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1. 发明申请

US20050206012A1 Stress and force management techniques for a semiconductor die 审中-公开
标题翻译：半导体芯片的应力和力量管理技术
公开(公告)号：US20050206012A1
公开(公告)日：2005-09-22
申请号：US10801205
申请日：2004-03-16
申请人： Warren Farnworth , William Hiatt , Tim Murphy , John Caldwell , Michael Slaughter , David Hembree , Jamie Wanke
发明人： Warren Farnworth , William Hiatt , Tim Murphy , John Caldwell , Michael Slaughter , David Hembree , Jamie Wanke
IPC分类号： H01L21/56 , H01L23/48 , H01L23/485
CPC分类号： H01L24/06 , H01L21/563 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/13099 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/73203 , H01L2224/73257 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01028 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2224/45099
摘要： Stress and force management techniques for a semiconductor die to help compensate for stress within the semiconductor die and to help compensate for forces applied to the semiconductor die to minimize damage thereto.
摘要翻译：用于半导体管芯的应力和力管理技术来帮助补偿半导体管芯内的应力，并帮助补偿施加到半导体管芯上的力以最小化对其的损害。

2. 发明申请

US20070018336A1 Stress and force management techniques for a semiconductor die 审中-公开
标题翻译：半导体芯片的应力和力量管理技术
公开(公告)号：US20070018336A1
公开(公告)日：2007-01-25
申请号：US11516097
申请日：2006-09-05
申请人： Warren Farnworth , William Hiatt , Tim Murphy , John Caldwell , Michael Slaughter , David Hembree , Jamie Wanke
发明人： Warren Farnworth , William Hiatt , Tim Murphy , John Caldwell , Michael Slaughter , David Hembree , Jamie Wanke
IPC分类号： H01L23/48
CPC分类号： H01L24/06 , H01L21/563 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/13099 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/73203 , H01L2224/73257 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01028 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2224/45099
摘要： Stress and force management techniques for a semiconductor die to help compensate for stress within the semiconductor die and to help compensate for forces applied to the semiconductor die to minimize damage thereto.
摘要翻译：用于半导体管芯的应力和力管理技术来帮助补偿半导体管芯内的应力，并帮助补偿施加到半导体管芯上的力以最小化对其的损害。

3. 发明申请

US20130016779A1 VIDEO COMPRESSION AND ENCODING METHOD 有权
公开(公告)号：US20130016779A1
公开(公告)日：2013-01-17
申请号：US13617834
申请日：2012-09-14
申请人： Eric Ameres , James Bankoski , Adrian W. Grange , Tim Murphy , Paul G. Wilkins , Yaowu Xu
发明人： Eric Ameres , James Bankoski , Adrian W. Grange , Tim Murphy , Paul G. Wilkins , Yaowu Xu
IPC分类号： H04N7/26
CPC分类号： H04N7/50 , H04N19/129 , H04N19/147 , H04N19/176 , H04N19/517 , H04N19/523 , H04N19/567 , H04N19/57 , H04N19/61 , H04N19/66 , H04N19/80 , H04N19/89
摘要： Disclosed herein is a method for decoding a video signal having at least one frame with a plurality of blocks including a current block, including generating, for at least a selected pixel in the current block, a predicted value for at least one pixel located in a row i and a column j of the current block using a processor and according to the following equation: Xij=Li+Aj−C; wherein Xij is the predicted value, Li is the value of a pixel to the left of the current block, Aj is the value of a pixel in a row above the current block and C is the value of a pixel in the row above and the column to the left of the current block and decoding the current block using the predicted value.

4. 发明授权

US08290055B2 Video compression and encoding method 有权
标题翻译：视频压缩和编码方法
公开(公告)号：US08290055B2
公开(公告)日：2012-10-16
申请号：US13200795
申请日：2011-09-30
申请人： Eric Ameres , James Bankoski , Adrian W Grange , Tim Murphy , Paul G Wilkins , Yaowu Xu
发明人： Eric Ameres , James Bankoski , Adrian W Grange , Tim Murphy , Paul G Wilkins , Yaowu Xu
IPC分类号： H04B1/66 , G06K9/36
CPC分类号： H04N7/50 , H04N19/129 , H04N19/147 , H04N19/176 , H04N19/517 , H04N19/523 , H04N19/567 , H04N19/57 , H04N19/61 , H04N19/66 , H04N19/80 , H04N19/89
摘要： Disclosed herein is a method for encoding at least one video frame having a plurality of blocks including a current block, including determining motion vectors for each of at least some of blocks surrounding the current block, identifying surrounding blocks having that have the same motion vector and assigning the identified surrounding blocks to a plurality of groups, determining a number of blocks in at least two of the plurality of groups and selecting a motion vector to encode the current block based on the determined number of blocks in the at least two groups.
摘要翻译：本文公开了一种用于编码至少一个视频帧的方法，所述至少一个视频帧具有包括当前块的多个块，包括确定围绕当前块的至少一些块中的每一个的运动矢量，识别具有相同运动矢量的周围块;以及将所识别的周围块分配给多个组，确定所述多个组中的至少两个组中的块的数量，并且基于所确定的所述至少两个组中的块的数量来选择运动矢量来编码所述当前块。

