond pad location of the semiconductor device to a corresponding rerouted bond pad location adjacent to a second one peripheral edge of the rerouted substantially planar member which is opposite the first periphered edge. In addition, assemblies including rerouting elements and methods for designing and using rerouting elements are disclosed.
摘要翻译：用于半导体器件的重新路由元件包括承载至少一个接触位置的基本上平面的构件，至少一个导电的至少一个重新路由的接合焊盘。接触位置邻近于基本平坦的构件的第一密封边缘并且位于对应于要使用重新路由元件的半导体器件的接合焊盘的位置的位置。与至少一个接触位置连通的至少一个导电元件将半导体器件的接合焊盘位置重新路由到与重新路由的基本上平面的部件的第二个周边边缘相邻的相应的重路由接合焊盘位置，第一个边缘。此外，公开了包括重新路由元件和用于设计和使用重新路由元件的方法的组件。

6. 发明申请

US20050156293A1 Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods 有权
标题翻译：路由元件用于多芯片模块，多芯片模块包括路由元素和方法
公开(公告)号：US20050156293A1
公开(公告)日：2005-07-21
申请号：US11080586
申请日：2005-03-15
申请人： David Corisis , Jerry Brooks , Matt Schwab , Tracy Reynolds
发明人： David Corisis , Jerry Brooks , Matt Schwab , Tracy Reynolds
IPC分类号： H01L23/538 , H05K1/14 , H05K3/30 , H05K3/40 , H01L23/495
CPC分类号： H05K1/141 , H01L23/5385 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/4824 , H01L2224/85399 , H01L2924/00014 , H01L2924/09701 , H01L2924/12044 , H01L2924/19041 , H05K1/147 , H05K3/305 , H05K3/4084 , H05K2201/048 , H05K2203/049 , Y10T29/49124 , Y10T29/49126 , Y10T29/49204 , H01L2224/45015 , H01L2924/207
摘要： A routing element for use in a semiconductor device assembly includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths than those provided by a carrier substrate of the semiconductor device assembly. The conductive traces may be carried upon a single surface of the routing element substrate, be carried internally by the routing element substrate, or include externally and internally carried portions. The routing element may also include a contact pad positioned at each end of each conductive trace thereof to facilitate electrical connection of each conductive trace to a corresponding terminal of the substrate or to a corresponding bond pad of a semiconductor device of the multichip module. Multichip modules are also disclosed, as are methods for designing the routing element and methods in which the routing element is used.
摘要翻译：用于半导体器件组件的布线元件包括承载导电迹线的衬底，该衬底提供比由半导体器件组件的载体衬底提供的电路更短的电路径或更短的电路径。导电迹线可以承载在路由元件衬底的单个表面上，由路由元件衬底在内部承载，或包括外部和内部承载的部分。布线元件还可以包括位于其每个导电迹线的每一端处的接触垫，以便于将每个导电迹线电连接到基片的相应端子或多芯片模块的半导体器件的对应接合焊盘。还公开了多芯片模块，以及用于设计路由元件的方法和使用路由元件的方法。

7. 发明申请

US20060121650A1 Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of a semiconductor device 审中-公开
标题翻译：在形成半导体器件期间通过使用球形焊接或其它连接的电路完成的方法和装置
公开(公告)号：US20060121650A1
公开(公告)日：2006-06-08
申请号：US11345027
申请日：2006-01-31
申请人： Rich Fogal , Tracy Reynolds , Timothy Cowles
发明人： Rich Fogal , Tracy Reynolds , Timothy Cowles
IPC分类号： H01L21/82
CPC分类号： H01L23/525 , G11C17/16 , G11C29/028 , G11C29/88 , G11C29/883 , H01L21/76892 , H01L22/32 , H01L24/05 , H01L24/06 , H01L2224/05578 , H01L2224/13028 , H01L2224/1613 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要： A method used to form a semiconductor device comprises providing first and second circuit portions having first and second pad portions respectively. The second circuit portion is electrically isolated from the first circuit portion. The first and second pad portions are then electrically connected, for example with a ball bond or a wire bond, to electrically couple the first and second circuit portions. In various embodiments the semiconductor device will not function until the pad portions are electrically coupled, and in other embodiments the functionality of the device may be selectively controlled by connecting selected pad portions from a plurality of pad portions. Isolating the first and second circuit portions allows electrical operations such as antifuse programming to be carried out without adversely affecting related circuits. Once electrical operations are completed, the isolated circuit portions are electrically coupled to provide a complete circuit. Various inventive embodiments and implementations are described.
摘要翻译：用于形成半导体器件的方法包括分别提供具有第一和第二焊盘部分的第一和第二电路部分。第二电路部分与第一电路部分电隔离。然后，第一和第二焊盘部分例如用球焊或引线接合电连接，以电耦合第一和第二电路部分。在各种实施例中，半导体器件将不起作用，直到焊盘部分电耦合，并且在其它实施例中，可以通过从多个焊盘部分连接所选择的焊盘部分来选择性地控制设备的功能。隔离第一和第二电路部分允许执行诸如反熔丝编程之类的电气操作，而不会不利地影响相关电路。一旦电气操作完成，隔离电路部分被电耦合以提供完整的电路。描述了各种发明实施例和实施方式。

