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1. 发明授权

US5324767A Thermosetting resin composition for casting high-voltage coil, and molded coil and panel formed by casting and curing the composition 失效
标题翻译：用于铸造高压线圈的热固性树脂组合物，以及通过浇铸和固化组合物形成的模制线圈和板
公开(公告)号：US5324767A
公开(公告)日：1994-06-28
申请号：US887769
申请日：1992-05-22
申请人： Tohru Koyama , Hirokazu Takasaki , Hiroshi Suzuki , Shigeo Amagi , Akio Mukoh , Ikushi Kano
发明人： Tohru Koyama , Hirokazu Takasaki , Hiroshi Suzuki , Shigeo Amagi , Akio Mukoh , Ikushi Kano
IPC分类号： C08G59/24 , C08G59/00 , C08G59/20 , C08G59/42 , C08K3/34 , C08K3/36 , C08K5/00 , C08L63/00 , H01B3/00 , H01B3/40 , H01B17/60 , H01F27/32 , H02K15/12
CPC分类号： H02K15/12 , C08K3/36 , H01B3/40 , H01F27/327
摘要： A thermoplastic resin composition for casting high-voltage coils containing two kinds of fillers (A) and (B), and products as molded coils and panels obtained by casting and curing the composition.The composition of the present invention contains 60%-85% by weight, based on the total weight of the composition, of a silica type filler which is an admixture (A) a spherical silica having an average particle diameter of 0.1-0.9 .mu.m and (B) a ground silica having an average particle diameter of 3-9 .mu., the ratio A/(A+B) being 1%-7% by weight.Products as molded coils and panels prepared by using the composition have good resistance to cracking and resistance to moisture.
摘要翻译：一种用于铸造含有两种填料（A）和（B）的高压线圈的热塑性树脂组合物，以及通过浇铸和固化该组合物获得的模制线圈和面板的产品。基于组合物的总重量，本发明的组合物含有60重量％-85重量％的二氧化硅型填料，其是平均粒径为0.1-0.9μm的混合物（A）的球形二氧化硅和（B）平均粒径为3-9μm的研磨二氧化硅，A /（A + B）的比例为1〜7重量％。通过使用该组合物制备的模制线圈和面板的产品具有良好的抗开裂性和耐潮湿性。

2. 发明申请

US20120300522A1 Semiconductor Device, Power Semiconductor Module and Power Conversion Device Equipped with Power Semiconductor Module 有权
标题翻译：半导体器件，功率半导体模块和配备功率半导体模块的电源转换器件
公开(公告)号：US20120300522A1
公开(公告)日：2012-11-29
申请号：US13499520
申请日：2010-08-24
申请人： Takeshi Tokuyama , Kinya Nakatsu , Ryuichi Saito , Toshiya Satoh , Hideaki Ishikawa , Nobutake Tsuyuno , Shigeo Amagi
发明人： Takeshi Tokuyama , Kinya Nakatsu , Ryuichi Saito , Toshiya Satoh , Hideaki Ishikawa , Nobutake Tsuyuno , Shigeo Amagi
IPC分类号： H01L23/52 , H02M7/48
CPC分类号： H02M7/003 , H01L23/473 , H01L23/49562 , H01L23/49575 , H01L24/34 , H01L25/072 , H01L2224/33 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2224/84801 , H01L2224/8484 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K7/1432 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor device includes: a case with an opening formed thereat; a semiconductor element housed inside the case; a first conductor plate housed inside the case and positioned at one surface side of the semiconductor element; a second conductor plate housed inside the case and positioned at another surface side of the semiconductor element; a positive bus bar electrically connected to the first conductor plate, through which DC power is supplied; a negative bus bar electrically connected to the second conductor plate, through which DC power is supplied; a first resin member that closes off the opening at the case; and a second resin member that seals the semiconductor element, the first conductor plate and the second conductor plate and is constituted of a material other than a material constituting the first resin member.
摘要翻译：一种半导体器件包括：形成有开口的壳体; 容纳在壳体内的半导体元件; 容纳在壳体内并位于半导体元件的一个表面侧的第一导体板; 第二导体板，容纳在所述壳体内并且位于所述半导体元件的另一表面侧; 电连接到第一导体板的正母线，通过其提供直流电力; 电连接到第二导体板的负母线，通过其提供直流电力; 封闭壳体上的开口的第一树脂构件; 以及第二树脂构件，其密封半导体元件，第一导体板和第二导体板，并且由构成第一树脂构件的材料以外的材料构成。

