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1. 发明授权

US08784973B2 Resin bonding method by photoirradiation, method for producing resin article, resin article produced by the same method, method for producing microchip, and microchip produced by the same method 有权
标题翻译：通过光照射的树脂粘合方法，树脂制品的制造方法，通过相同的方法制造的树脂制品，微芯片的制造方法和通过相同的方法制造的微芯片
公开(公告)号：US08784973B2
公开(公告)日：2014-07-22
申请号：US13396488
申请日：2012-02-14
申请人： Hiroyuki Sugimura , Yoshihiro Taguchi , Yoshinao Taniguchi
发明人： Hiroyuki Sugimura , Yoshihiro Taguchi , Yoshinao Taniguchi
IPC分类号： B32B3/00 , B29C65/00 , B29C65/14 , B29C65/76 , C09J5/06 , B81C3/00 , C08J3/28 , C08J5/12 , C08J7/12 , B29L31/30 , B29L17/00 , B29K69/00 , B29C35/08
CPC分类号： B29C66/00143 , B29C65/14 , B29C65/1406 , B29C65/1496 , B29C65/76 , B29C66/001 , B29C66/1122 , B29C66/45 , B29C66/53461 , B29C66/71 , B29C66/73117 , B29C66/73161 , B29C66/73365 , B29C66/73771 , B29C66/7392 , B29C66/7394 , B29C66/82661 , B29C66/8322 , B29C66/91 , B29C66/9141 , B29C66/91411 , B29C66/91645 , B29C66/919 , B29C66/91945 , B29C66/953 , B29C2035/0827 , B29K2069/00 , B29L2017/00 , B29L2031/3061 , B81B2201/0214 , B81B2201/058 , B81C3/001 , B81C2203/032 , C08J3/28 , C08J5/121 , C08J7/123 , C09J5/06 , C09J2205/31 , C09J2400/226 , C09J2423/006 , Y02P20/582 , Y10T428/24562 , Y10T428/24612 , Y10T428/31504 , Y10T428/31909 , B29C65/00 , B29K2023/38
摘要： A resin bonding method according to the present invention is a resin bonding method for bonding a first resin and a second resin including (I) a step of irradiating spaces containing oxygen molecules with vacuum ultraviolet light having a wavelength of 175 nm or less, the spaces being in contact with surfaces of the first and second resins; and (II) a step of, after the irradiation, subjecting the surfaces to temperature rise while the surfaces are in contact with each other, to bond the first resin and the second resin together with the surfaces serving as bonding surfaces. In the step (I), the surfaces of the first and second resins may be further irradiated with the vacuum ultraviolet light. In this case, a light amount of the vacuum ultraviolet light having reached the surfaces is preferably, for example, 0.1 J/cm2 or more and 10 J/cm2 or less.
摘要翻译：本发明的树脂接合方法是将第一树脂和第二树脂接合的树脂接合方法，其包括（I）使用具有175nm以下的波长的真空紫外线照射含氧分子的空间的步骤，与第一和第二树脂的表面接触; 和（II）在照射之后，当表面彼此接触时使表面经历温度升高的步骤，将第一树脂和第二树脂与作为粘合表面的表面结合。在步骤（I）中，可以进一步用真空紫外光照射第一和第二树脂的表面。在这种情况下，到达表面的真空紫外光的光量优选为例如0.1J / cm 2以上且10J / cm 2以下。