5. 发明授权

US07732882B2 Method and system for electrically coupling a chip to chip package 有权
标题翻译：用于电耦合芯片到芯片封装的方法和系统
公开(公告)号：US07732882B2
公开(公告)日：2010-06-08
申请号：US11971150
申请日：2008-01-08
申请人： Tim Murphy , Lee Gotcher
发明人： Tim Murphy , Lee Gotcher
IPC分类号： H01L31/0203
CPC分类号： H01L23/48 , H01L2924/0002 , H01L2924/00
摘要： A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals. Both the chip and the chip package have at least one such converter physically disposed on them. Each converter is able to (1) convert received electromagnetic signals into electronic signals, which it then may relay to leads on the device on which it is disposed; and (2) receive electronic signals from leads on the device on which it is disposed and convert them into corresponding electromagnetic signals, which it may transmit to a corresponding converter on the other device. Not having a direct physical connection between the chip and the chip package decreases the inductive and capacitive effects commonly experienced with physical bonds.
摘要翻译：芯片和芯片封装可以通过使用能够通过发射和接收电磁信号彼此通信的一组转换器彼此传输信息。芯片和芯片封装都至少有一个这样的转换器物理地放置在它们上。每个转换器能够（1）将接收到的电磁信号转换成电子信号，然后它可以继续传输到其所在设备上的引线; 和（2）从其所在设备上的引线接收电子信号，并将其转换成相应的电磁信号，该电磁信号可以传输到另一个设备上的相应转换器。芯片和芯片封装之间没有直接的物理连接减少了物理键通常遇到的电感和电容效应。

6. 发明授权

US07606310B1 Video compression and encoding method 有权
公开(公告)号：US07606310B1
公开(公告)日：2009-10-20
申请号：US12102694
申请日：2008-04-14
申请人： Eric L Ameres , James Bankoski , Adrian W Grange , Tim Murphy , Paul G Wilkins , Yaowu Xu
发明人： Eric L Ameres , James Bankoski , Adrian W Grange , Tim Murphy , Paul G Wilkins , Yaowu Xu
IPC分类号： H04N7/12 , G06K9/36
CPC分类号： H04N7/50 , H04N19/129 , H04N19/147 , H04N19/176 , H04N19/517 , H04N19/523 , H04N19/567 , H04N19/57 , H04N19/61 , H04N19/66 , H04N19/80 , H04N19/89
摘要： A method of compressing video data having at least one frame having at least one block and each block having an array of pixels is provided. The method transforms the pixels of each block into coefficients and creates an optimal transmission order of the coefficients. The method also optimizes the speed of processing compressed video data by partitioning the data bitstream and coding each partition independently. The method also predicts fractional pixel motion by selecting an interpolation method for each given plurality or block of pixels depending upon at least one metric related to each given block and varies the method from block to block. The method also enhances error recovery for a current frame using a frame prior to the frame immediately before the current frame as the only reference frame for lessening quality loss during data transmission. Enhanced motion vector coding is also provided.