3. 发明授权

US07147929B2 Method of manufacturing a resin-molded stator 失效
标题翻译：树脂成形定子的制造方法
公开(公告)号：US07147929B2
公开(公告)日：2006-12-12
申请号：US11217449
申请日：2005-09-02
申请人： Shigeo Amagi , Osamu Koizumi
发明人： Shigeo Amagi , Osamu Koizumi
IPC分类号： G11B7/253 , G11B7/24 , H02K3/30 , H02K5/00 , H02K15/00 , G11B11/105 , G11B11/00 , C08J11/00
CPC分类号： H02K15/14 , H02K5/08 , Y10T29/49009 , Y10T428/256 , Y10T428/31681 , Y10T428/31786
摘要： A highly reliable resin-molded stator not suffering insulation breakdown between the different phases of the stator coils even when the operation mode where the output of a rotary machine using a resin-molded stator in which a stator coil wound around a plurality of slots and a stator coil provided at the stator core end are resin-molded is to be increased from the level under a stopped status to the maximum achievable level within a short time is repeated. Also disclosed is a method of manufacturing such a stator, and a rotary machine using the same. The resin-molded stator of the present invention comprises a stator core, electrically insulated stator coils wound around the plurality of slots or protrusions provided in the axial direction of the stator core, and molding resin with which are molded the stator core and the stator coils located at the aforementioned slots or protrusions and at the stator core end, wherein the resin-molded stator is characterized in that non-adhesive structure is established between the molding resin and at least one of the end faces of the stator core.
摘要翻译：即使在使用其中缠绕在多个槽上的定子线圈的树脂模制定子的旋转机械的输出的操作模式和一个定子线圈的不同相位之间，也不会发生定子线圈的不同相之间的绝缘击穿的高度可靠的树脂模制定子设置在定子芯端的定子线圈被树脂模制从在停止状态下的水平增加到在短时间内的最大可实现水平。还公开了制造这种定子的方法和使用该定子的旋转机械。本发明的树脂模制定子包括定子芯，缠绕在沿定子芯轴向设置的多个槽或突起的电绝缘定子线圈，以及模制树脂，其中模制定子芯和定子线圈位于上述槽或突起处和定子铁芯端，其中树脂模制定子的特征在于，在模制树脂与定子芯的至少一个端面之间建立非粘合结构。

4. 发明授权

US06288341B1 Insulating material windings using same and a manufacturing method thereof 有权
标题翻译：使用其绝缘材料绕组及其制造方法
公开(公告)号：US06288341B1
公开(公告)日：2001-09-11
申请号：US09457259
申请日：1999-12-09
申请人： Tomoya Tsunoda , Keiichi Morikawa , Mitsuru Onoda , Shigeo Amagi , Tatsuo Honda
发明人： Tomoya Tsunoda , Keiichi Morikawa , Mitsuru Onoda , Shigeo Amagi , Tatsuo Honda
IPC分类号： H01B1762
CPC分类号： H02K3/40 , H02K3/345
摘要： In order to provide windings for electrical rotating machines having an insulating film superior in electrical characteristics, a high heat conductive insulating film 11 is formed at outer periphery of wound conductor 10 using a high heat conductive insulating tape, which includes a mica layer 3, a reinforcement layer 5, and a high heat conductive filler layer 7, wherein the resin content in each layer of the mica layer 3 and the high heat conductive filler layer 7 is specified in the range of 10-25% by weight based on the whole weight of the material. 1-80% by weight of said filler is spherical.
摘要翻译：为了提供具有优异的电气特性的绝缘膜的旋转电机的绕组，使用高导热绝缘带在缠绕导体10的外周形成高导热绝缘膜11，该导热绝缘带包括云母层3，加强层5和高导热性填充层7，其中云母层3和高导热性填充层7的各层中的树脂含量以10-25重量％为基准，以整体重量为基准的材料。所述填料的1-80重量％为球形。

5. 发明授权

US08784715B2 Structure of parts made from plural composite pieces and method of building those parts 有权
标题翻译：由多个复合件制成的零件的结构和构建这些零件的方法
公开(公告)号：US08784715B2
公开(公告)日：2014-07-22
申请号：US12616826
申请日：2009-11-12
申请人： Katsuhide Oohashi , Shigeo Amagi , Osamu Miyo
发明人： Katsuhide Oohashi , Shigeo Amagi , Osamu Miyo
IPC分类号： B29C45/14
CPC分类号： H05K5/0069 , B29C45/14639 , B29C45/1671 , B29C70/72 , B29C71/0063 , B29C2045/14893 , B29K2995/0041 , H01R43/24
摘要： A pre-molded part is formed by pre-molding an insert with a pre-molded member, and then the pre-molded part is inserted into an over-molded member composed of thermo plastic resin. After applying a heat treatment with a temperature lower than a crystalline melting point of the pre-molded part to the pre-molded part surrounding the insert, a firm contact between the insert and the resin surrounding the insert without a gap at the interface between those parts is obtained.
摘要翻译：通过用预成型体预成型插入物形成预成型部，然后将预成型部插入由热塑性树脂构成的覆盖成型体。在将低于预成型部件的结晶熔点的温度进行热处理之后，将其插入到围绕插入件的预成型部件之间，在插入件与树脂周围的固定接触件之间的界面处没有间隙获得零件。