2. 发明授权

US08576372B2 Casing structure for electronic devices 有权
标题翻译：电子设备外壳结构
公开(公告)号：US08576372B2
公开(公告)日：2013-11-05
申请号：US13765337
申请日：2013-02-12
申请人： Lenovo (Singapore) Pte. Ldt.
发明人： Gang Ji , Tetsuya Ohtani , Takayuki Morino , Akinori Uchino
IPC分类号： G02F1/13 , G02F1/1333
CPC分类号： B29C45/0001 , B29C45/0005 , B29C45/14311 , B29C45/14336 , B29C45/14786 , B29C45/14811 , B29K2105/06 , B29K2307/00 , B29K2309/08 , B29K2715/003 , B29K2995/0005 , B29K2995/0007 , B29L2009/00 , B29L2031/3061 , B29L2031/3475 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1698
摘要： An aspect provides a method, including: fixing a laminated panel, which has been cut into a predetermined shape, to a mold, said laminated panel having an expanded layer disposed between layers made of a conductive resin; injection of molding non-conducting resin into the mold in which the laminated panel has been fixed; wherein a non-conductive region and a conductive region are joined to form a bottom surface of a display casing, said display casing having an inner and outer surface; and wherein an antenna mounting space is formed in the non-conductive region. Other aspects are described and claimed.
摘要翻译：一方面提供一种方法，包括：将已经切割成预定形状的层压板固定到模具，所述层压板具有设置在由导电树脂制成的层之间的发泡层; 将成型非导电树脂注入到已经固定有层压板的模具中; 其中非导电区域和导电区域被接合以形成显示器壳体的底表面，所述显示器壳体具有内表面和外表面; 并且其中在所述非导电区域中形成天线安装空间。描述和要求保护其他方面。

3. 发明申请

US20130147079A1 CASING STRUCTURES FOR ELECTRONIC DEVICES 有权
标题翻译：电子设备的结构
公开(公告)号：US20130147079A1
公开(公告)日：2013-06-13
申请号：US13765337
申请日：2013-02-12
申请人： Lenovo (Singapore) Pte. Ltd.
发明人： Gang Ji , Tetsuya Ohtani , Takayuki Morino , Akinori Uchino
IPC分类号： B29C45/00
CPC分类号： B29C45/0001 , B29C45/0005 , B29C45/14311 , B29C45/14336 , B29C45/14786 , B29C45/14811 , B29K2105/06 , B29K2307/00 , B29K2309/08 , B29K2715/003 , B29K2995/0005 , B29K2995/0007 , B29L2009/00 , B29L2031/3061 , B29L2031/3475 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1698
摘要： An aspect provides a method, including: fixing a laminated panel, which has been cut into a predetermined shape, to a mold, said laminated panel having an expanded layer disposed between layers made of a conductive resin; injection of molding non-conducting resin into the mold in which the laminated panel has been fixed; wherein a non-conductive region and a conductive region are joined to form a bottom surface of a display casing, said display casing having an inner and outer surface; and wherein an antenna mounting space is formed in the non-conductive region. Other aspects are described and claimed.
摘要翻译：一方面提供一种方法，包括：将已经切割成预定形状的层压板固定到模具，所述层压板具有设置在由导电树脂制成的层之间的发泡层; 将成型非导电树脂注入到已经固定有层压板的模具中; 其中非导电区域和导电区域被接合以形成显示器壳体的底表面，所述显示器壳体具有内表面和外表面; 并且其中在所述非导电区域中形成天线安装空间。描述和要求保护其他方面。