7. 发明授权

US07499492B1 Video compression and encoding method 有权
标题翻译：视频压缩和编码方法
公开(公告)号：US07499492B1
公开(公告)日：2009-03-03
申请号：US11931924
申请日：2007-10-31
申请人： Eric L Ameres , James Bankoski , Adrian W Grange , Tim Murphy , Paul G. Wilkins , Yaowu Xu
发明人： Eric L Ameres , James Bankoski , Adrian W Grange , Tim Murphy , Paul G. Wilkins , Yaowu Xu
IPC分类号： H04N7/12 , H03M7/00
CPC分类号： H04N7/50 , H04N19/129 , H04N19/147 , H04N19/176 , H04N19/517 , H04N19/523 , H04N19/567 , H04N19/57 , H04N19/61 , H04N19/66 , H04N19/80 , H04N19/89
摘要： A method of compressing video data having at least one frame having at least one block and each block having an array of pixels is provided. The method transforms the pixels of each block into coefficients and creates an optimal transmission order of the coefficients. The method also optimizes the speed of processing compressed video data by partitioning the data bitstream and coding each partition independently. The method also predicts fractional pixel motion by selecting an interpolation method for each given plurality or block of pixels depending upon at least one metric related to each given block and varies the method from block to block. The method also enhances error recovery for a current frame using a frame prior to the frame immediately before the current frame as the only reference frame for lessening quality loss during data transmission. Enhanced motion vector coding is also provided.
摘要翻译：提供了一种压缩具有至少一个具有至少一个块的帧的视频数据的方法，并且每个块具有像素阵列。该方法将每个块的像素变换为系数，并创建系数的最佳传输顺序。该方法还通过分割数据比特流并独立编码每个分区来优化处理压缩视频数据的速度。该方法还通过根据与每个给定块相关的至少一个度量来选择每个给定的多个或多个像素块的内插方法来预测分数像素运动，并且将该方法从块改变为块。该方法还使用紧邻当前帧之前的帧之前的帧将当前帧的误差恢复提高为用于减少数据传输期间的质量损失的唯一参考帧。还提供增强的运动矢量编码。

8. 发明授权

US07335985B2 Method and system for electrically coupling a chip to chip package 有权
标题翻译：用于电耦合芯片到芯片封装的方法和系统
公开(公告)号：US07335985B2
公开(公告)日：2008-02-26
申请号：US10651601
申请日：2003-08-29
申请人： Tim Murphy , Lee Gotcher
发明人： Tim Murphy , Lee Gotcher
IPC分类号： H01L23/34
CPC分类号： H01L23/48 , H01L2924/0002 , H01L2924/00
摘要： A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals. Both the chip and the chip package have at least one such converter physically disposed on them. Each converter is able to (1) convert received electromagnetic signals into electronic signals, which it then may relay to leads on the device on which it is disposed; and (2) receive electronic signals from leads on the device on which it is disposed and convert them into corresponding electromagnetic signals, which it may transmit to a corresponding converter on the other device. Not having a direct physical connection between the chip and the chip package decreases the inductive and capacitive effects commonly experienced with physical bonds.
摘要翻译：芯片和芯片封装可以通过使用能够通过发射和接收电磁信号彼此通信的一组转换器彼此传输信息。芯片和芯片封装都至少有一个这样的转换器物理地放置在它们上。每个转换器能够（1）将接收到的电磁信号转换成电子信号，然后它可以继续传输到其所在设备上的引线; 和（2）从其所在设备上的引线接收电子信号，并将其转换成相应的电磁信号，该电磁信号可以传输到另一个设备上的相应转换器。芯片和芯片封装之间没有直接的物理连接减少了物理键通常遇到的电感和电容效应。

9. 发明申请

US20060204247A1 System and method for multiple bit optical data transmission in memory systems 有权
公开(公告)号：US20060204247A1
公开(公告)日：2006-09-14
申请号：US11432015
申请日：2006-05-10
申请人： Tim Murphy
发明人： Tim Murphy
IPC分类号： H04B10/00
CPC分类号： H04B10/801
摘要： The disclosed system and method data increases data transmission speed through a memory system by using optical signals comprising a plurality of wavelengths of light so that each pulse of optical signals can represent more than a single bit of data. An optical transmitter comprises multiple, separately controllable light-emitting sections which generate light at different wavelengths. A photoreceptor, comprising sections of materials responsive to light received at different wavelengths, provides an output signal corresponding to the light signals received at the different wavelengths. The photoreceptor therefore can decode the received optical signals into a multiple bit output sequence corresponding with the multiple bit sequence originally transmitted. The disclosed method and system can be used to communicate signals between a plurality of memory devices and a memory hub within a memory module or directly to a system memory controller, and/or between a plurality of memory hubs and a system memory controller.

10. 外观设计

USD418569S T-ball matt 失效
公开(公告)号：USD418569S
公开(公告)日：2000-01-04
申请号：US87903
申请日：1998-05-11
申请人： Tim Murphy
设计人： Tim Murphy

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