6. 发明授权

US06504102B2 Insulating material, windings using same, and a manufacturing method thereof 有权
标题翻译：绝缘材料，使用其的绕组及其制造方法
公开(公告)号：US06504102B2
公开(公告)日：2003-01-07
申请号：US09944135
申请日：2001-09-04
申请人： Tomoya Tsunoda , Keiichi Morikawa , Mitsuru Onoda , Shigeo Amagi , Tatsuo Honda
发明人： Tomoya Tsunoda , Keiichi Morikawa , Mitsuru Onoda , Shigeo Amagi , Tatsuo Honda
IPC分类号： H01B1754
CPC分类号： H02K3/40 , H02K3/345
摘要： In order to provide windings for electrical rotating machines having an insulating film superior in electrical characteristics, a high heat conductive insulating film 11 is formed at outer periphery of wound conductor 10 using a high heat conductive insulating tape, which includes a mica layer 3, a reinforcement layer 5, and a high heat conductive filler layer 7, wherein the resin content in each layer of the mica layer 3 and the high heat conductive filler layer 7 is specified in the range of 10-25% by weight based on the whole weight of the material. 1-80% by weight of said filler is spherical.
摘要翻译：为了提供具有优异的电气特性的绝缘膜的旋转电机的绕组，使用高导热绝缘带在缠绕导体10的外周形成高导热绝缘膜11，该导热绝缘带包括云母层3，加强层5和高导热性填充层7，其中云母层3和高导热性填充层7的各层中的树脂含量以10-25重量％为基准，以整体重量为基准的材料。所述填料的1-80重量％为球形。

7. 发明授权

US06492008B1 Multilayer printed wiring board and electronic equipment 有权
标题翻译：多层印刷线路板和电子设备
公开(公告)号：US06492008B1
公开(公告)日：2002-12-10
申请号：US09686931
申请日：2000-10-12
申请人： Shigeo Amagi , Satoshi Murakawa
发明人： Shigeo Amagi , Satoshi Murakawa
IPC分类号： B32B300
CPC分类号： H05K3/4688 , B32B7/02 , B32B15/08 , H05K1/0271 , H05K2201/029 , H05K2201/0352 , H05K2201/068 , H05K2201/09318 , Y10S428/901 , Y10T428/24917
摘要： The thermal expansion coefficient of a composite insulator layer is adjusted in order to suppress warping deformation in a multilayer printed wiring board caused by temperature change. The thicknesses and the covering ratios on the both sides of the electric conductor layer composing the multilayer printed wiring board are asymmetric with respect to the central plane. A multilayer printed wiring board is formed by laminating composite insulation layers and laminated bodies, the composite insulation layer being made of a cloth a resin impregnated into the cloth, the laminated body being composed of electric conductor layers formed by coating on a surface of the composite insulation layer. The thermal expansion coefficient of the composite insulation layer having a conductor layer with a higher covering ratio is set to be smaller than the thermal expansion coefficient of the composite insulation layer having a conductor layer with a lower covering ratio.
摘要翻译：调整复合绝缘体层的热膨胀系数，以抑制由温度变化引起的多层印刷电路板中的翘曲变形。构成多层印刷电路板的导电体层的两面的厚度和覆盖率相对于中心面不对称。多层印刷线路板是通过层压复合绝缘层和层叠体形成的，复合绝缘层由浸渍在布中的树脂制成，层叠体由通过在复合材料的表面上涂覆而形成的导电体层构成绝缘层。将具有较高覆盖率的导体层的复合绝缘层的热膨胀系数设定为小于具有较低覆盖率的导体层的复合绝缘层的热膨胀系数。