4. 发明授权

US08357015B2 Metal-resin compound member 有权
标题翻译：金属树脂复合部件
公开(公告)号：US08357015B2
公开(公告)日：2013-01-22
申请号：US12734731
申请日：2008-11-21
申请人： Yoshihiko Kohmura , Shingo Yoshida , Yusuke Fuji , Takaya Hirai , Wataru Kawagishi
发明人： Yoshihiko Kohmura , Shingo Yoshida , Yusuke Fuji , Takaya Hirai , Wataru Kawagishi
IPC分类号： H05K7/14
CPC分类号： B29C45/006 , B29C33/44 , B29C45/14311 , B29C45/14639 , B29C45/14778 , B29C65/04 , B29C65/08 , B29C65/16 , B29C65/48 , B29C66/53461 , B29C66/54 , B29K2305/00 , B29K2705/00 , B29L2031/3061 , B29L2031/3481 , H01R13/405 , H01R13/6599 , H01R13/74 , H01R43/0221 , H05K5/0069 , Y10T428/19 , Y10T428/24996 , Y10T428/31678
摘要： A case comprised of a metal-resin composite body having a connector including a terminal fitting, the connector being integrated with an opening of a wall of a case main body so that the connector sandwiches an edge of the wall. The connector is comprised of a base resin formed by injection molding so as to sandwich the wall. A separately-manufactured connector is welded to the base resin. Forming the base resin on the case main body provides a less complicated configuration of the case compared to a case where a connector is formed directly to the case main body.
摘要翻译：一种由具有连接器的金属树脂复合体构成的壳体，该连接器包括端子接头，所述连接器与壳体主体的壁的开口整合，使得连接器夹住壁的边缘。连接器由通过注射成型形成的基础树脂组成以夹住壁。单独制造的连接器焊接到基础树脂上。与将壳体主体直接形成连接器的情况相比，在壳体主体上形成基础树脂，形成了较不复杂的壳体结构。

5. 发明授权

US08181334B2 Method for producing windings for a dry-type transformer 有权
标题翻译：干式变压器绕组生产方法
公开(公告)号：US08181334B2
公开(公告)日：2012-05-22
申请号：US13116564
申请日：2011-05-26
申请人： Benjamin Weber , Frank Cornelius , Jens Tepper , Oliver Becker , Paul Szasz
发明人： Benjamin Weber , Frank Cornelius , Jens Tepper , Oliver Becker , Paul Szasz
IPC分类号： G11B5/127
CPC分类号： H01F41/122 , B29C35/12 , B29C53/58 , B29C59/10 , B29C70/865 , B29C71/0081 , B29L2031/3061 , H01F27/323 , H01F27/327 , H01F41/127 , Y10T29/4906 , Y10T29/49071
摘要： A method is provided for producing windings for a dry-type transformer with in each case one winding for the low voltage (LV winding) and one for the high voltage (HV winding). The LV and HV windings are each electrically insulated from one another and have layers which are electrically insulated from one another by virtue of, initially, the winding for the low voltage being produced from electrically conductive wire or tape material and an insulating layer including resin-impregnated fibre material. Prior to the application of the HV winding, the maximum insulating thickness for the layer insulation and the number of fiber rovings corresponding to this insulating thickness can be determined, and each winding layer and the associated insulating layer can be produced simultaneously with a physical offset with respect to one another. To produce the winding, fiber polymer layers can be applied, as layers of insulation, simultaneously with the winding conductor between the individual winding layers of the winding, and the finished winding is subjected to a curing operation.
摘要翻译：提供了一种用于干式变压器绕组的方法，在每种情况下都有一个用于低压（LV绕组）的绕组和一个用于高压（HV绕组）的绕组。 LV和HV绕组各自彼此电绝缘并且具有彼此电绝缘的层，其原因在于，最初由导电线或带材料制成的用于低电压的绕组和包括树脂 - 浸渍纤维材料。在施加HV绕组之前，可以确定层间绝缘的最大绝缘厚度和对应于该绝缘厚度的纤维粗纱的数量，并且每个绕组层和相关绝缘层可以与物理偏移同时产生，相互尊重为了制造绕组，可以将纤维聚合物层作为绝缘层施加与绕组的各个绕组层之间的绕组导体同时施加，并且完成的绕组进行固化操作。

