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    • 2. 发明申请
    • FULLY AUTOMATED PASTE DISPENSE SYSTEM FOR DISPENSING SMALL DOTS AND LINES
    • 完全自动化的粉煤灰处理系统,用于分配小动物和线条
    • US20080054023A1
    • 2008-03-06
    • US11931096
    • 2007-10-31
    • Thomas WeissJames HumenikMark LaPlanteDavid Long
    • Thomas WeissJames HumenikMark LaPlanteDavid Long
    • B05C5/00G01F11/00B67D5/42B05C11/00
    • B05C11/1034H05K1/092H05K3/1241H05K2203/0126
    • A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet. The method then provides for retracting the punch until the punch face is substantially coplanar with the orifice member second surface, and then cleaning the punch face and coplanar orifice member second surface to remove any residual paste thereon.
    • 一种从分配装置将可流动的导电膏分配到毛坯上的方法,该分配装置包括具有第一表面和第二表面的孔口构件和在其之间的孔,在邻近孔口构件第一表面的加压室和含有该糊料的冲头, 面可通过孔口构件孔移动。 该方法包括将冲头定位在孔口构件孔的外部,使得冲头表面与孔构件第一表面间隔开,将期望量的浆料流动到冲头表面上,通过孔口构件孔移动冲压面上的浆料,直到 冲头面延伸超过孔口构件第二表面,并且在仍然在冲压面上的同时使工件与浆料接触以将浆料沉积在毛坯上。 该方法然后提供回缩冲头,直到冲头表面与孔口构件第二表面基本共面,然后清洁冲头面和共面孔构件第二表面以去除其上的残留糊料。
    • 4. 发明申请
    • Fully automated paste dispense system for dispensing small dots and lines
    • 完全自动化的糊剂分配系统用于分配小点和线
    • US20050042381A1
    • 2005-02-24
    • US10645384
    • 2003-08-21
    • Thomas WeissJames HumenikMark LaPlanteDavid Long
    • Thomas WeissJames HumenikMark LaPlanteDavid Long
    • B05D3/00B05C5/00B05C11/10B05D5/12B67D7/60H05K1/09H05K3/10H05K3/12B05C11/00
    • B05C11/1034H05K1/092H05K3/1241H05K2203/0126
    • A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet. The method then provides for retracting the punch until the punch face is substantially coplanar with the orifice member second surface, and then cleaning the punch face and coplanar orifice member second surface to remove any residual paste thereon.
    • 一种从分配装置将可流动的导电膏分配到毛坯上的方法,该分配装置包括具有第一表面和第二表面的孔口构件和在其之间的孔,在邻近孔口构件第一表面的加压室和含有该糊料的冲头, 面可通过孔口构件孔移动。 该方法包括将冲头定位在孔口构件孔的外部,使得冲头表面与孔构件第一表面间隔开,将期望量的浆料流动到冲头表面上,通过孔口构件孔移动冲压面上的浆料,直到 冲头面延伸超过孔口构件第二表面,并且在仍然在冲压面上的同时使工件与浆料接触以将浆料沉积在毛坯上。 该方法然后提供回缩冲头,直到冲头表面与孔口构件第二表面基本共面,然后清洁冲头面和共面孔构件第二表面以去除其上的残留糊料。
    • 5. 发明申请
    • ROLLING CONTACT SCREENING METHOD AND APPARATUS
    • 滚动联系人筛选方法和装置
    • US20050058771A1
    • 2005-03-17
    • US10605219
    • 2003-09-16
    • L. HerronJames HumenikDavid LongJason Miller
    • L. HerronJames HumenikDavid LongJason Miller
    • B41F15/42H05K3/12H05K3/40B05D5/12
    • H05K3/1233B41F15/42H05K3/4053H05K2203/0143
    • A method of applying paste to an electronic circuit board substrate containing via openings comprises providing over the substrate a mask having openings therein for lines and openings corresponding to the substrate via openings, and providing a roller having a surface adjacent the roller. Paste is then applied either to the mask or to a side of the surface facing the mask. The method then includes rolling the roller and the surface over the mask and flowing the paste into the openings in the mask without substantially sliding the roller and surface over the mask. In the preferred embodiment, paste is applied to a side of the surface facing the mask and the surface containing the paste is rolled over the mask. The surface may be attached to the roller. More preferably, the surface is on a film strip, separate from the roller, disposed between the roller and the substrate.
    • 将糊剂涂布到包含通孔的电子电路板基底上的方法包括在基底上设置一个掩模,该掩模在其上具有与基底通孔开口相对应的线和开口的开口,并提供一个具有与滚子相邻的表面的辊。 然后将糊剂施加到面罩或面向面罩的表面的一侧。 该方法然后包括将辊和表面滚动在掩模上并将糊剂流动到面罩中的开口中,而不使辊和表面基本上滑过掩模。 在优选实施例中,将糊剂施加到面向面罩的表面的一侧,并且将含有糊状物的表面卷在掩模上。 表面可以附接到辊子。 更优选地,表面位于设置在辊和基底之间的与辊分离的膜条上。