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1. 发明申请

US20060197544A1 Test sockets, test systems, and methods for testing microfeature devices 审中-公开
公开(公告)号：US20060197544A1
公开(公告)日：2006-09-07
申请号：US11414987
申请日：2006-05-01
申请人： John Caldwell , Mark Tverdy , Michael Slaughter
发明人： John Caldwell , Mark Tverdy , Michael Slaughter
IPC分类号： G01R31/02
CPC分类号： G01R1/0483 , G01R31/2893
摘要： Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.

2. 发明申请

US20050206401A1 Test sockets, test systems, and methods for testing microfeature devices 失效
标题翻译：测试插座，测试系统和测试微功能设备的方法
公开(公告)号：US20050206401A1
公开(公告)日：2005-09-22
申请号：US10805872
申请日：2004-03-22
申请人： John Caldwell , Mark Tverdy , Michael Slaughter
发明人： John Caldwell , Mark Tverdy , Michael Slaughter
IPC分类号： G01R1/04 , G01R31/02 , G01R31/28
CPC分类号： G01R1/0483 , G01R31/2893
摘要： Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.
摘要翻译：测试插座，测试系统和用于利用衬底和从衬底突出的多个导电互连元件来测试微特征器件的方法。在一个实施例中，测试插座包括支撑表面和支撑表面中对应于微特征装置的至少一些互连元件的多个孔。单独的孔延伸穿过测试插座，并且其尺寸被设计成接收互连元件中的一个的一部分，使得当微特征装置被接收在测试插座中时，基板与支撑表面间隔开。在该实施例的一个方面，单个孔具有小于互连元件的横截面尺寸的横截面尺寸，使得孔仅接收相应互连元件的一部分。

3. 发明申请

US20060197545A1 Test sockets, test systems, and methods for testing microfeature devices 审中-公开
标题翻译：测试插座，测试系统和测试微功能设备的方法
公开(公告)号：US20060197545A1
公开(公告)日：2006-09-07
申请号：US11415335
申请日：2006-05-01
申请人： John Caldwell , Mark Tverdy , Michael Slaughter
发明人： John Caldwell , Mark Tverdy , Michael Slaughter
IPC分类号： G01R31/02
CPC分类号： G01R1/0483 , G01R31/2893
摘要： Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.
摘要翻译：测试插座，测试系统和用于利用衬底和从衬底突出的多个导电互连元件来测试微特征器件的方法。在一个实施例中，测试插座包括支撑表面和支撑表面中对应于微特征装置的至少一些互连元件的多个孔。单独的孔延伸穿过测试插座，并且其尺寸被设计成接收互连元件中的一个的一部分，使得当微特征装置被接收在测试插座中时，基板与支撑表面间隔开。在该实施例的一个方面，单个孔具有小于互连元件的横截面尺寸的横截面尺寸，使得孔仅接收相应互连元件的一部分。

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