6. 发明授权

US07842146B2 Ultrasonic energy for adhesive bonding 有权
标题翻译：用于粘合剂的超声波能量
公开(公告)号：US07842146B2
公开(公告)日：2010-11-30
申请号：US11961114
申请日：2007-12-20
申请人： Saeed J. Siavoshani , Syed Z. Mahdi
发明人： Saeed J. Siavoshani , Syed Z. Mahdi
IPC分类号： B32B37/00
CPC分类号： C09J5/06 , B29C65/08 , B29C65/4815 , B29C65/483 , B29C65/4835 , B29C65/485 , B29C65/4865 , B29C65/5057 , B29C66/1122 , B29C66/341 , B29C66/43 , B29C66/91411 , B29C66/91445 , B29C66/91645 , B29C66/91651 , B29C66/91653 , B29C66/9513 , B29C66/9516 , B29K2105/243 , B29L2031/286 , B29L2031/30 , B29L2031/3061 , B29L2031/44 , B29L2031/5218 , F16B11/006
摘要： An adhesive is contacted with a surface of a substrate and ultrasonic energy is applied to the adhesive to enhance the bonding of the adhesive to the surface of the substrate. The ultrasonic energy, particularly ultrasonic vibrations, can assist the adhesive in wetting the substrate surface, curing, polymerization or the like to enhance bonding.
摘要翻译：将粘合剂与基材的表面接触，并将超声能量施加到粘合剂上以增强粘合剂与基材表面的粘结。超声能量，特别是超声波振动可以帮助粘合剂润湿基底表面，固化，聚合等以增强粘合。

7. 发明申请

US20100213042A1 Electric Hand Control, Especially for Electrically Adjustable Hospital and Care Beds 有权
标题翻译：电动手控，特别适用于电动医院和护理床
公开(公告)号：US20100213042A1
公开(公告)日：2010-08-26
申请号：US12084787
申请日：2006-11-10
申请人： Verner Smidt , Bjarne Carstensen
发明人： Verner Smidt , Bjarne Carstensen
IPC分类号： H01H13/76 , H01H9/02
CPC分类号： H01H9/0228 , A47C31/008 , A61G2203/12 , B29L2031/3061 , H01H2223/003 , H01H2223/04 , H01H2231/032
摘要： An electric hand control, especially for electrically adjustable hospital and care beds and comprising a housing (1) constructed as a single trough shaped shell with a bottom and side walls, and wherein a printed circuit (2) with switches is mounted and above the switches there is a plate with tongue like shaped keys, and finally there is a cover foil (6) with indication of the keys and secured to the upper edge of the sides of the shell. As the housing is a single shell for one thing manufacturing of two difficult parts is avoided, for another assembling of these are avoided in the assembling process, and finally an assembling with a risk of leak is avoided. By further equipping the printed circuit and the cable with a plug (12a) the assembly is made easier. In this connection it is expedient that the spout (10) is equipped with an oval through going hole, so that the plug at the end of the cable can be led through the spout.
摘要翻译：一种电动手控制器，特别是用于电气可调的医院和护理床，并且包括构造为具有底部和侧壁的单个槽形壳体的壳体（1），并且其中安装有开关的印刷电路（2）并且在开关存在具有舌状的板状的键，最后有一个带有指示键并固定在壳体侧面的上边缘的盖板（6）。由于壳体是单壳体，因此避免了制造两个困难部件的一个壳体，因此在组装过程中避免了这些组件的另一组装，并且最终避免了具有泄漏风险的组装。通过使印刷电路和电缆进一步装配有插头（12a），组件变得更容易。在这方面，有利的是，喷口（10）配备有椭圆形通孔，使得电缆端部的插头可以通过喷口引导。