8. 发明授权

US06426578B1 Electric rotating machine 有权
标题翻译：电动旋转机
公开(公告)号：US06426578B1
公开(公告)日：2002-07-30
申请号：US09851250
申请日：2001-05-09
申请人： Hideaki Mori , Shigeo Amagi , Saburo Usami , Tadashi Sonobe , Yasuomi Yagi , Tomoya Tsunoda , Mitsuru Onoda
发明人： Hideaki Mori , Shigeo Amagi , Saburo Usami , Tadashi Sonobe , Yasuomi Yagi , Tomoya Tsunoda , Mitsuru Onoda
IPC分类号： H02K348
CPC分类号： H02K9/10 , H02K3/30 , H02K3/34 , Y10T29/49012
摘要： An electric rotating machine having a rotor, rotatably disposed in an inner radius side of a stator through a gap, including rotor windings contained in a plurality of slots formed in a rotor core, a slot insulation placed between the rotor winding and the slot, an insulation block placed between a wedge arranged at a peripheral side of the rotor core outward of the rotor winding of the slot and the rotor winding. At least one of the slot insulation and the insulation block is an insulation formed by filling or mixing granular and/or short-fiber insulating materials having a thermal conductivity higher than 5 W/m·K in a resin and a thermal conductivity in a thickness direction higher than 0.35 W/m·K.
摘要翻译：一种具有转子的旋转电机，其通过间隙可旋转地设置在定子的内半径侧，包括容纳在形成在转子芯中的多个槽中的转子绕组，设置在转子绕组和槽之间的槽绝缘体绝缘块放置在设置在转子芯的外围侧的楔形件之间的槽的转子绕组和转子绕组之间。槽绝缘和绝缘块中的至少一个是通过在树脂中填充或混合导热率高于5W / mK的颗粒和/或短纤维绝缘材料而形成的绝缘体，并且在厚度方向的热导率较高比0.35 W / mK

9. 发明授权

US5768108A Multi-layer wiring structure 失效
标题翻译：多层布线结构
公开(公告)号：US5768108A
公开(公告)日：1998-06-16
申请号：US720028
申请日：1996-09-27
申请人： Osamu Miura , Kunio Miyazaki , Akio Takahashi , Motoyo Wajima , Ryuji Watanabe , Takao Miwa , Yuichi Satsu , Shigeo Amagi
发明人： Osamu Miura , Kunio Miyazaki , Akio Takahashi , Motoyo Wajima , Ryuji Watanabe , Takao Miwa , Yuichi Satsu , Shigeo Amagi
IPC分类号： H05K1/05 , H01L21/48 , H01L23/538 , H05K1/11 , H05K3/40 , H05K3/42 , H05K3/46 , H05K1/00 , H05K1/09 , H05K1/16
CPC分类号： H01L21/4857 , H01L23/5385 , H05K3/4641 , H01L2224/16225 , H05K1/113 , H05K2201/068 , H05K2201/09536 , H05K2201/096 , H05K3/4069 , H05K3/429 , H05K3/4623
摘要： A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes. In this structure, the wiring structure having the core material of a low thermal expansive metal is used as a base, and therefore a dimensional change of a board is small, and microscopic wiring layers can be formed, and the reliability of connection between the sub-assemblies is enhanced. Furthermore, the board can be produced at low costs.
摘要翻译：在电子计算机，工作站等中使用用于安装电子装置的多层布线结构，特别是具有微细布线层的多层封装板，该板具有优异的尺寸稳定性和高可靠性，以及制造这种基板的方法。多层布线结构包括至少两个子组件的复合体，每个子组件具有通过绝缘层分别形成在低热膨胀金属的芯材的相对侧上的布线层，使得布线层对应于区域相互之间的比例。子组件通过导体经由通孔彼此连接。在这种结构中，将具有低热膨胀金属的芯材的布线结构用作基底，因此板的尺寸变化小，并且可以形成微细的布线层，并且子层之间的连接的可靠性大会组合得到增强。此外，该板可以低成本生产。

10. 发明授权

US07723619B2 Composite moldings and a method of manufacturing the same 有权
标题翻译：复合模制品及其制造方法
公开(公告)号：US07723619B2
公开(公告)日：2010-05-25
申请号：US10589883
申请日：2004-03-19
申请人： Katsuhide Ohashi , Shigeo Amagi , Osamu Miyo , Sadayuki Aoki
发明人： Katsuhide Ohashi , Shigeo Amagi , Osamu Miyo , Sadayuki Aoki
IPC分类号： H05K1/16
CPC分类号： B29C45/0025 , B29C45/14377 , B29C45/14639 , B29C2045/14893 , B29L2031/3061 , H01R13/405 , H01R43/24
摘要： Continuous annular resin bands surrounding electrical contact portions of respective terminals are disposed without gaps between the electrical contact portions of respective terminals and resin members that fixedly hold the terminals; there are formed gaps among the adjoining resin bands. Gaps are formed among a bundle of terminals having annular resin bands and resin members surrounding the bundle. A partial adhesion is formed at the interface between the terminals and the resin by a low cost manufacturing method, whereby a molding with high air-tightness between the interior and exterior thereof and high reliability is realized.
摘要翻译：围绕各个端子的电接触部分的连续的环形树脂带在各端子的电接触部分和固定住端子的树脂构件之间没有间隙地设置; 在相邻的树脂带之间形成间隙。在具有环形树脂带和围绕束的树脂构件的一束端子之间形成间隙。通过低成本制造方法在端子和树脂之间的界面处形成部分粘附，从而实现其内部和外部之间具有高气密性的模制品和高可靠性。

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