8. 发明申请

US20060113650A1 Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element 有权
标题翻译：焊盘重路由元件和包括重新路由元件的堆叠半导体器件组件
公开(公告)号：US20060113650A1
公开(公告)日：2006-06-01
申请号：US11325293
申请日：2006-01-04
申请人： David Corisis , Jerry Brooks , Matt Schwab , Tracy Reynolds
发明人： David Corisis , Jerry Brooks , Matt Schwab , Tracy Reynolds
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06562 , H01L2225/06572 , H01L2225/06586 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/3011 , H01L2924/30111 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A rerouting element for a semiconductor device includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The conductive elements, which communicate with corresponding conductive vias, reroute the bond pad locations to corresponding contact pad locations adjacent to one peripheral edge or two adjacent peripheral edges of the rerouted semiconductor device. The rerouting element is particularly useful for rerouting centrally located bond pads of a semiconductor device, as well as for rerouting the peripheral locations of bond pads of a semiconductor device to one or two adjacent peripheral edges thereof. In addition, methods for designing and using rerouting elements are disclosed. Semiconductor device assemblies including one or more rerouting elements that provide contacts adjacent to one or two adjacent peripheral edges of a semiconductor die are also disclosed, as are semiconductor device assemblies in which contacts adjacent to two or more peripheral edges of a lower semiconductor device are exposed laterally beyond peripheral edges of an upper semiconductor device.
摘要翻译：用于半导体器件的重新路由元件包括承载导电通孔，导电元件和接触焊盘的电介质膜。导电通孔位于对应于要使用重新路由元件的半导体器件的接合焊盘的位置的位置处。与相应的导电通孔连通的导电元件将接合焊盘位置重新路由到与被重新路由的半导体器件的一个外围边缘或两个相邻外围边缘相邻的相应接触焊盘位置。重新路由元件对于重新布置半导体器件的中心位置的接合焊盘以及将半导体器件的接合焊盘的外围位置重新路由到其一个或两个相邻的外围边缘是特别有用的。另外，公开了设计和使用重路由元件的方法。还公开了包括提供与半导体管芯的一个或两个相邻外围边缘相邻的触点的一个或多个重路由元件的半导体器件组件，其中与下半导体器件的两个或更多个外围边缘相邻的触点暴露的半导体器件组件横向超过上半导体器件的外围边缘。