8. 发明申请

US20100172015A1 ELECTROPHORETIC DISPLAY 有权
标题翻译：电泳显示
公开(公告)号：US20100172015A1
公开(公告)日：2010-07-08
申请号：US12651617
申请日：2010-01-04
申请人： Patrick Shui Chung WANG
发明人： Patrick Shui Chung WANG
IPC分类号： G02F1/167
CPC分类号： G09F9/30 , B23K20/10 , B23K2101/40 , B29C65/08 , B29C65/48 , B29K2023/06 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2067/00 , B29K2069/00 , B29K2079/08 , B29K2081/06 , B29K2995/0025 , B29K2995/0026 , B29L2031/3061 , G02F1/1339 , G02F1/1341 , G02F1/167 , G02F2202/28 , G09F9/372
摘要： An electronic device includes a first substrate made of thin plastic sheet; a second substrate made of thin plastic sheet opposing the first substrate; a chamber formed between portions of the first and second substrates; and a sealing structure configured to seal the chamber at the interface between the first and second substrates, wherein the sealing structure surrounds the chamber and comprises a recess formed in one of the substrates and a protrusion formed on the other of the substrates, the protrusion engaging the recess.
摘要翻译：电子装置包括由薄塑料片制成的第一基片; 由与所述第一基板相对的薄塑料片制成的第二基板; 形成在第一和第二基板的部分之间的室; 以及密封结构，其构造成在所述第一和第二基板之间的界面处密封所述室，其中所述密封结构围绕所述室并且包括形成在所述基板中的一个中的凹部和形成在所述基板中的另一个上的突起，所述突起接合凹槽

9. 发明申请

US20100096771A1 METHOD FOR FABRICATING INJECTION-MOLDED PRODUCT 有权
标题翻译：用于制造注射成型产品的方法
公开(公告)号：US20100096771A1
公开(公告)日：2010-04-22
申请号：US12582957
申请日：2009-10-21
申请人： Jong-Min CHOI , Kwang-Jin BAE
发明人： Jong-Min CHOI , Kwang-Jin BAE
IPC分类号： B29C45/16
CPC分类号： B29C45/372 , B29C45/0053 , B29C45/006 , B29C2045/0079 , B29C2045/0093 , B29K2995/002 , B29K2995/0025 , B29K2995/0026 , B29L2031/3061
摘要： A method for fabricating an injection-molded product for a mold in which a pattern carved therein is prepared. An interim injection-molded product with a pattern arranged on an inner face thereof is fabricated using the mold having the carved pattern. Paint or a coloring agent is deposited on the inner face of the molded interim injection-molded product. The pattern on the injection-molded product finished by depositing paint is visible from an exterior of the finished product.
摘要翻译：制备其中刻有图案的模具的注塑产品的制备方法。使用具有雕刻图案的模具制造具有布置在其内表面上的图案的中间注塑产品。油漆或着色剂沉积在模制的中间注塑产品的内表面上。通过沉积涂料成型的注射成型产品上的图案可从成品的外部看到。

10. 发明授权

US07618575B2 Method for wafer scale molding of protective caps 有权
标题翻译：保护盖的晶片刻度成型方法
公开(公告)号：US07618575B2
公开(公告)日：2009-11-17
申请号：US10898214
申请日：2004-07-26
申请人： Kia Silverbrook
发明人： Kia Silverbrook
IPC分类号： B29C51/08 , B29C57/00
CPC分类号： B29C43/36 , B29C33/0022 , B29C33/38 , B29C43/50 , B29C2035/0822 , B29C2043/503 , B29K2105/256 , B29K2883/00 , B29L2031/3061 , B29L2031/3425 , B29L2031/56 , H01L21/4803 , H01L2924/16235
摘要： A method of molding provides two molds (102, 104) formed of semiconductor material. The molds (102, 104) have substantially planar working faces (108, 110) into which recesses (106, 112) are formed. In use the molds (102, 104) are pressed together with the working faces (108, 110) opposed so the recesses (106, 112) form mold cavities. The molds (102, 104) only contact each other in the plane of the working faces (108, 110). A thermoplastic sheet placed between the molds is heated to deform the sheet into the mold cavities.
摘要翻译：一种成型方法提供由半导体材料形成的两个模具（102,104）。模具（102,104）具有基本上平面的工作面（108,110），凹部（106,112）形成在其中。在使用中，模具（102,104）与相对的工作面（108,110）压在一起，使得凹部（106,112）形成模腔。模具（102,104）仅在工作面（108,110）的平面内彼此接触。放置在模具之间的热塑性片材被加热以使片材变形成模腔。

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