9. 发明申请

US20050156295A1 Routing element for use in semiconductor device assemblies 有权
标题翻译：用于半导体器件组件的路由元件
公开(公告)号：US20050156295A1
公开(公告)日：2005-07-21
申请号：US11076740
申请日：2005-03-10
申请人： David Corisis , Jerry Brooks , Matt Schwab , Tracy Reynolds
发明人： David Corisis , Jerry Brooks , Matt Schwab , Tracy Reynolds
IPC分类号： H01L23/538 , H05K1/14 , H05K3/30 , H05K3/40 , H01L23/053
CPC分类号： H05K1/141 , H01L23/5385 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/4824 , H01L2224/85399 , H01L2924/00014 , H01L2924/09701 , H01L2924/12044 , H01L2924/19041 , H05K1/147 , H05K3/305 , H05K3/4084 , H05K2201/048 , H05K2203/049 , Y10T29/49124 , Y10T29/49126 , Y10T29/49204 , H01L2224/45015 , H01L2924/207
摘要： A routing element for use in a semiconductor device assembly includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths than those provided by a carrier substrate of the semiconductor device assembly. The conductive traces may be carried upon a single surface of the routing element substrate, be carried internally by the routing element substrate, or include externally and internally carried portions. The routing element may also include a contact pad positioned at each end of each conductive trace thereof to facilitate electrical connection of each conductive trace to a corresponding terminal of the substrate or to a corresponding bond pad of a semiconductor device of the multichip module. Multichip modules are also disclosed, as are methods for designing the routing element and methods in which the routing element is used.
摘要翻译：用于半导体器件组件的布线元件包括承载导电迹线的衬底，该衬底提供比由半导体器件组件的载体衬底提供的电路更短的电路径或更短的电路径。导电迹线可以承载在路由元件衬底的单个表面上，由路由元件衬底在内部承载，或包括外部和内部承载的部分。布线元件还可以包括位于其每个导电迹线的每一端处的接触垫，以便于将每个导电迹线电连接到衬底的对应端子或多芯片模块的半导体器件的相应接合焊盘。还公开了多芯片模块，以及用于设计路由元件的方法和使用路由元件的方法。

10. 发明授权

US06357275B1 Apparatus and method for providing mechanically pre-formed conductive leads 失效
标题翻译：用于提供机械预成形的导电引线的装置和方法
公开(公告)号：US06357275B1
公开(公告)日：2002-03-19
申请号：US09721028
申请日：2000-11-21
申请人： Ronald W. Ellis , Tracy Reynolds , Michael Bettinger
发明人： Ronald W. Ellis , Tracy Reynolds , Michael Bettinger
IPC分类号： B21D2202
CPC分类号： H01L24/86 , H01L21/4842 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , Y10T29/49121
摘要： The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, an apparatus includes a forming chuck engageable with a first surface of a conductive sheet, and a receiving chuck engageable with a second surface of the conductive sheet opposite from the forming chuck. The forming chuck has a raised forming portion alignable with one or more lead members formed in the conductive sheet, and the receiving chuck has a receiving portion alignable with the forming portion and shaped to closely conform to at least part of the forming portion. The conductive sheet is compressed between the forming chuck and the receiving chuck to mechanically pre-form the one or more lead members into one or more pre-formed conductive leads. In one embodiment, the raised forming portion includes a ridge having a polygonal cross-sectional shape and the receiving portion comprises a channel. Alternately, the raised forming portion includes a partially-pyramidal block and the receiving portion comprises a pocket. In yet another embodiment, the raised forming portion includes a plurality of blocks and the receiving portion comprises a plurality of pockets. In still another embodiment of the invention, an apparatus includes a press coupled to the forming chuck that controllably engages the forming chuck against the conductive sheet. In another embodiment, an apparatus includes a handler for controllably positioning the conductive sheet before and after engagement with the forming and receiving chucks.
摘要翻译：本发明涉及一种用于提供机械预成形的导电引线的装置和方法。在本发明的一个实施例中，一种装置包括可与导电片的第一表面接合的成形卡盘以及可与导电片的与成形卡盘相对的第二表面接合的接收卡盘。成形卡盘具有与形成在导电片中的一个或多个引线部件对准的凸起形成部分，并且接收卡盘具有可与成形部分对准的成形为与形成部分的至少一部分紧密配合的接收部分。导电片在成形卡盘和接收卡盘之间被压缩，以将一个或多个引线部件机械地预成形为一个或多个预先形成的导电引线。在一个实施例中，凸起形成部分包括具有多边形横截面形状的脊，并且接收部分包括通道。或者，升高的成形部分包括部分锥体块，并且接收部分包括口袋。在另一个实施例中，凸起成形部分包括多个块，并且接收部分包括多个袋。在本发明的另一个实施例中，一种设备包括联接到成形卡盘的压力机，该压力机可控制地将成形卡盘接合在导电板上。在另一个实施例中，一种装置包括用于在与成形和接收卡盘接合之前和之后可控地定位导电片的处理器。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式